Specific depth cone resistivity measurements to determine soil engineering properties

The University of British Columbia (UBC) began performing piezocone penetration tests (CPTU) with electrical resistivity measurements (RCPTU) in 1989. Since then, RCPTU research at UBC has focused on obtaining geo-environmental parameters such as fluid resistivity and soil engineering properties such as porosity and degree of saturation from measurements of bulk soil electrical resistivity using the empirical relationship proposed by Archie (1942). Within this framework, the paper illustrates and discusses important design and calibration issues for resistivity modules such as the use of isolated circuitry to achieve linear calibrations over large ranges of resistivity. The suitability of RCPTU measurements for determination of geo-environmental and geotechnical parameters are assessed using typical ranges of soil and groundwater properties and methods of isolating individual factors for study are discussed. Illustrative examples of RCPTU research efforts including the environmental characterization of mine tailings, delineation of saline water intrusions in fresh water aquifers and the quality control of geotechnical ground densification are presented throughout the text. It is shown that groundwater temperature and hence ion mobility is not significantly altered by frictional heat generated during piezocone penetration and that ratio-based approaches to monitoring soil porosity can be used to eliminate the requirement for extensive groundwater sampling programs. Lastly, it is shown that RCPTU measurements above the water table can only be made using resistivity modules that are stable over a large range of resistivities and that such measurements are the most difficult to interpret because of grain surface conduction effects and generally unknown fluid resistivities.

High tech garbage can help engineering colleges to improve hands-on education

This paper presents a discussion on the potential use of high tech garbage, including electronic waste (e-waste), as a source of mechanisms, sensors and actuators, that can be adapted to improve the reality of microprocessor systems labs, at low cost. By means of some examples, it is shown that entire subsystems withdrawn of high tech equipments can be easily integrated into existing laboratory infrastructure. As examples, first a precision positioning mechanism is presented, which was taken from a discarded commercial ink jet printer and interfaced with a microprocessor board used in the laboratory classes. Secondly, a read/write head and its positioning mechanism has been withdrawn of a retired CD/DVD drive and again interfaced with the microprocessor board. Students who have been using these new experiments strongly approve their inclusion in the lab schedules. © 2011 IEEE.

Notes on competencies in engineering education

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

The Dependence of Retention Time on Gate Length in UTBOX FBRAM With Different Source/Drain Junction Engineering

The floating-body-RAM sense margin and retention-time dependence on the gate length is investigated in UTBOX devices using BJT programming combined with a positive back bias (so-called V th feedback). It is shown that the sense margin and the retention time can be kept constant versus the gate length by using a positive back bias. Nevertheless, below a critical L, there is no room for optimization, and the memory performances suddenly drop. The mechanism behind this degradation is attributed to GIDL current amplification by the lateral bipolar transistor with a narrow base. The gate length can be further scaled using underlap junctions.

Study of silicon-on-insulator multiple-gate MOS structures including band-gap engineering and self heating effects

