Resputtering Effect on Nanocrystalline Ni-Ti Alloy Films

We report on the effect of resputtering on the properties of nanocrystalline Ni-Ti alloy thin films deposited using co-sputtering of Ni and Ti targets. In order to facilitate the formation of nanocrystalline phases, films were deposited at room temperature and 573 K (300 A degrees C) with substrate bias voltage of -100 V. The influence of substrate material on the composition, surface topography microstructure, and phase formations of nanocrystalline Ni-Ti thin films was also systematically investigated. The preferential resputtering of Ti adatoms was lesser for Ni-Ti films deposited on quartz substrate owing to high surface roughness of 4.87 nm compared to roughness value of 1.27 nm for Si(100) substrate.

A Numerical Model of Rapid Solidification Processing of Ni-Al Alloy in Planar Flow Casting

A numerical model has been developed for simulating the rapid solidification processing (RSP) of Ni-Al alloy in order to predict the resultant phase composition semi-quantitatively during RSP. The present model couples the initial nucleation temperature evaluating method based on the time dependent nucleation theory, and solidified volume fraction calculation model based on the kinetics model of dendrite growth in undercooled melt. This model has been applied to predict the cooling curve and the volume fraction of solidified phases of Ni-Al alloy in planar flow casting. The numerical results agree with the experimental results semi-quantitatively.

Low-Power Super-resolution Readout with Antimony Bismuth Alloy Film as Mask layer

Sb-Bi alloy films are proposed as a new kind of super-resolution mask layer with low readout threshold power. Using the Sb-Bi alloy film as a mask layer and SiN as a protective layer in a read-only memory disc, the super-resolution pits with diameters of 380 nm are read out by a dynamic setup, the laser wavelength is 780 nm and the numerical aperture of pickup lens is 0.45. The effects of the Sb-Bi thin film thickness, laser readout power and disc rotating velocity on the readout signal are investigated. The results show that the threshold laser power of super-resolution readout of the Sb-Bi mask layer is about 0.5 mW, and the corresponding carrier-to-noise ratio is about 20 dB at the film thickness of 50 nm. The super-resolution mechanism of the Sb-Bi alloy mask layer is discussed based on its temperature dependence of reflection.

Effects of Ag on electrical properties of Ag/Ni/p-GaN ohmic contact

Properties of the Ag/Ni/p-GaN structure at different temperatures are studied by Auger electron spectroscopy, scanning electron microscopy and high resolution x-ray diffraction. The effect of Ag in ohmic contact on the crystalline quality is investigated and the optimized value of annealing temperature is reported. The lowest specific contact resistance of 2.5 x 10(-4) Omega cm(2) is obtained at annealing temperature of 550 degrees C.

Ni基电极淀积前后表面处理对p-GaN欧姆接触的影响

在p-GaN上蒸发Ni/Au电极前,采用王水、HCl、缓冲HF进行前表面处理,O_2气氛下退火后,比较各电极样品的I-V特性和表面形貌.结果显示无表面处理时接触电阻最小,且溶剂处理后残留的电解质会影响电极的电流特性和稳定性.用俄歇电子能谱(AES)测试不同元素随深度分布情况,发现高温退火过程中NiO的形成有自动清洁p-GaN表面的作用,因此对于Ni基电极前表面处理不是必需的.再将样品用10%草酸溶液处理,其I-V特性显示接触电阻率明显下降;X射线光电子能谱(XPS)测试显示草酸溶液处理后电极表面Ni含量显著减少,而Au元素信号峰增强,说明表面高阻P型NiO被有效除去,对改善接触性能具有实际意义.

Pt-Ni/p-InP低阻欧姆接触的机理研究

利用X射线衍射和AES(俄歇)方法，深入地研究了RF磁探溅射淀积的Pt-Ni/p-InP(100)非合金膜系在热退火过程中Pt和Ni与衬底InP中的In和P形成稳定化合物的行为，揭示了比接触电阻降低于3×10~(-6)Ω·cm~2的根本原因。

Effect of cerium on microstructure and electrochemical performance of Ti-V-Cr-Ni electrode alloy

Effect of cerium on the microstructure and electrochemical performance of the Ti0.25V0.35-xCexCr0.1Ni0.3 (x = 0, 0.005) electrode alloy was investigated by X-ray diffraction (XRD), field emission scanning electron microscopy/energy dispersive X-ray spectrometry (FESEM-EDS), and electrochemical impedance spectroscopy (EIS) measurements. On the basis of XRD and FESEM-EDS analysis, the alloy was mainly composed of V-based solid solution with body-centered-cubic structure and TiNi-based secondary phase. Ce did not exist in two phases, instead, it existed as Ce-rich small white particles, with irregular edges, distributed near the grain boundaries of the V-based solid solution phase. Discharge capacity, cycle stability, and high-rate discharge ability of the alloy electrode were effectively improved with the addition of Ce at 293 K. It was very surprising that the charge retention was abnormal with larger discharge capacity after standing at the open circuit for 24 h. EIS indicated that addition of Ce improved the dynamic performance, which caused the charge transfer resistance (R-T) to decrease and exchange current density (I-0) to increase markedly. The exchange current density of the electrochemical reaction on the alloy surface with Ce addition was about 2.07 and 3.10 times larger than that of the alloy without Ce at 303 and 343 K, respectively.

Electroless nickel composite (Ni-P/SiC) coating - A study on interface and corrosion characteristic

Surface behaviour is of paramount importance as failure and degradation tend to initiate from the surface. Electroless composite coating (NiP/SiC) was developed using SiC as reinforcing particles. As heat treatment plays a vital role in electroless nickel coating owing to the changes in microstructure, phase structure and mechanical properties, an insight at the interface changes in chemistry and micromechanical behaviour was investigated using scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) and microindentation techniques. Corrosion performance was analysed using electrochemical impedance spectroscopy (EIS). Absence of zinc and migration of copper at the interface was detected. Brittleness and microcracks was seen long the interface when indenting at load of 500 gf (Vickers). Corrosion performance is weaker than particles free coating. However, a thin blanket of NiP could enhance the resistance to corrosive medium.

Mapping the hot deformation microstructure of Ni-30Fe alloy

The evolution of structure during the hot working of an austenitic Ni-30%Fe alloy is studied using EBSD analysis of samples tested in torsion. A microstructural map in temperature-strain space that plots grain size, cell size, fracture and dynamic recrystallization is presented.