Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al

Molecular dynamics (MD) simulations are carried out to analyze the diffusion bonding at Cu/Al interfaces. The results indicate that the thickness of the interfacial layer is temperature-dependent, with higher temperatures yielding larger thicknesses. At temperatures below 750 K, the interface thickness is found to increase in a stepwise manner as a function of time. At temperatures above 750 K, the thickness increases rapidly and smoothly. When surface roughness is present, the bonding process consists of three stages. In the first stage, surfaces deform under stress, resulting in increased contact areas. The second stage involves significant plastic deformation at the interface as temperature increases, resulting in the disappearance of interstices and full contact of the surface pair. The last stage entails the diffusion of atoms under constant temperature. The bonded specimens show tensile strengths reaching 88% of the ideal Cu/Al contact strength. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Third order elastic constants of bcc Cu-Al-Ni

We have measured the changes in the ultrasonic wave velocity, induced by the application of uniaxial stresses in a Cu-Al-Ni single crystal. From these measurements, the complete set of third-order elastic constants has been obtained. The comparison of results for Cu-Al-Ni with available data for other Cu-based alloys has shown that all these alloys exhibit similar anharmonic behavior. By using the measured elastic constants in a Landau expansion for elastic phase transitions, we have been able to give an estimation of the value of a fourth-order elastic constants combination. The experiments have also shown that the application of a stress in the [001] direction, reduces the material resistance to a (110)[110] shear and thus favors the martensitic transition.

Aging kinetics in the Cu-8 wt.% Al alloy with Ag additions

The influence of additions of 2, 4, 6, 8, 10 and 12 wt.% Ag in the isothermal aging kinetics of the Cu-8 wt.% Al alloy was studied using microhardness measurements, differential scanning calorimetry, optical and scanning electron microscopy and X-ray diffractometry. The results indicate that the presence of silver is responsible for the shift of the equilibrium concentration to higher Al contents, allowing the formation of the gamma(1) phase (Al4Cu9) in this alloy. For Ag additions up to 6% the dominant kinetic process is Ag precipitation and for additions from 8 to 12% Ag the nucleation of the perlitic phase dominates. (C) 2003 Elsevier B.V. B.V. All rights reserved.

Effect of 4 mass% Ag addition on the thermal behavior of the Cu-9 mass% Al alloy

The effect of 4 mass% Ag addition on the thermal behavior of the Cu-9 mass% Al alloy was studied using differential scanning calorimetry (DSC), optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDX) and X-ray diffractometry (XRD). The results showed that the presence of silver causes (Cu)-alpha+(alpha+gamma1)-->(Cu)-alpha+beta transformation to occur in two stages. In the first one, part of the produced beta phase combines with the precipitated Ag to give a silver-rich phase and in the second one the transformation is completed. The formation of this silver-rich phase seems to be enhanced at very low cooling rates.

Effect of Ag additions on the reverse martensitic transformation in the Cu-10 mass% Al alloy

The effect of Ag additions on the reverse martensitic transformation in the Cu-10 mass% Al alloy was studied using differential thermal analysis (DTA), optical (OM) and scanning electron microscopies (SEM) and X-ray diffractometry. The results indicated that Ag additions to the Cu-10 mass% Al alloy shift the equilibrium concentration to higher Al contents, allow to obtain both beta(1)' and beta' martensitic phases in equilibrium and that Ag precipitation is a process associated with the perlitic phase formation.

Effect of Ag addition on the martensitic phase of the Cu-10 wt.% Al alloy

Thermal analysis and compression tests at room temperature have been carried out for Cu-10 wt.% Al and Cu-10 wt.% Al-10 wt.% Ag alloys samples. The results indicate that the decomposition reaction of the (beta(1)) parent phase is decreased suppressed and a martensite stabilization effect can be induced by Ag addition. The Cu-Al-Ag alloy shows some degree of shape memory capacity. (C) 2007 Elsevier B.V. All rights reserved.

Isothermal decomposition kinetics in the Cu-9%Al-4%Ag alloy

The influence of 4 wt.%Ag addition on the isothermal decomposition kinetics of the beta' phase in the Cu-9wt.%Al alloy was studied by microhardness measurements, optical and scanning electron microscopy (SEM), energy dispersive X-ray (EDX) analysis, and X-ray diffractometry. The results showed that the presence of Ag decreases the beta' --> (alpha + gamma(1)) decomposition reaction rate in the Cu-9%Al-4%Ag alloy, an effect that may be associated to the gamma(1) phase which catalyses the Ag precipitation, making it faster than the decomposition reaction, and thus, stabilizing the martensitic phase. (C) 2003 Elsevier B.V. All rights reserved.

Thermal stability of the martensitic transformation of Cu-Al-Ni-Mn-Ti

The development of new shape memory alloys with high martensitic transformation temperature increases the potential for applications. The development and use of these new alloys depends on the stability of the structure during cycling at high temperatures. If it is possible to guarantee that on alloys keeps the structure during cycling, then the alloy can be used because of the shape memory properties. The aim of this work is to obtain a kinetic model of the forward and backward martensitic transformation of two Cu-Al-Ni-Mn-Ti alloys. Differential scanning calorimetry has been performed in order to establish the kinetic stability of the martensite and the beta transformation. (c) 2006 Elsevier B.V. All rights reserved.

Isothermal aging kinetics in the Cu-19 at.%Al alloy

The influence of the disordered (Cu)-alpha phase in the isothermal aging kinetics of the Cu-19 at.%Al alloy was studied using microhardness measurements, optical and scanning electron microscopy and X-ray diffractometry. The results indicate that the beta'-->(alpha+gamma (1)) decomposition reaction rate increases with the increase of the temperature in the range between 150 and 500 degreesC and at 600 degreesC the reaction is delayed by the alpha phase precipitation. The value obtained for the activation energy indicates an interface diffusion controlled reaction. (C) 2001 Elsevier B.V. B.V. All rights reserved.

Reverse martensitic transformation in the Cu-10 wt% Al-6 wt%Ag alloy

The reverse martensitic transformation in the Cu-10 wt%Al-6 wt%Ag alloy was studied by classical differential thermal analysis (IDTA), scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDX) and X-ray diffractometry (XRD). The results indicated that the presence of Ag in the Cu-10%Al alloy is responsible for the separation of the competitive reactions that occur during the reverse martensitic transformation and is also associated to an increase in the disordering degree at high temperatures, when compared with alloys without Ag addition. (c) 2005 Springer Science + Business Media, Inc.

Estudo da influência de adições de prata na resistividade elétrica da liga Cu-5%Al

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Influência de adições de prata na cinética de recristalização da liga CU-5%Al

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Influência de adições de prata na cinética de precipitação da liga Cu-5%Al

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)