The progresses of electron devices integration have proceeded for more than 40 years following the well–known Moore’s law, which states that the transistors density on chip doubles every 24 months. This trend has been possible due to the downsizing of the MOSFET dimensions (scaling); however, new issues and new challenges are arising, and the conventional ”bulk” architecture is becoming inadequate in order to face them. In order to overcome the limitations related to conventional structures, the researchers community is preparing different solutions, that need to be assessed. Possible solutions currently under scrutiny are represented by: • devices incorporating materials with properties different from those of silicon, for the channel and the source/drain regions; • new architectures as Silicon–On–Insulator (SOI) transistors: the body thickness of Ultra-Thin-Body SOI devices is a new design parameter, and it permits to keep under control Short–Channel–Effects without adopting high doping level in the channel. Among the solutions proposed in order to overcome the difficulties related to scaling, we can highlight heterojunctions at the channel edge, obtained by adopting for the source/drain regions materials with band–gap different from that of the channel material. This solution allows to increase the injection velocity of the particles travelling from the source into the channel, and therefore increase the performance of the transistor in terms of provided drain current. The first part of this thesis work addresses the use of heterojunctions in SOI transistors: chapter 3 outlines the basics of the heterojunctions theory and the adoption of such approach in older technologies as the heterojunction–bipolar–transistors; moreover the modifications introduced in the Monte Carlo code in order to simulate conduction band discontinuities are described, and the simulations performed on unidimensional simplified structures in order to validate them as well. Chapter 4 presents the results obtained from the Monte Carlo simulations performed on double–gate SOI transistors featuring conduction band offsets between the source and drain regions and the channel. In particular, attention has been focused on the drain current and to internal quantities as inversion charge, potential energy and carrier velocities. Both graded and abrupt discontinuities have been considered. The scaling of devices dimensions and the adoption of innovative architectures have consequences on the power dissipation as well. In SOI technologies the channel is thermally insulated from the underlying substrate by a SiO2 buried–oxide layer; this SiO2 layer features a thermal conductivity that is two orders of magnitude lower than the silicon one, and it impedes the dissipation of the heat generated in the active region. Moreover, the thermal conductivity of thin semiconductor films is much lower than that of silicon bulk, due to phonon confinement and boundary scattering. All these aspects cause severe self–heating effects, that detrimentally impact the carrier mobility and therefore the saturation drive current for high–performance transistors; as a consequence, thermal device design is becoming a fundamental part of integrated circuit engineering. The second part of this thesis discusses the problem of self–heating in SOI transistors. Chapter 5 describes the causes of heat generation and dissipation in SOI devices, and it provides a brief overview on the methods that have been proposed in order to model these phenomena. In order to understand how this problem impacts the performance of different SOI architectures, three–dimensional electro–thermal simulations have been applied to the analysis of SHE in planar single and double–gate SOI transistors as well as FinFET, featuring the same isothermal electrical characteristics. In chapter 6 the same simulation approach is extensively employed to study the impact of SHE on the performance of a FinFET representative of the high–performance transistor of the 45 nm technology node. Its effects on the ON–current, the maximum temperatures reached inside the device and the thermal resistance associated to the device itself, as well as the dependence of SHE on the main geometrical parameters have been analyzed. Furthermore, the consequences on self–heating of technological solutions such as raised S/D extensions regions or reduction of fin height are explored as well. Finally, conclusions are drawn in chapter 7.

Exploring Engineering

Engineering faculty members at Bucknell University have established a course required for freshman engineering students and open to liberal arts students. The course has been designed to stimulate and enhance student interest in all the engineering disciplines at Bucknell. The course ranges broadly across small groups, faculty-lead recitations, laboratory experiences, student design projects, traditional lectures, and guest speakers. The exploring engineering course has completed its second year. The authors describe the course, the changes made since the initial offering and the impact on the students and faculty involved. They also present and interpret student evaluations of the course.(4 refs)

Software Engineering Education Needs More Engineering

To what extent is “software engineering” really “engineering” as this term is commonly understood? A hallmark of the products of the traditional engineering disciplines is trustworthiness based on dependability. But in his keynote presentation at ICSE 2006 Barry Boehm pointed out that individuals’, systems’, and peoples’ dependency on software is becoming increasingly critical, yet that dependability is generally not the top priority for software intensive system producers. Continuing in an uncharacteristic pessimistic vein, Professor Boehm said that this situation will likely continue until a major software-induced system catastrophe similar in impact to the 9/11 World Trade Center catastrophe stimulates action toward establishing accountability for software dependability. He predicts that it is highly likely that such a software-induced catastrophe will occur between now and 2025. It is widely understood that software, i.e., computer programs, are intrinsically different from traditionally engineered products, but in one aspect they are identical: the extent to which the well-being of individuals, organizations, and society in general increasingly depend on software. As wardens of the future through our mentoring of the next generation of software developers, we believe that it is our responsibility to at least address Professor Boehm’s predicted catastrophe. Traditional engineering has, and continually addresses its social responsibility through the evolution of the education, practice, and professional certification/licensing of professional engineers. To be included in the fraternity of professional engineers, software engineering must do the same. To get a rough idea of where software engineering currently stands on some of these issues we conducted two surveys. Our main survey was sent to software engineering academics in the U.S., Canada, and Australia. Among other items it sought detail information on their software engineering programs. Our auxiliary survey was sent to U.S. engineering institutions to get some idea about how software engineering programs compared with those in established engineering disciplines of Civil, Electrical, and Mechanical Engineering. Summaries of our findings can be found in the last two sections of our paper.

