A practical package technique for FBG-based temperature independent sensor

A practical package technique for temperature independent Fiber Bragg grating sensor is proposed. A uniform strength cantilever with two FBG attached on the upper and lower surfaces was utilized as the key element. By detecting two wavelengths differential output, the applied force can be obtained and temperature effects can be eliminated. Experiment results show the sensor has linear response and output signal uctuates less than 12pm as temperature changes from -10 degrees C to 50 degrees C. The maximum thermal error is less than 0.3% of the full measurement range.

A spatial sampling optimization package using MSN theory

The density and distribution of spatial samples heavily affect the precision and reliability of estimated population attributes. An optimization method based on Mean of Surface with Nonhomogeneity (MSN) theory has been developed into a computer package with the purpose of improving accuracy in the global estimation of some spatial properties, given a spatial sample distributed over a heterogeneous surface; and in return, for a given variance of estimation, the program can export both the optimal number of sample units needed and their appropriate distribution within a specified research area. (C) 2010 Elsevier Ltd. All rights reserved.

A software development package for intelligent supervisory systems

Barnes, D. P., Hardy, N. W., Lee, M. H., Orgill, C. H., Sharpe, K. A. I. A software development package for intelligent supervisory systems. In Proc. ACME Res. Conf., Nottingham, September 1988, pp. 4

Measuring Bottleneck Link Speed in Package-Switched Networks

The quality of available network connections can often have a large impact on the performance of distributed applications. For example, document transfer applications such as FTP, Gopher and the World Wide Web suffer increased response times as a result of network congestion. For these applications, the document transfer time is directly related to the available bandwidth of the connection. Available bandwidth depends on two things: 1) the underlying capacity of the path from client to server, which is limited by the bottleneck link; and 2) the amount of other traffic competing for links on the path. If measurements of these quantities were available to the application, the current utilization of connections could be calculated. Network utilization could then be used as a basis for selection from a set of alternative connections or servers, thus providing reduced response time. Such a dynamic server selection scheme would be especially important in a mobile computing environment in which the set of available servers is frequently changing. In order to provide these measurements at the application level, we introduce two tools: bprobe, which provides an estimate of the uncongested bandwidth of a path; and cprobe, which gives an estimate of the current congestion along a path. These two measures may be used in combination to provide the application with an estimate of available bandwidth between server and client thereby enabling application-level congestion avoidance. In this paper we discuss the design and implementation of our probe tools, specifically illustrating the techniques used to achieve accuracy and robustness. We present validation studies for both tools which demonstrate their reliability in the face of actual Internet conditions; and we give results of a survey of available bandwidth to a random set of WWW servers as a sample application of our probe technique. We conclude with descriptions of other applications of our measurement tools, several of which are currently under development.

Clasificación jerárquica ascendente con Mathematica

Hemos desarrollado el algoritmo usual de clasificación jerárquica ascendente en el sistema Mathematica. El usuario escoge la disimilitud según el tipo de datos que deba analizar: cuantitativos, cualitativos o binarios, así como el índice de agregación a utilizar. Se dispone de varias opciones para cada escogencia. Además, se ha implementado un gran número de manipulaciones sobre el árbol binario de clasificación, como el corte del árbol, la rotaciones, la dimensionalidad, el etiquetado, los colores, etc.

Mathematica: potentes herramientas

Aún si su trabajo parece no estar vinculado con la matemática, Mathematica puede ser de su interés. Con este recurso el arduo trabajo del cálculo -numérico o simbólico- resulta cosa del pasado, el desarrollo de materiales didácticos tiene nuevas y revolucionarias herramientas, las aplicaciones de modelos matemáticos pueden producir resultados sin ocuparse de la implementación computacional de complicados algoritmos matemáticos, en suma, con las computadoras y Mathematica se multiplican las capacidades para entender, desarrollar y aplicar las matemáticas y ciencias afines.

Mathematical modelling: a laser soldering process for an optoelectronics butterfly package

For sensitive optoelectronic components, traditional soldering techniques cannot be used because of their inherent sensitivity to thermal stresses. One such component is the Optoelectronic Butterfly Package which houses a laser diode chip aligned to a fibre-optic cable. Even sub-micron misalignment of the fibre optic and laser diode chip can significantly reduce the performance of the device. The high cost of each unit requires that the number of damaged components, via the laser soldering process, are kept to a minimum. Mathematical modelling is undertaken to better understand the laser soldering process and to optimize operational parameters such as solder paste volume, copper pad dimensions, laser solder times for each joint, laser intensity and absorption coefficient. Validation of the model against experimental data will be completed, and will lead to an optimization of the assembly process, through an iterative modelling cycle. This will ultimately reduce costs, improve the process development time and increase consistency in the laser soldering process.

