CMOS indoor light energy harvesting system for wireless sensing applications

This book discusses in detail the CMOS implementation of energy harvesting. The authors describe an integrated, indoor light energy harvesting system, based on a controller circuit that dynamically and automatically adjusts its operation to meet the actual light circumstances of the environment where the system is placed. The system is intended to power a sensor node, enabling an autonomous wireless sensor network (WSN). Although designed to cope with indoor light levels, the system is also able to work with higher levels, making it an all-round light energy harvesting system. The discussion includes experimental data obtained from an integrated manufactured prototype, which in conjunction with a photovoltaic (PV) cell, serves as a proof of concept of the desired energy harvesting system. © 2016 Springer International Publishing. All rights are reserved.

Caracterização do “warpage” e sua variabilidade no processo produtivo de encapsulamento de circuitos integrados

Nos últimos anos a indústria de semicondutores, nomeadamente a produção de memórias, tem sofrido uma grande evolução. A necessidade de baixar custos de produção, assim como de produzir sistemas mais complexos e com maior capacidade, levou à criação da tecnologia WLP (Wafer Level Packaging). Esta tecnologia permite a produção de sistemas mais pequenos, simplificar o fluxo do processo e providenciar uma redução significativa do custo final do produto. A WLP é uma tecnologia de encapsulamento de circuitos integrados quando ainda fazem parte de wafers (bolachas de silício), em contraste com o método tradicional em que os sistemas são individualizados previamente antes de serem encapsulados. Com o desenvolvimento desta tecnologia, surgiu a necessidade de melhor compreender o comportamento mecânico do mold compound (MC - polímero encapsulante) mais especificamente do warpage (empeno) de wafers moldadas. O warpage é uma característica deste produto e deve-se à diferença do coeficiente de expansão térmica entre o silício e o mold compound. Este problema é observável no produto através do arqueamento das wafers moldadas. O warpage de wafers moldadas tem grande impacto na manufatura. Dependendo da quantidade e orientação do warpage, o transporte, manipulação, bem como, a processamento das wafers podem tornar-se complicados ou mesmo impossíveis, o que se traduz numa redução de volume de produção e diminuição da qualidade do produto. Esta dissertação foi desenvolvida na Nanium S.A., empresa portuguesa líder mundial na tecnologia de WLP em wafers de 300mm e aborda a utilização da metodologia Taguchi, no estudo da variabilidade do processo de debond para o produto X. A escolha do processo e produto baseou-se numa análise estatística da variação e do impacto do warpage ao longo doprocesso produtivo. A metodologia Taguchi é uma metodologia de controlo de qualidade e permite uma aproximação sistemática num dado processo, combinando gráficos de controlo, controlo do processo/produto, e desenho do processo para alcançar um processo robusto. Os resultados deste método e a sua correta implementação permitem obter poupanças significativas nos processos com um impacto financeiro significativo. A realização deste projeto permitiu estudar e quantificar o warpage ao longo da linha de produção e minorar o impacto desta característica no processo de debond. Este projecto permitiu ainda a discussão e o alinhamento entre as diferentes áreas de produção no que toca ao controlo e a melhoria de processos. Conseguiu–se demonstrar que o método Taguchi é um método eficiente no que toca ao estudo da variabilidade de um processo e otimização de parâmetros. A sua aplicação ao processo de debond permitiu melhorar ou a fiabilidade do processo em termos de garantia da qualidade do produto, como ao nível do aumento de produção.

Conceção de um tutorial de Iniciação ao co-projeto de Hardware/software

A crescente evolução dos dispositivos contendo circuitos integrados, em especial os FPGAs (Field Programmable Logic Arrays) e atualmente os System on a chip (SoCs) baseados em FPGAs, juntamente com a evolução das ferramentas, tem deixado um espaço entre o lançamento e a produção de materiais didáticos que auxiliem os engenheiros no Co- Projecto de hardware/software a partir dessas tecnologias. Com o intuito de auxiliar na redução desse intervalo temporal, o presente trabalho apresenta o desenvolvimento de documentos (tutoriais) direcionados a duas tecnologias recentes: a ferramenta de desenvolvimento de hardware/software VIVADO; e o SoC Zynq-7000, Z-7010, ambos desenvolvidos pela Xilinx. Os documentos produzidos são baseados num projeto básico totalmente implementado em lógica programável e do mesmo projeto implementado através do processador programável embarcado, para que seja possível avaliar o fluxo de projeto da ferramenta para um projeto totalmente implementado em hardware e o fluxo de projeto para o mesmo projeto implementado numa estrutura de harware/software.

CMOS indoor light energy harvesting system for wireless sensing applications

Dissertação para obtenção do Grau de Doutor em Engenharia Electrotécnica e de Computadores

Implementação de um sistema MPPT em circuito integrado CMOS

Dissertação de mestrado integrado em Engenharia Eletrónica Industrial e Computadores

Non-invasive RF built-in testing using on-chip temperature sensors

This poster shows how to efficiently observe high-frequency figures of merit in RF circuits by measuring DC temperature with CMOS-compatible built-in sensors.

