An investigation on the effects of Ag addition in the powder — in tube processing of long multifilamentary (Bi,Pb) - 2223/Ag superconducting tapes

It is important that long superconducting tape must have desired strain tolerance (less reduction of Jc with applied strains) and stress tolerance (less reduction of JC in applied stresses) for its use as coils and magnets. Ag addition to the BPSCCO system has many advantages with its physical and chemical inertness to the system, reduces the processing temperature, and promotes the grain growth, grain alignment and connectivity. All these not only enhance the critical current density of the tapes but also improve the mechanical properties. But the published results show very much scattering on the type of Ag additive to be selected, method of addition and its optimum percentage. Also there are some negative reports in this regard. The present work has been undertaken to study the effect of silver addition in different forms (Ag powder, Ag2O, AgNO3) on the superconducting and mechanical properties of (Bi,Pb)-2223/Ag tapes and to find out a suitable form of Ag additive and its optimum percentage to have better superconducting and mechanical properties. Also it is the aim of the present work is to optimise the process parameters needed to prepare (Bi,Pb)-2223/Ag multifilamentary tapes of length ~ 12 m in solenoid and pancake coil forms with good critical current density and homogeneity of J C along the length of the tapes.

Effect of 4 mass% Ag addition on the thermal behavior of the Cu-9 mass% Al alloy

The effect of 4 mass% Ag addition on the thermal behavior of the Cu-9 mass% Al alloy was studied using differential scanning calorimetry (DSC), optical microscopy (OM), scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDX) and X-ray diffractometry (XRD). The results showed that the presence of silver causes (Cu)-alpha+(alpha+gamma1)-->(Cu)-alpha+beta transformation to occur in two stages. In the first one, part of the produced beta phase combines with the precipitated Ag to give a silver-rich phase and in the second one the transformation is completed. The formation of this silver-rich phase seems to be enhanced at very low cooling rates.

Effect of Ag addition on the martensitic phase of the Cu-10 wt.% Al alloy

Thermal analysis and compression tests at room temperature have been carried out for Cu-10 wt.% Al and Cu-10 wt.% Al-10 wt.% Ag alloys samples. The results indicate that the decomposition reaction of the (beta(1)) parent phase is decreased suppressed and a martensite stabilization effect can be induced by Ag addition. The Cu-Al-Ag alloy shows some degree of shape memory capacity. (C) 2007 Elsevier B.V. All rights reserved.

Influence of Ag addition on the thermal behavior of the Cu-11 mass% Al alloy

In this work the influence of Ag additions on the thermal behavior of the Cu-11 mass% Al alloy was studied using differential scanning calorimetry, in situ X-ray diffractometry and scanning electron microscopy. The results indicated that changes in the heating rate shift the peak attributed to alpha phase formation to higher temperatures, evidencing the diffusive character of this reaction. The activation energy value for the alpha phase formation reaction, obtained from a non-isotherm kinetic model, is close to that corresponding to Cu atoms self diffusion, thus confirming that this reaction is dominated by Cu atoms diffusion through the martensite matrix.

Phase transformations in the Cu-Al alloy with Ag addition

The effect of Ag addition on the phase transformations that occur in the Cu-10% Al alloy was studied using differential thermal analysis, scanning electron and optical microscopies and energy dispersive X-ray analysis. The results indicated that Ag addition is responsible for the separation of the reverse martensitic transformation in two stages, and for the refinement of the α-phase grains. The relative amount of the β1 martensitic phase, retained on slow cooling (above 2 K min-1 of cooling rate), and the relative fraction of phase α2 are increased. The solubility limit of Ag in the matrix is close to 6 mass% and at this concentration the maximum stability of the β-phase is reached. © 2005 Akadémiai Kiadó, Budapest.

Effect of Ag addition on phase transitions of the Cu-22.26 at.%Al-9.93 at.%Mn alloy

The phase transitions that occur in the Cu-22.26 at.%Al-9.93 at.%Mn and Cu-22.49 at.%Al-10.01 at.%Mn-1.53 at.%Ag alloys after slow cooling were studied using differential scanning calorimetry at different heating rates, microhardness changes with temperature, magnetization changes with temperature, scanning electron microscopy and energy dispersion X-ray spectroscopy. The results indicated that the presence of Ag does not modify the transition sequence of Cu-Al-Mn alloy, introduces a new transition due to the (Ag-Cu)-rich precipitates dissolution at about 800 K, and changes the mechanism of DO 3 phase dissolution. This mechanistic change was analyzed and a sequence of phase transitions was proposed for the reaction. © 2013 Elsevier B.V.

Isothermal decomposition kinetics in the Cu-9%Al-4%Ag alloy

The influence of 4 wt.%Ag addition on the isothermal decomposition kinetics of the beta' phase in the Cu-9wt.%Al alloy was studied by microhardness measurements, optical and scanning electron microscopy (SEM), energy dispersive X-ray (EDX) analysis, and X-ray diffractometry. The results showed that the presence of Ag decreases the beta' --> (alpha + gamma(1)) decomposition reaction rate in the Cu-9%Al-4%Ag alloy, an effect that may be associated to the gamma(1) phase which catalyses the Ag precipitation, making it faster than the decomposition reaction, and thus, stabilizing the martensitic phase. (C) 2003 Elsevier B.V. All rights reserved.

Reverse martensitic transformation in the Cu-10 wt% Al-6 wt%Ag alloy

The reverse martensitic transformation in the Cu-10 wt%Al-6 wt%Ag alloy was studied by classical differential thermal analysis (IDTA), scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDX) and X-ray diffractometry (XRD). The results indicated that the presence of Ag in the Cu-10%Al alloy is responsible for the separation of the competitive reactions that occur during the reverse martensitic transformation and is also associated to an increase in the disordering degree at high temperatures, when compared with alloys without Ag addition. (c) 2005 Springer Science + Business Media, Inc.

