Modeling of Thermal Phenomena in a High Power Diode Laser Package
| Data(s) |
13/01/2010
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| Identificador | |
| Idioma(s) |
中文 |
| Fonte |
Ephraim Suhir, Jingwei Wang, Zhenbang Yuan, Xu Chen, Xingsheng Liu.Modeling of Thermal Phenomena in a High Power Diode Laser Package.见:10th on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP).Beijing.2009-08. |
| Palavras-Chave | #电子、电信技术 #电子、电信技术::半导体器件与技术 #semiconductor laser arrays #thermal failures #finite-elementanalysis (FEA) |
| Tipo |
会议论文 |