Continuous phase shift of sinusoidal signals using injection locked oscillators

This work presents an alternative to generate continuous phase shift of sinusoidal signals based on the use of super harmonic injection locked oscillators (ILO). The proposed circuit is a second harmonic ILO with varactor diodes as tuning elements. In the locking state, by changing the varactor bias, a phase shift instead of a frequency shift is observed at the oscillator output. By combining two of these circuits, relative phases up to 90 could be achieved. Two prototypes of the circuit have been implemented and tested, a hybrid version working in the range of 200-300 MHz and a multichip module (MCM) version covering the 900¿1000 MHz band.

Wireless Sensor Networks for Infrastructure Monitoring, TR-611, 2010

A good system of preventive bridge maintenance enhances the ability of engineers to manage and monitor bridge conditions, and take proper action at the right time. Traditionally infrastructure inspection is performed via infrequent periodical visual inspection in the field. Wireless sensor technology provides an alternative cost-effective approach for constant monitoring of infrastructures. Scientific data-acquisition systems make reliable structural measurements, even in inaccessible and harsh environments by using wireless sensors. With advances in sensor technology and availability of low cost integrated circuits, a wireless monitoring sensor network has been considered to be the new generation technology for structural health monitoring. The main goal of this project was to implement a wireless sensor network for monitoring the behavior and integrity of highway bridges. At the core of the system is a low-cost, low power wireless strain sensor node whose hardware design is optimized for structural monitoring applications. The key components of the systems are the control unit, sensors, software and communication capability. The extensive information developed for each of these areas has been used to design the system. The performance and reliability of the proposed wireless monitoring system is validated on a 34 feet span composite beam in slab bridge in Black Hawk County, Iowa. The micro strain data is successfully extracted from output-only response collected by the wireless monitoring system. The energy efficiency of the system was investigated to estimate the battery lifetime of the wireless sensor nodes. This report also documents system design, the method used for data acquisition, and system validation and field testing. Recommendations on further implementation of wireless sensor networks for long term monitoring are provided.

Compositional influence on the electrical performance of zinc indium tin oxide transparent thin-film transistors

In this work, zinc indium tin oxide layers with different compositions are used as the active layer of thin film transistors. This multicomponent transparent conductive oxide is gaining great interest due to its reduced content of the scarce indium element. Experimental data indicate that the incorporation of zinc promotes the creation of oxygen vacancies. In thin-film transistors this effect leads to a higher threshold voltage values. The field-effect mobility is also strongly degraded, probably due to coulomb scattering by ionized defects. A post deposition annealing in air reduces the density of oxygen vacancies and improves the fieldeffect mobility by orders of magnitude. Finally, the electrical characteristics of the fabricated thin-film transistors have been analyzed to estimate the density of states in the gap of the active layers. These measurements reveal a clear peak located at 0.3 eV from the conduction band edge that could be attributed to oxygen vacancies.

Cap mòbil amb tecnologia led RGBW controlat per DMX

Disseny tant a nivell de hardware com de software d’un cap mòbil amb tecnologia led RGBW controlat pel protocol DMX512. Aquest projecte es limita al disseny i a la realització de tots els elements de software i hardware necessaris per crear un prototipus de cap mòbil que pugui ser controlat mitjançant el protocol DMX. Per tant, està encarat completament cap a la vessant electrònica i de programació sense fer referència als materials i elements constructius utilitzats o sobre el disseny i estètica del producte

On an asymptotic formula for the maximum voltage drop in a on-chip power distribution network

We present a new asymptotic formula for the maximum static voltage in a simplified model for on-chip power distribution networks of array bonded integrated circuits. In this model the voltage is the solution of a Poisson equation in an infinite planar domain whose boundary is an array of circular pads of radius ", and we deal with the singular limit Ɛ → 0 case. In comparison with approximations that appear in the electronic engineering literature, our formula is more complete since we have obtained terms up to order Ɛ15. A procedure will be presented to compute all the successive terms, which can be interpreted as using multipole solutions of equations involving spatial derivatives of functions. To deduce the formula we use the method of matched asymptotic expansions. Our results are completely analytical and we make an extensive use of special functions and of the Gauss constant G

Power supply noise and logic error probability

Voltage fluctuations caused by parasitic impedances in the power supply rails of modern ICs are a major concern in nowadays ICs. The voltage fluctuations are spread out to the diverse nodes of the internal sections causing two effects: a degradation of performances mainly impacting gate delays anda noisy contamination of the quiescent levels of the logic that drives the node. Both effects are presented together, in thispaper, showing than both are a cause of errors in modern and future digital circuits. The paper groups both error mechanismsand shows how the global error rate is related with the voltage deviation and the period of the clock of the digital system.

Via-configurable transistor array: a regular design technique to improve ICs yield

Process variations are a major bottleneck for digital CMOS integrated circuits manufacturability and yield. That iswhy regular techniques with different degrees of regularity are emerging as possible solutions. Our proposal is a new regular layout design technique called Via-Configurable Transistors Array (VCTA) that pushes to the limit circuit layout regularity for devices and interconnects in order to maximize regularity benefits. VCTA is predicted to perform worse than the Standard Cell approach designs for a certain technology node but it will allow the use of a future technology on an earlier time. Ourobjective is to optimize VCTA for it to be comparable to the Standard Cell design in an older technology. Simulations for the first unoptimized version of our VCTA of delay and energy consumption for a Full Adder circuit in the 90 nm technology node are presented and also the extrapolation for Carry-RippleAdders from 4 bits to 64 bits.