953 resultados para Al-Si-Cu(4) alloy


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The forging characteristics of an Al-Cu-Mg-Si-Sn alloy are examined using it new testing strategy which incorporates a double truncated cone specimen and finite element modelling. This sample geometry produces controlled strain distributions within a single specimen and can readily identify the specific strain required to achieve a specific microstructural event by matching the metallographic data with the strain profiles calculated from finite element software, The friction conditions were determined using the conventional friction ring test, which was evaluated using finite element software. The rheological properties of the alloy, evaluated from compression testing of right cylinders, are similar to the properties of conventional aluminium forgings. A hoop strain develops at the outer diameter of the truncated cones and this leads to pore opening at the outer few millimetres. The porosity is effectively removed when the total strain equals the net compressive strain. The strain profiles that develop in the truncated cones are largely independent of the processing temperature and the strain rate although the strain required for pore closure increases as the forging temperature is reduced. This suggests that the microstructure and the strain rate sensitivity may also be important factors controlling pore behaviour. (C) 2002 Elsevier Science B.V. All rights reserved.

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We report on experimental studies of the Kondo physics and the development of non-Fermi-liquid scaling in UCu(4+x)Al(8-x) family. We studied 7 different compounds with compositions between x = 0 and 2. We measured electrical transport (down to 65 mK) and thermoelectric power (down to 1.8 K) as a function of temperature, hydrostatic pressure, and/or magnetic field. Compounds with Cu content below x = 1.25 exhibit long-range antiferromagnetic order at low temperatures. Magnetic order is suppressed with increasing Cu content and our data indicate a possible quantum critical point at x(cr) approximate to 1.15. For compounds with higher Cu content, non-Fermi-liquid behavior is observed. Non-Fermi-liquid scaling is inferred from electrical resistivity results for the x = 1.25 and 1.5 compounds. For compounds with even higher Cu content, a sharp kink occurs in the resistivity data at low temperatures, and this may be indicative of another quantum critical point that occurs at higher Cu compositions. For the magnetically ordered compounds, hydrostatic pressure is found to increase the Neel temperature, which can be understood in terms of the Kondo physics. For the non-magnetic compounds, application of a magnetic field promotes a tendency toward Fermi-liquid behavior. Thermoelectric power was analyzed using a two-band Lorentzian model, and the results indicate one fairly narrow band (10 meV and below) and a second broad band (around hundred meV). The results imply that there are two relevant energy scales that need to be considered for the physics in this family of compounds. (C) 2011 Elsevier B.V. All rights reserved.

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Surfaces of silicon wafers implanted with N and C, respectively, and aluminum 5052 implanted with N alone by plasma immersion ion implantation WHO were probed by a nanoindentor and analyzed by the contact-angle method to provide information on surface nanohardness and wettability. Silicon nitride and silicon carbide are important ceramic materials for microelectronics, especially for high-temperature applications. These compounds can be synthesized by high-dose ion implantation. The nanohardness of a silicon sample implanted with 12-keV nitrogen PIII (with 3 X 10(17) cm(-2) dose) increased by 10% compared to the unimplanted sample, in layers deeper than the regions where the formation of the Si,N, compound occurred. A factor of 2.5 increase in hardness was obtained for C-implanted Si wafer at 35 keV (with 6 X 10(17) cm(-2) dose), again deeper than the SiC-rich layer, Both compounds are in the amorphous state and their hardness is much lower than that of the crystalline compounds, which require an annealing process after ion implantation. In the same targets, the contact angle increased by 65% and 35% for N- and C-implanted samples, respectively. Compared to the Si target, the nitrogen PIII-irradiated Al 5052 (wish 15 keV) showed negligible change in its hydrophobic character after ion implantation. Its near-surface nanohardness measurement showed a slight increase for doses of 1 X 10(17) cm(-2). We have been searching for an AlN layer of the order of 1000 A thick, using such a low-energy PIII process, but oxide formation during processing has precluded its synthesis. (C) 2002 Elsevier B.V. B.V. All rights reserved.

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The kinetics of Ag-rich precipitates formation in the Cu-2 wt.% Al alloy with additions of 2, 4, 6, 8, 10 and 12 wt.% Ag was studied using microhardness changes with temperature and time, differential scanning calorimetry (DSC), differential thermal analysis (DTA), scanning electron microscopy (SEM), optical microscopy (OM), energy dispersive X-ray analysis (EDX) and X-ray diffractometry (XRD). The results indicated that an increase in the Ag content decreases the activation energy for Ag-rich precipitates formation, and that it is possible to estimate the values of the diffusion and nucleation activation energies for the Ag precipitates. (C) 2004 Elsevier B.V. All rights reserved.

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The effect of Ag additions on the reverse martensitic transformation in the Cu-10 mass% Al alloy was studied using differential thermal analysis (DTA), optical (OM) and scanning electron microscopies (SEM) and X-ray diffractometry. The results indicated that Ag additions to the Cu-10 mass% Al alloy shift the equilibrium concentration to higher Al contents, allow to obtain both beta(1)' and beta' martensitic phases in equilibrium and that Ag precipitation is a process associated with the perlitic phase formation.

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The influence of the disordered (Cu)-alpha phase in the isothermal aging kinetics of the Cu-19 at.%Al alloy was studied using microhardness measurements, optical and scanning electron microscopy and X-ray diffractometry. The results indicate that the beta'-->(alpha+gamma (1)) decomposition reaction rate increases with the increase of the temperature in the range between 150 and 500 degreesC and at 600 degreesC the reaction is delayed by the alpha phase precipitation. The value obtained for the activation energy indicates an interface diffusion controlled reaction. (C) 2001 Elsevier B.V. B.V. All rights reserved.

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The order-disorder transformation in the Ni-4.49 at.% Al alloy was studied using electrical resistivity measurements, microhardness measurements, differential scanning calorimetry (DSC) and transmission electron microscopy (TEM). The results confirmed the ordering behavior expected for Ni-Al dilute alloys and the suggested relation between resistivity changes and microhardness changes with antiferromagnetic spin ordering. The higher value obtained for the activation energy of vacancy migration was associated with a decrease in the Al concentration gradient near solute-depleted regions. (c) 2005 Elsevier B.V. All rights reserved.

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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

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In the Cu-Al system, due to the sluggishness of the beta a dagger" (alpha + gamma(1)) eutectoid reaction, the beta phase can be retained metastably. During quenching, metastable beta alloys undergo a martensitic transformation to a beta' phase at Al low content. The ordering reaction beta a dagger" beta(1) precedes the martensitic transformation. The influence of Ag additions on the reactions containing the beta phase in the Cu-11mass%Al alloy was studied using differential scanning calorimetry and in situ X-ray diffractometry. The results indicated that, on cooling, two reactions are occurring in the same temperature range, the beta -> (alpha + gamma(1)) decomposition reaction and the beta -> beta(1) reaction, with different reaction mechanisms (diffusive for the former and ordering for the latter) and, consequently, with different reaction rates. For lower cooling rates, the dominant is the decomposition reaction and for higher cooling rates the ordering reaction prevails. on heating, the (alpha + gamma(1)) -> beta reverse eutectoid reaction occurs with a resulting beta phase saturated with alpha. The increase of Ag concentration retards the beta -> (alpha + gamma(1)) decomposition reaction and the beta -> beta(1) ordering reaction, which occurs in the same temperature range, becomes the predominant process.