Demonstracion critico-apologetica del Theatro Critico Universal, que dio á luz el R. P. M. Fr. Benito Gerónimo Feyjoó, Benedictino : con la qual se hace patente la evidencia, certeza ... que en los tomos I. II. III. en algunas partes del IV, y en la Ilustracion Apologetica, pretendió contradecir el Vulgo, con diferentes papelones ; por no haber entendido hasta ahora la conexion, y obvia significacion de las voces ; adjunta una defensa de las aprobaciones de la dicha Ilustracion

Quarta impresion.

Cartas eruditas, y curiosas : en que, por la mayor parte se continua el designio del Teatro Critico Universal, impugnando, ó reduciendo á dudosas varias opiniones comunes

Nueva impresion.

Reliability study of the electroless Ni–P layer against solder alloy

Copper (Cu) has been widely used in the under bump metallurgy of chip and substrate metallization for chip packaging. However, due to the rapid formation of Cu–Sn intermetallic compound (IMC) at the tin-based solder/Cu interface during solder reaction, the reliability of this type of solder joint is a serious concern. In this work, electroless nickel–phosphorous (Ni–P) layer was deposited on the Cu pad of the flexible substrate as a diffusion barrier between Cu and the solder materials. The deposition was carried out in a commercial acidic sodium hypophosphite bath at 85 °C for different pH values. It was found that for the same deposition time period, higher pH bath composition (mild acidic) yields thicker Ni–P layer with lower phosphorous content. Solder balls having composition 62%Sn–36%Pb–2%Ag were reflowed at 240 °C for 1 to 180 min on three types of electroless Ni–P layers deposited at the pH value of 4, 4.8 and 6, respectively. Thermal stability of the electroless Ni–P barrier layer against the Sn–36%Pb–2%Ag solder reflowed for different time periods was examined by scanning electron microscopy equipped with energy dispersed X-ray. Solder ball shear test was performed in order to find out the relationship between the mechanical strength of solder joints and the characteristics of the electroless Ni–P layer deposited. The layer deposited in the pH 4 acidic bath showed the weak barrier against reflow soldering whereas layer deposited in pH 6 acidic bath showed better barrier against reflow soldering. Mechanical strength of the joints were deteriorated quickly in the layer deposited at pH 4 acidic bath, which was found to be thin and has a high phosphorous content. From the cross-sectional studies and fracture surface analyses, it was found that the appearance of the dark crystalline phosphorous-rich Ni layer weakened the interface and hence lower solder ball shear strength. Ni–Sn IMC formed at the interfaces was found to be more stable at the low phosphorous content (∼14 at.%) layer. Electroless Ni–P deposited at mild acidic bath resulting phosphorous content of around 14 at.% is suggested as the best barrier layer for Sn–36%Pb–2%Ag solder.

Revisión sistemática de la producción española sobre rendimiento académico entre 1980 y 2011

El bajo rendimiento académico sigue siendo un problema de investigación de gran impacto social. Sin embargo, los resultados científicos no están teniendo repercusión en la mejora, ni en las políticas educativas. En este trabajo nos propusimos identificar, ordenar, analizar y extraer conclusiones sobre la producción española sobre rendimiento académico, con el fin de visualizarla y derivar problemas futuros objeto de investigación. Para ello se llevó a cabo un estudio de revisión en seis etapas, en el que se combinaron procedimientos metodológicos de investigación de síntesis y de investigación bibliométrica. Se identificaron las publicaciones en cuatro bases de datos españolas; posteriormente se analizaron y codificaron los datos extraídos alrededor de nueve indicadores: título, año, tipo de documento, editorial, autor, número autores, institución, comunidad autónoma y tema. Los resultados muestran una producción constante y creciente (1595 referencias), pero dispersa, tanto por el inmenso número de autores que publican, la mayoría con un solo trabajo, como por los lugares donde publican. Las temáticas más tratadas se refieren en primer lugar a modelos explicativos, diagnóstico y tratamiento; en segundo lugar se abordan los factores y variables determinantes del bajo y alto rendimiento académico; en tercer lugar se desarrollan estudios sobre legislación y de otras variables psicológicas y educativas en relación con el rendimiento. Este estudio supone una aproximación sintetizada de la producción sobre rendimiento académico en España, y un primer paso para investigaciones de síntesis posteriores, que nos permitan identificar buenas prácticas para el ejercicio de “prácticas basadas en la evidencia”, y otros problemas de investigación.