New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering

This book provides the latest in a series of books growing out of the International Joint Conferences on Computer, Information and Systems Sciences and Engineering. It includes chapters in the most advanced areas of Computing, Informatics, Systems Sciences and Engineering. It has accessible to a wide range of readership, including professors, researchers, practitioners and students. This book includes a set of rigorously reviewed world-class manuscripts addressing and detailing state-of-the-art research projects in the areas of Computer Science, Informatics, and Systems Sciences, and Engineering. It includes selected papers form the conference proceedings of the Ninth International Joint Conferences on Computer, Information, and Systems Sciences, and Engineering (CISSE 2013). Coverage includes topics in: Industrial Electronics, Technology & Automation, Telecommunications and Networking, Systems, Computing Sciences and Software Engineering, Engineering Education, Instructional Technology, Assessment, and E-learning.

Multidisciplinary Learning, Another way of Teaching Maths in Engineering

Multidisciplinary training is widely appreciated in industry and business, and nevertheless usually is not addressed in the early stages of most undergraduate programs. We outline here a multidisciplinary course for undergraduates studying engineering in which mathematics would be the common language, the transverse tool. The goal is motivating students to learn more mathematics and as a result, improve the quality of engineering education. The course would be structured around projects in four branches in engineering: mechanical, electrical, civil and bio-tech. The projects would be chosen among a wide variety of topics in engineering practice selected with the guidance of professional engineers. In these projects mathematics should interact with at least two other basic areas of knowledge in engineering: chemistry, computers science, economics, design or physics.

Physics and Mathematics in the Engineering Curriculum: Correlation with Applied Subjects

This paper presents a study in which the relationship between basic subjects (Mathematics and Physics) and applied engineering subjects (related to Machinery, Electrical Engineering, Topography and Buildings) in higher engineering education curricula is evaluated. The analysis has been conducted using the academic records of 206 students for five years. Furthermore, 34 surveys and personal interviews were conducted to analyze the connections between the contents taught in each subject and to identify student perceptions of the correlation with other subjects or disciplines. At the same time, the content of the different subjects have been analyzed to verify the relationship among the disciplines.Aproper coordination among subjects will allow students to relate and interconnect topics of different subjects, even with the ones learnt in previous courses, while also helping to reduce dropout rates and student failures in successfully accomplishing the different courses.

Transactions of the International Engineering Congress, 1915 ...

[v. 1] The Panama canal. 2 v.--[v. 2] Waterways and irrigation.--[v. 3] Municipal engineering.--[v. 4] Railway engineering.--[v. 5] Materials of engineering construction.--[v. 6] Mechanical engineering.--[v. 7] Electrical engineering and hydroelectric power development.--[v. 8] Mining engineering.--[v. 9] Metallurgy.--[v. 10] Naval architecture and marine engineering.--[v. 11] Miscellany.--[v. 12] Index volume.

Engineering applications of higher mathematics,

Bibliography at end of each volume.

Proceedings of the American Street and Interurban Railway Engineering Association.

Mode of access: Internet.

Engineering abstracts : journal of the International Institute of Technical Bibliography.

Description based on: Aug. 1910; title from cover.

Illuminating engineering.

"The journal of the Illuminating Engineering Society."