"System in package technology" - design for manufacture challenges

Purpose – To present key challenges associated with the evolution of system-in-package technologies and present technical work in reliability modeling and embedded test that contributes to these challenges. Design/methodology/approach – Key challenges have been identified from the electronics and integrated MEMS industrial sectors. Solutions to optimising the reliability of a typical assembly process and reducing the cost of production test have been studied through simulation and modelling studies based on technology data released by NXP and in collaboration with EDA tool vendors Coventor and Flomerics. Findings – Characterised models that deliver special and material dependent reliability data that can be used to optimize robustness of SiP assemblies together with results that indicate relative contributions of various structural variables. An initial analytical model for solder ball reliability and a solution for embedding a low cost test for a capacitive RF-MEMS switch identified as an SiP component presenting a key test challenge. Research limitations/implications – Results will contribute to the further development of NXP wafer level system-in-package technology. Limitations are that feedback on the implementation of recommendations and the physical characterisation of the embedded test solution. Originality/value – Both the methodology and associated studies on the structural reliability of an industrial SiP technology are unique. The analytical model for solder ball life is new as is the embedded test solution for the RF-MEMS switch.

Computational approach for reliable and robust system-in-package design

A computational modelling approach integrated with optimisation and statistical methods that can aid the development of reliable and robust electronic packages and systems is presented. The design for reliability methodology is demonstrated for the design of a SiP structure. In this study the focus is on the procedure for representing the uncertainties in the package design parameters, their impact on reliability and robustness of the package design and how these can be included in the design optimisation modelling framework. The analysis of thermo-mechanical behaviour of the package is conducted using non-linear transient finite element simulations. Key system responses of interest, the fatigue life-time of the lead-free solder interconnects and warpage of the package, are predicted and used subsequently for design purposes. The design tasks are to identify the optimal SiP designs by varying several package input parameters so that the reliability and the robustness of the package are improved and in the same time specified performance criteria are also satisfied

Reliability based design optimisation for system-in-package

This paper discusses a reliability based optimisation modelling approach demonstrated for the design of a SiP structure integrated by stacking dies one upon the other. In this investigation the focus is on the strategy for handling the uncertainties in the package design inputs and their implementation into the design optimisation modelling framework. The analysis of fhermo-mechanical behaviour of the package is utilised to predict the fatigue life-time of the lead-free board level solder interconnects and warpage of the package under thermal cycling. The SiP characterisation is obtained through the exploitation of Reduced Order Models (ROM) constructed using high fidelity analysis and Design of Experiments (DoE) methods. The design task is to identify the optimal SiP design specification by varying several package input parameters so that a specified target reliability of the solder joints is achieved and in the same time design requirements and package performance criteria are met

Microwave curing for high density package

Summary form only given. Currently the vast majority of adhesive materials in electronic products are bonded using convection heating or infra-red as well as UV-curing. These thermal processing steps can take several hours to perform, slowing throughput and contributing a significant portion of the cost of manufacturing. With the demand for lighter, faster, and smaller electronic devices, there is a need for innovative material processing techniques and control methodologies. The increasing demand for smaller and cheaper devices pose engineering challenges in designing a curing systems that minimize the time required between the curing of devices in a production line, allowing access to the components during curing for alignment and testing. Microwave radiation exhibits several favorable characteristics and over the past few years has attracted increased academic and industrial attention as an alternative solution to curing of flip-chip underfills, bumps, glob top and potting cure, structural bonding, die attach, wafer processing, opto-electronics assembly as well as RF-ID tag bonding. Microwave energy fundamentally accelerates the cure kinetics of polymer adhesives. It provides a route to focus heat into the polymer materials penetrating the substrates that typically remain transparent. Therefore microwave energy can be used to minimise the temperature increase in the surrounding materials. The short path between the energy source and the cured material ensures a rapid heating rate and an overall low thermal budget. In this keynote talk, we will review the principles of microwave curing of materials for high density packing. Emphasis will be placed on recent advances within ongoing research in the UK on the realization of "open-oven" cavities, tailored to address existing challenges. Open-ovens do not require positioning of the device into the cavity through a movable door, hence being more suitable for fully automated processing. Further potential advantages of op- - en-oven curing include the possibility for simultaneous fine placement and curing of the device into a larger assembly. These capabilities promise productivity gains by combining assembly, placement and bonding into a single processing step. Moreover, the proposed design allows for selective heating within a large substrate, which can be useful particularly when the latter includes parts sensitive to increased temperatures.

Design for reliability for wafer level system in package

This paper discusses the Design for Reliability modelling of several System-in-Package (SiP) structures developed by NXP and advanced on the basis of Wafer Level Packaging (WLP). Two different types of Wafer Level SiP (WLSiP) are presented and discussed. The main focus is on the modelling approach that has been adopted to investigate and analyse the board level reliability of the presented SiP configurations. Thermo-mechanical non-linear Finite Element Analysis (FEA) is used to analyse the effect of various package design parameters on the reliability of the structures and to identify design trends towards package optimisation. FEA is used also to gain knowledge on moulded wafer shrinkage and related issues during the wafer level fabrication. The paper provides a brief outline and demonstration of a design methodology for reliability driven design optimisation of SiP. The study emphasises the advantages of applying the methodology to address complex design problems where several requirements may exist and uncertainties and interactions between parameters in the design are common.