Isotope Shift in the Dielectronic Recombination of Three-Electron ANd57+

Isotope shifts in dielectronic recombination spectra were studied for Li-like ^ANd⁵⁷⁺ ions with A=142 and A=150. From the displacement of resonance positions energy shifts dE^142?150(2s-2p_1/2)=40.2(3)(6)??meV [(stat)(sys)] and dE^142?150(2s-2p_3/2)=42.3(12)(20)??meV of 2s-2p_jtransitions were deduced. An evaluation of these values within a full QED treatment yields a change in the mean-square charge radius of ^142?150d?r²?=-1.36(1)(3)??fm². The approach is conceptually new and combines the advantage of a simple atomic structure with high sensitivity to nuclear size.

Notas sobre el "primum cognitum" en Cayetano y su vínculo con la metafísica

Cayetano tuvo un papel protagónico en los debates intelectuales de su época (s. XVI), destacándose como un auténtico adalid del tomismo; inclusive muchas de sus tesis pasaron a formar parte de tal doctrina, las cuales –a veces matizadas y otras no tanto– perviven hasta nuestros días. Entre los diversos temas que afrontó se destaca su particular noción de primum cognitum. Aquí, partimos del hecho de que la tradición tomista no ha visto mayores inconvenientes en equiparar lo que entienden Cayetano y el Aquinate por el ens primo cadit; empero nosotros estamos en condiciones de afirmar que tal equiparación al menos es problemática. En este sentido, nos ocuparemos de realizar un primer acercamiento al tema del ente primer conocido cayetaniano para intentar mostrar su real significado. Asimismo, procuraremos ver, ayudados por los aportes de algunos estudiosos contemporáneos –en especial el de Lawrence Dewan–, hasta qué punto tal noción se corresponde o no con los desarrollos teóricos de Tomás de Aquino, sobre todo con el vínculo entre el primer conocido y el ente como objeto de la metafísica.

Delamination Fracture Related to Tempering in a High-Strength Low-Alloy Steel

The delamination or splitting of mechanical test specimens of rolled steel plate is a phenomenon that has been studied for many years. In the present study, splitting during fracture of tensile and Charpy V-notch (CVN) test specimens is examined in a high-strength low-alloy plate steel. It is shown that delamination did not occur in test specimens from plate in the as-rolled condition, but was severe in material tempered in the temperature range 500 °C to 650 °C. Minor splitting was seen after heating to 200 °C, 400 °C, and 700 °C. Samples that had been triple quenched and tempered to produce a fine equiaxed grain size also did not exhibit splitting. Microstructural and preferred orientation studies are presented and are discussed as they relate to the splitting phenomenon. It is concluded that the elongated as-rolled grains and grain boundary embrittlement resulting from precipitates (carbides and nitrides) formed during reheating were responsible for the delamination.

High-gain x-ray lasing at 11.1 nm in sodiumlike copper driven by a 20-J, 2-ps Nd:glass laser

Evidence of high gain pumped by recombination has been observed in the 5g-4f transition at 11.1 nn in sodiumlike copper ions with use of a 20-J 2-ps Nd:glass laser system. The time- and space-integrated gain coefficient was 8.8 +/- 1.4 cm(-1), indicating a single-transit amplification of similar to 60 times. This experiment has shown that 2 ps is the optimum pulse duration to drive the sodiumlike copper recombination x-ray lasing at 11.1 nm. (C) 1996 Optical Society of America

Tool life and hole surface integrity studies for hole-making of Ti6Al4V Alloy

With a significant growth in the use of titanium alloys in the aviation manufacturing industry, the key challenge of making high-quality holes in the aircraft assembly process needs to be addressed. In this work, case studies deploying traditional drilling and helical milling technologies are carried out to investigate the tool life and hole surface integrity for hole-making of titanium alloy. Results show that the helical milling process leads to much longer tool life, generally lower hole surface roughness, and higher hole subsurface microhardness. In addition, no plastically deformed layer or white layer has been observed in holes produced by helical milling. In contrast, a slightly softened region was always present on the drilled surface. The residual stress distributions within the hole surface, including compressive and tensile residual stress, have also been investigated in detail.

Hole-making Process and Its impacts on the Fatigue Response of Ti -6Al-4V Aircraft Alloy

In this work, the impact of conventional drilling and helical milling processes on the fatigue response Ti-6Al-4V (grade 5 titanium alloy) has been presented. Results show that the work pieces produced by helical milling has a 119% longer fatigue life compared with the drilled pieces under dry machining condition, and a 96% longer fatigue life for helical milled piece under lubricated condition. The use of cutting fluid has led to longer fatigue lives – 15% longer for drilling and 3% longer for helical milling. Other results such as the machined surface roughness, alloy surface and sub-surface microstructures have also been studied in details.