Embossing of polymers using a thermosetting polymer mold made by soft lithography

In this article we present a mechanical pattern transfer process where a thermosetting polymer mold instead of a metal, dielectric, ceramic, or semiconductor master made by conventional lithography was used as the master to pattern thermoplastic polymers in hot embossing lithography. The thermosetting polymer mold was fabricated by a soft lithography strategy, microtransfer molding. For comparison, the thermosetting polymer mold and the silicon wafer master were both used to imprint the thermoplastic polymer, polymethylmethacrylate. Replication of the thermosetting polymer mold and the silicon wafer master was of the same quality. This indicates that the thermosetting polymer mold could be used for thermoplastic polymer patterning in hot embossing lithography with high fidelity.

Soft lithography and its application

软刻蚀是一类基于自组装和复制模塑等原理的非光刻微米和纳米加工方法。

Fabrication, patterning, and optical properties of nanocrystalline YVO4 : A (A = Eu3+, Dy3+, Sm3+, Er3+) phosphor films via sol-gel soft lithography

Nanocrystalline YVO4:A (A = Eu3+, Dy3+, Sm3+, Er3+) phosphor films and their patterning were fabricated by a Pechini sol-gel process combined with soft lithography. X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), thermogravimetric and differential thermal analysis (TG-DTA), atomic force microscopy (AFM) and optical microscopy, UV/vis transmission and absorption spectra, photoluminescence (PL) spectra, and lifetimes were used to characterize the resulting films. The results of XRD indicated that the films began to crystallize at 400 degreesC and the crystallinity increased with the increase of annealing temperatures. Transparent nonpatterned phosphor films were uniform and crack-free, which mainly consisted of grains with an average size of 90 nm. Patterned gel and crystalline phosphor film bands with different widths (5-60 mum) were obtained. Significant shrinkage and a few defects were observed in the patterned films during the heat treatment process. The doped rare earth ions (A) showed their characteristic emission in crystalline YVO4 phosphor films because of an efficient energy transfer from vanadate groups to them. The Sm3+ and Er3+ ions also showed upconversion luminescence in a YVO4 film host. Both the lifetimes and PL intensity of the rare earth ions increased with increasing annealing temperature from 400 to 800 degreesC, and the optimum concentration for Eu3+ was determined to be 7 mol % and those for Dy3+, Sm3-, and Er3+ were 2 Mol % of Y3- in YVO4 films, respectively.

Preparation, patterning and luminescence properties of rare earth-doped YVO4 nanocrystalline phosphor films via sol-gel soft lithography

In this presentation, nanocrystalline YVO4:A (A=Eu3+, Dy3+, SM3+, Er3+) phosphor films and their patterning were fabricated by a Pechini sol-gel process combined with a soft lithography (micro-molding in capillaries). XRD, FT-IR, AFM and optical microscope, absorption spectra, photoluminescence (PL) spectra as well as lifetimes were used to characterize the resulting films. The results of XRD indicated that the films began to crystallize at 400 degrees C and the crystallinity increased with the increase of annealing temperatures. Transparent nonpattemed phosphor films were uniform and crack free, which mainly consisted of grains with an average size of 90nm. Patterned crystalline phosphor film bands with different widths (5-30 mu m) were obtained. The doped rare earth ions (A) showed their characteristic emission in crystalline YVO4 phosphor films due to an efficient energy transfer from vanadate groups to them. The Sm3+ and Er3+ ions also showed upconversion luminescence in YVO4 film host. The optimum concentration for Eu3+ was determined to be 7 mol% and those for Dy3+, Sm3+, Er3+ were 2 Mol% of Y3+ in YVO4 films, respectively.

Development of block copolymer lithography for device structure fabrication

This thesis investigated well-ordered block copolymer (BCP) thin film characteristics and their use for nanoscale pattern formation using a series of polystyrene-block-polymethylmethacrylate (PS-b-PMMA), polystyrene-blockpolydimethylsiloxane (PS-b-PDMS) and polystyrene-block-poly(ethylene oxide) (PS-b-PEO) systems of various molecular weights. BCP thin films, which act as an ‘on-chip’ etch mask and material templates, are highly promising self-assembling process for future scalable nanolithography. Unlike conventional BCP processing methods, the work in this thesis demonstrates that well-ordered patterns can be achieved in a few seconds compared to several hours by use of a non-conventional microwave assisted technique. As a result, well-ordered BCP nanoscale structures can be developed in industry appropriate periods facilitating their incorporation into current technologies. An optimised and controlled plasma dry etch process was used for successful pattern transfer to the underlying silicon substrate. Long range ordered BCP templates were further modified by selective metal inclusion technique to form a hard mask template towards fabrication of high aspect ratio nanopillars and nanowires. The work described here is centred on how these templates might be used to generate function at substrate surfaces. Herein we describe a number of innovations which might allow their successful uptake in a number of applications.

Large-area nanopatterning of self-assembled monolayers of alkanethiolates by interferometric lithography.

