High tech garbage can help engineering colleges to improve hands-on education


Autoria(s): Lucena, Samuel Euzédice de
Contribuinte(s)

Universidade Estadual Paulista (UNESP)

Data(s)

27/05/2014

27/05/2014

01/12/2011

Resumo

This paper presents a discussion on the potential use of high tech garbage, including electronic waste (e-waste), as a source of mechanisms, sensors and actuators, that can be adapted to improve the reality of microprocessor systems labs, at low cost. By means of some examples, it is shown that entire subsystems withdrawn of high tech equipments can be easily integrated into existing laboratory infrastructure. As examples, first a precision positioning mechanism is presented, which was taken from a discarded commercial ink jet printer and interfaced with a microprocessor board used in the laboratory classes. Secondly, a read/write head and its positioning mechanism has been withdrawn of a retired CD/DVD drive and again interfaced with the microprocessor board. Students who have been using these new experiments strongly approve their inclusion in the lab schedules. © 2011 IEEE.

Identificador

http://dx.doi.org/10.1109/FIE.2011.6142725

Proceedings - Frontiers in Education Conference, FIE.

1539-4565

0190-5848

http://hdl.handle.net/11449/72848

10.1109/FIE.2011.6142725

WOS:000300879800030

2-s2.0-84858237230

Idioma(s)

eng

Relação

Proceedings - Frontiers in Education Conference, FIE

Direitos

closedAccess

Palavras-Chave #Hands-on education #Electrical engineering labs #High tech garbage #Electronic waste #Optical encoders
Tipo

info:eu-repo/semantics/conferencePaper