974 resultados para Étape de préparation au changement


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本论文利用扫描隧道显微镜(STM)在Au(111)电极上结合电化学方法在分子水平上观察分子的吸附组装和结构调控等。主要内容如下: (1) 用现场电化学扫描隧道显微镜(ECSTM)在Au(111)电极上研究了巯基己醇(MHO)取代六苯并苯的详细过程。取代速度强烈依赖于MHO的浓度。浓度较低时,反应速度较慢,我们可以用现场ECSTM跟踪观察详细的取代过程。取代首先发生在靠近重构线肘部的位置,出现单分子或多个六苯并苯分子的取代而形成的pits。随着取代过程的进行,这些小的pits生长或合并成较大的pits;pits周围的六苯并苯分子逐渐被MHO取代,最终在限定的区域内形成有序的domain。观察局部区域的取代过程,我们发现沿着重构线的方向扩展速度最快。快速取代之后,MHO在Au(111)电极表面形成( )R30°晶格结构,而慢速取代之后,MHO在表面形成c(4×2)超结构。与MHO在干净的Au(111)电极上的吸附相比,在六苯并苯修饰的Au(111)电极上即使在很低的浓度下也没有观察到平躺的物理吸附相,而是直接形成化学吸附相。这可能是由于六苯并苯的存在,MHO的碳氢链不能直接与Au原子接触。通过数据分析,我们发现取代速率曲线呈倒S形状。 (2) 我们用循环伏安法(CV)和ECSTM研究了腺嘌呤(Adenine,A),胸腺嘧啶(Thymine,T)和鸟嘌呤(Guanine,G)单组分及混合组分(A+T)的电化学二维相变。施加在Au(111)电极上的电位不同,A会呈现不同的吸附状态,包括物理吸附相和化学吸附相。在物理吸附的电势范围,高分辨ECSTM图像显示,同一个电势下共存着多样性的A的吸附结构。当基底电势变得更正时,一种更倾斜的吸附状态也就是A的化学吸附相会形成。在较负电位下,A和T能通过分子之间氢键作用在Au(111)电极上形成一种新的网络结构,而G能形成多层吸附。 (3) 利用STM研究了不同方法移除硫醇自组装膜之后金电极表面的再生情况。分别使用了化学法和电化学还原脱附法。化学法比较简单,使用的试剂有王水,piranha和NaBH4。王水对金电极表面有强腐蚀作用;piranha和NaBH4对金表面的作用较小,但是NaBH4处理之后的金表面上会有较多的亮岛出现。在移除自组装膜之后的电极上直接组装六苯并苯,我们观察到用piranha和NaBH4处理之后的金电极表面上六苯并苯自组装膜缺陷较多,有序domain也比较小。电化学法脱附可以得到比较干净的金表面,直接组装的六苯并苯自组装膜有序性好,缺陷少。而且,电化学脱附法通过控制电位可以实现硫醇自组装膜和六苯并苯自组装膜的相互转换。

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Up to now, in most of the research work done on the effect of hydrogen on a Schottky barrier, the hydrogen was introduced into the semiconductor before metal deposition. This letter reports that hydrogen can be effectively introduced into the Schottky barriers (SBs) of Au/n-GaAs and Ti/n-GaAs by plasma hydrogen treatment (PHT) after metal deposition on [100] oriented n-GaAs substrates. The Schottky barrier height (SBH) of a SB containing hydrogen shows the zero/reverse bias annealing (ZBA/RBA) effect. ZBA makes the SBH decrease and RBA makes it increase. The variations in the SBHs are reversible. In order to obtain obvious ZBA/RBA effects, selection of the temperature for plasma hydrogen treatment is important, and it is indicated that 100-degrees-C for Au/n-GaAs and 150-degrees-C for Ti/n-GaAs are suitable temperatures. It is concluded from the analysis of experimental results that only the hydrogen located at or near the metal-semiconductor interface, rather than the hydrogen in the bulk of either the semiconductor or the metal, is responsible for the ZBA/RBA effect on SBH.

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Interfacial formation processes and reactions between Au and hydrogenated amorphous Si have been studied by photoemission spectroscopy and Auger electron spectroscopy. A three-dimensional growth of Au metal cluster occurs at initial formation of the Au/a-Si:H interface. When Au deposition exceeds a critical time, Au and Si begin interdiffusing and react to create an Au-Si alloy region. Annealing enhances interdiffusion and a Si-rich region exists on the topmost surface of Au films on a-Si:H.

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The Ni/Au contact was treated with oxalic acid after annealing in O_2 ambient, and its I-V characteristic showed the property of contact has been obviously improved. An Auger electron spectroscopy (AES) depth pro-file of the contact as-annealed showed that the top layer was highly resistive NiO, while an X-ray photo-electron spectroscopy (XPS) of oxalic acid treated samples indicated that the NiO has been removed effectively. A scanning electron microscope (SEM) was used to observe the surface morphology of the contacts, and it was found that the lacunaris surface right after annealing became quite smooth with lots of small Au exposed areas after oxalic acid treatment. When the test probe or the subsequently deposited Ti/Au was directly in contact with these small Au areas, they worked as low resistive current paths and thus decrease the specific contact resistance.

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采用化学气相沉积(CVD)方法在Si(001)衬底上分别制备了有金属Au缓冲层以及无Au缓冲层的ZnO薄膜。其中Au缓冲层在物理气相沉积(PVD)设备中蒸发,厚度大约为300nm。有Au缓冲层的ZnO薄膜晶体质量比直接在Si衬底上生长有了显著提高。利用X射线衍射(XRD)研究了所生长ZnO薄膜的结晶质量,有Au缓冲层的ZnO薄膜虽然仍为多晶,但显示出明显的择优取向。用光学显微镜研究了ZnO薄膜的表面特征,金属Au缓冲层显著地提高了在Si衬底上生长的ZnO薄膜的晶粒尺寸及平整度。同时利用室温光致发光(PL)谱研究了ZnO薄膜的光学性质,并分析了有Au缓冲层的ZnO薄膜NEB发光峰强度反而弱的可能原因。

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在MBE和MOCVD两种方法制备的n-GaN材料上制作了Au-GaN肖特基结,测定了肖特基结的室温I-V特性。分析表明

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于2010-11-23批量导入

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于2010-11-23批量导入