We demonstrate that interferometric lithography provides a fast, simple approach to the production of patterns in self-assembled monolayers (SAMs) with high resolution over square centimeter areas. As a proof of principle, two-beam interference patterns, formed using light from a frequency-doubled argon ion laser (244 nm), were used to pattern methyl-terminated SAMs on gold, facilitating the introduction of hydroxyl-terminated adsorbates and yielding patterns of surface free energy with a pitch of ca. 200 nm. The photopatterning of SAMs on Pd has been demonstrated for the first time, with interferometric exposure yielding patterns of surface free energy with similar features sizes to those obtained on gold. Gold nanostructures were formed by exposing SAMs to UV interference patterns and then immersing the samples in an ethanolic solution of mercaptoethylamine, which etched the metal substrate in exposed areas while unoxidized thiols acted as a resist and protected the metal from dissolution. Macroscopically extended gold nanowires were fabricated using single exposures and arrays of 66 nm gold dots at 180 nm centers were formed using orthogonal exposures in a fast, simple process. Exposure of oligo(ethylene glycol)-terminated SAMs to UV light caused photodegradation of the protein-resistant tail groups in a substrate-independent process. In contrast to many protein patterning methods, which utilize multiple steps to control surface binding, this single step process introduced aldehyde functional groups to the SAM surface at exposures as low as 0.3 J cm(-2), significantly less than the exposure required for oxidation of the thiol headgroup. Although interferometric methods rely upon a continuous gradient of exposure, it was possible to fabricate well-defined protein nanostructures by the introduction of aldehyde groups and removal of protein resistance in nanoscopic regions. Macroscopically extended, nanostructured assemblies of streptavidin were formed. Retention of functionality in the patterned materials was demonstrated by binding of biotinylated proteins.

A versatile diffractive maskless lithography for single-shot and serial microfabrication.

We demonstrate a diffractive maskless lithographic system that is capable of rapidly performing both serial and single-shot micropatterning. Utilizing the diffractive properties of phase holograms displayed on a spatial light modulator, arbitrary intensity distributions were produced to form two and three dimensional micropatterns/structures in a variety of substrates. A straightforward graphical user interface was implemented to allow users to load templates and change patterning modes within the span of a few minutes. A minimum resolution of approximately 700 nm is demonstrated for both patterning modes, which compares favorably to the 232 nm resolution limit predicted by the Rayleigh criterion. The presented method is rapid and adaptable, allowing for the parallel fabrication of microstructures in photoresist as well as the fabrication of protein microstructures that retain functional activity.

Plasmonic Sensing Using Nanodome Arrays Fabricated by Soft Nanoimprint Lithography

Arrays of gold-coated nanodomes were fabricated on glass substrates using a soft
nanoimprint lithography technique. Optical transmission measurements revealed complex
plasmonic resonances that proved highly sensitive to the array dimensions, the thickness of
the gold layer, and the refractive index of the surrounding medium. As one promising
application for these structures, the refractive index sensing capabilities of the nanodome
arrays were assessed.

Lithography-free micro- and nanostructuring based on conventional plasma etching

In now-a-days semiconductor and MEMS technologies the photolithography is the working horse for fabrication of functional devices. The conventional way (so called Top-Down approach) of microstructuring starts with photolithography, followed by patterning the structures using etching, especially dry etching. The requirements for smaller and hence faster devices lead to decrease of the feature size to the range of several nanometers. However, the production of devices in this scale range needs photolithography equipment, which must overcome the diffraction limit. Therefore, new photolithography techniques have been recently developed, but they are rather expensive and restricted to plane surfaces. Recently a new route has been presented - so-called Bottom-Up approach - where from a single atom or a molecule it is possible to obtain functional devices. This creates new field - Nanotechnology - where one speaks about structures with dimensions 1 - 100 nm, and which has the possibility to replace the conventional photolithography concerning its integral part - the self-assembly. However, this technique requires additional and special equipment and therefore is not yet widely applicable. This work presents a general scheme for the fabrication of silicon and silicon dioxide structures with lateral dimensions of less than 100 nm that avoids high-resolution photolithography processes. For the self-aligned formation of extremely small openings in silicon dioxide layers at in depth sharpened surface structures, the angle dependent etching rate distribution of silicon dioxide against plasma etching with a fluorocarbon gas (CHF3) was exploited. Subsequent anisotropic plasma etching of the silicon substrate material through the perforated silicon dioxide masking layer results in high aspect ratio trenches of approximately the same lateral dimensions. The latter can be reduced and precisely adjusted between 0 and 200 nm by thermal oxidation of the silicon structures owing to the volume expansion of silicon during the oxidation. On the basis of this a technology for the fabrication of SNOM calibration standards is presented. Additionally so-formed trenches were used as a template for CVD deposition of diamond resulting in high aspect ratio diamond knife. A lithography-free method for production of periodic and nonperiodic surface structures using the angular dependence of the etching rate is also presented. It combines the self-assembly of masking particles with the conventional plasma etching techniques known from microelectromechanical system technology. The method is generally applicable to bulk as well as layered materials. In this work, layers of glass spheres of different diameters were assembled on the sample surface forming a mask against plasma etching. Silicon surface structures with periodicity of 500 nm and feature dimensions of 20 nm were produced in this way. Thermal oxidation of the so structured silicon substrate offers the capability to vary the fill factor of the periodic structure owing to the volume expansion during oxidation but also to define silicon dioxide surface structures by selective plasma etching. Similar structures can be simply obtained by structuring silicon dioxide layers on silicon. The method offers a simple route for bridging the Nano- and Microtechnology and moreover, an uncomplicated way for photonic crystal fabrication.