Effect of Ag concentration on the thermal behavior of the Cu-10 mass% Al and Cu-11 mass% Al alloys

In this work the effect of Ag concentration on the thermal behavior of the Cu-10 mass% Al and Cu-11 mass% Al alloys with additions of 4, 6, 8 and 10 mass% Ag was studied using differential scanning calorimetry (DSC), in situ X-ray diffractometry (XRD) and scanning electron microscopy (SEM). The results showed that for the Cu-10 mass% Al alloy Ag addition induce the beta'(1) phase formation and for the Cu-11 mass% Al alloy these additions increase the amount of martensite formed on quenching and decrease the stability range of this phase on heating.

Partial melt processing and electrical properties of Bi-Sr-Ca-Cu-o superconducting thick films on (100) MgO substrates

Superconducting thick films of Bi2Sr2CaCu2Oy (Bi-2212) on single-crystalline (100) MgO substrates have been prepared using a doctor-blade technique and a partial-melt process. It is found that the phase composition and the amount of Ag addition to the paste affect the structure and superconducting properties of the partially melted thick films. The optimum heat treatment schedule for obtaining high Jc has been determined for each paste. The heat treatment ensures attainment of high purity for the crystalline Bi-2212 phase and high orientation of Bi-2212 crystals, in which the c-axis is perpendicular to the substrate. The highest Tc, obtained by resistivity measurement, is 92.2 K. The best value for Jct (transport) of these thick films, measured at 77 K in self-field, is 8 × 10 3 Acm -2.

Bactericidal effect of silver-reinforced carbon nanotube and hydroxyapatite composites

Bacterial infection remains an important risk factor after orthopedic surgery. The present paper reports the synthesis of hydroxyapatite-silver (HA-Ag) and carbon nanotube-silver (CNT-Ag) composites via spark plasma sintering (SPS) route. The retention of the initial phases after SPS was confirmed by phase analysis using X-ray diffraction and Raman spectroscopy. Energy dispersive spectrum analysis showed that Ag was distributed uniformly in the CNT/HA matrix. The breakage of CNTs into spheroid particles at higher temperatures (1700 degrees C) is attributed to the Rayleigh instability criterion. Mechanical properties (hardness and elastic modulus) of the samples were evaluated using nanoindentation testing. Ag reinforcement resulted in the enhancement of hardness (by similar to 15%) and elastic modulus (similar to 5%) of HA samples, whereas Ag reinforcement in CNT, Ag addition does not have much effect on hardness (0.3 GPa) and elastic modulus (5 GPa). The antibacterial tests performed using Escherichia coli and Staphylococcus epidermidis showed significant decrease (by similar to 65-86%) in the number of adhered bacteria in HA/CNT composites reinforced with 5% Ag nanoparticles. Thus, Ag-reinforced HA/CNT can serve as potential antibacterial biocomposites.

Electrochemical noise analysis of chalcopyrite carbon paste electrodes by Acidithiobacillus ferrooxidans

The electrochemical response of chalcopyrite was studied using electrochemical noise analysis (ENA). The assay was carried out under constant aeration using 30 mL in two electrochemical cells containing iron-free mineral salts solution. These cells were initially monitored for 56 hours, After 72 hours, 7.25x 10(10) cells mL(-1) of A, ferrooxidans strain LR were added in both cells and monitored until 128 h. Subsequent to this period, 0.927 mmol L-1 of silver ions and 400 mmol L-1 of chloride ions were added each one separately. Both conditions were monitored until 168 hours. According to results obtained, it was observed that Cl- ions addition induced an accelerated corrosion process. However, there is a tendency of the system to reach the stationary state due to repassivation of the electrodic surface. In the other side, the Ag+ addition contributed for the maintenance of the oxidant atmosphere, in spite of controversial effect caused by considerable variations in the R-n values, resulting in a instability in the chalcopyrite reactivity.

Estudo da influência de adições de prata na cinética de precipitação e no comportamento eletroquímico da liga Cu-6%Al

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization

The dissolution of thin film under-bump-metallization (UBM) by molten solder has been one of the most serious processing problems in electronic packaging technology. Due to a higher melting temperature and a greater Sn content, a molten lead-free solder such as eutectic SnAg has a faster dissolution rate of thin film UBM than the eutectic SnPb. The work presented in this paper focuses on the role of 0.5 wt % Cu in the base Sn–3.5%Ag solder to reduce the dissolution of the Cu bond pad in ball grid array applications. We found that after 0.5 wt % Cu addition, the rate of dissolution of Cu in the molten Sn–3.5%Ag solder slows down dramatically. Systematic experimental work was carried out to understand the dissolution behavior of Cu by the molten Sn–3.5%Ag and Sn–3.5%Ag–0.5%Cu solders at 230–250 °C, for different time periods ranging from 1 to 10 min. From the curves of consumed Cu thickness, it was concluded that 0.5 wt % Cu addition actually reduces the concentration gradient at the Cu metallization/molten solder interface which reduces the driving force of dissolution. During the dissolution, excess Cu was found to precipitate out due to heterogeneous nucleation and growth of Cu6Sn5 at the solder melt/oxide interface. In turn, more Cu can be dissolved again. This process continues with time and leads to more dissolution of Cu from the bond pad than the amount expected from the solubility limit, but it occurs at a slower rate for the molten Sn–3.5%Ag–0.5%Cu solder. © 2003 American Institute of Physics.