Substrate Conformal Imprint Lithography als innovatives Verfahren zur Herstellung von Nanospektrometern im sichtbaren Spektralbereich

Selbstbestimmung und -gestaltung des eigenen Alltages gewinnen immer mehr an Bedeutung, insbesondere für ältere Mitmenschen in ländlichen Regionen, die auf ärztliche Versorgung angewiesen sind. Die Schaffung sogenannter smart personal environments mittels einer Vielzahl von, nahezu unsichtbar installierten Sensoren im gewohnten Lebensraum liefert dem Anwender (lebens-) notwendige Informationen über seine Umgebung oder seinen eigenen Körper. Dabei gilt es nicht den Anwender mit technischen Daten, wie Spektren, zu überfordern. Vielmehr sollte die Handhabung so einfach wie möglich gestaltet werden und die ausgewertete Information als Indikationsmittel zum weiteren Handeln dienen. Die Anforderungen an moderne Technologien sind folglich eine starke Miniaturisierung, zur optimalen Integration und Mobilität, bei gleichzeitig hoher Auflösung und Stabilität. Die Zielsetzung der vorliegenden Arbeit ist die Miniaturisierung eines spektroskopischen Systems bei gleichzeitig hohem Auflösungsvermögen für die Detektion im sichtbaren Spektralbereich. Eine Möglichkeit für die Herstellung eines konkurrenzfähigen „Mini-„ oder „Mikrospektrometers“ basiert auf Fabry-Pérot (FP) Filtersystemen, da hierbei die Miniaturisierung nicht wie üblich auf Gittersysteme limitiert ist. Der maßgebliche Faktor für das spektrale Auflösungsvermögen des Spektrometers ist die vertikale Präzision und Homogenität der einzelnen 3D Filterkavitäten, die die unterschiedlichen Transmissionswellenlängen der einzelnen Filter festlegen. Die wirtschaftliche Konkurrenzfähigkeit des am INA entwickelten Nanospektremeters wurde durch die maximale Reduzierung der Prozessschritte, nämlich auf einen einzigen Schritt, erreicht. Erstmalig wird eine neuartige Nanoimprint Technologie, die sog. Substrate Conformal Imprint Lithography, für die Herstellung von wellenlängen-selektierenden Filterkavitäten von stark miniaturisierten Spektrometern eingesetzt. Im Zuge dieser Arbeit wird das Design des FP Filtersystems entwickelt und technologisch mittels Dünnschichtdeposition und der Nanoimprinttechnologie realisiert. Ein besonderer Schwerpunkt liegt hierbei in der Untersuchung des Prägematerials, dessen optische Eigenschaften maßgeblich über die Performance des Filtersystems entscheiden. Mit Hilfe eines speziell gefertigten Mikroskopspektrometers werden die gefertigten Filterfelder hinsichtlich ihrer Transmissionseigenschaften und ihres Auflösungsvermögens hin untersucht. Im Hinblick auf publizierte Arbeiten konkurrierender Arbeitsgruppen konnte eine deutliche Verbesserung des miniaturisierten Spektrometers erreicht werden. Die Minimierung der Prozessschritte auf einen einzigen Prägeschritt sorgt gleichzeitig für eine schnelle und zuverlässige Replikation der wellenlängenselektierenden Filterkavitäten. Im Rahmen dieser Arbeit wurde aufgezeigt, dass das angestrebte Nanospektrometer, trotz der sehr geringen Größe, eine hohe Auflösung liefern kann und gerade wegen der starken Miniaturisierung mit kommerziellen Mini- und Mikro-spektrometern konkurrenzfähig ist.

Two-dimensional Photonic Crystals Fabricated by Nanoimprint Lithography

We report on the process parameters of nanoimprint lithography (NIL) for the fabrication of two-dimensional (2-D) photonic crystals. The nickel mould with 2-D photonic crystal patterns covering the area up to 20mm² is produced by electron-beam lithography (EBL) and electroplating. Periodic pillars as high as 200nm to 250nm are produced on the mould with the diameters ranging from 180nm to 400nm. The mould is employed for nanoimprinting on the poly-methyl-methacrylate (PMMA) layer spin-coated on the silicon substrate. Periodic air holes are formed in PMMA above its glass-transition temperature and the patterns on the mould are well transferred. This nanometer-size structure provided by NIL is subjective to further pattern transfer.

Offset Lithography

A group of students are shown working in the Offset Lithography Department at the New York Trade School. Several presses can be seen in the room. Black and white photograph.