La Enseñanza de la Creatividad en los estudios de Publicidad de las Universidades Españolas : un análisis de los temarios de las asignaturas de Estrategia Creativa, Redacción Creativa, Dirección de Arte y Creatividad Publicitaria. Réplica del estudio de Stuhlfaut y Berman (2009) en Estados Unidos

A lo largo de esta investigación se describirá de forma exploratoria cómo se está enseñando actualmente la creatividad publicitaria en las universidades españolas en contraposición con las universidades estadounidenses. El motivo para elaborar esta comparación es simple: una investigación muy similar ya se ha llevado a cabo en Estados Unidos. Tras considerar otros enfoques metodológicos, llegó a nuestras manos un artículo publicado en el Journal of Advertising Education. En este artículo se llevaba a cabo un anàlisis de contenido de los temarios de las asignaturas de creatividad de una muestra de las universidades estadounidenses. La investigación, llevada a cabo por Mark Stuhlfaut y Margo Berman (2009) presenta una metodología muy clara y sólida que por sus características invita a ser replicada en otro campo o, como es el caso, en otro país. Así pues, siguiendo los pasos metodológicos marcados por Stuhlfaut y Berman, se presenta una réplica de su investigación Pedagogic Challenges: The Teaching of Creative Strategy in Advertising Courses7 y se estudia la enseñanza en materia creatividad publicitaria en la universidad española analizando los temarios de las asignaturas de creatividad. El trabajo se divide en dos partes. La primera consiste en una revisión bibliográfica para determinar el estado de la cuestión de los estudios universitarios de publicidad y, más concretamente, de la materia de creatividad publicitaria. La segunda parte es la réplica del estudio la cual conlleva el análisis de contenido de los temarios obtenidos y la consiguiente comparación entre los resultados obtenidos con los publicados por Stuhlfaut y Berman (2009).

Learning from errors

We present a model of learning in which agents learn from errors. If an action turns out to be an error, the agent rejects not only that action but also neighboring actions. We find that, keepng memory of his errors, under mild assumptions an acceptable solution is asymptotically reached. Moreover, one can take advantage of big errors for a faster learning.

Anàlisi de la controvèrsia L'Hôpital - Bernoulli

El 1696 el Marquès de L'Hôpital publicà el primer tractat sistemàtic sobre càlcul diferencial, l'"Analyse des infiniments petits", que es basava en les "Lectiones de calculo differentialium" de Johann Bernoulli. Però podem parlar d'aportacions originals per part de L'Hôpital? L'objectiu d'aquest treball de recerca és comparar el contingut i la forma de l'Analyse i de les Lectiones i detectar possibles influències d'altres autors per intentar, finalment, donar una resposta a aquesta qüestió.

Recovering the Elliott invariant from the Cuntz semigroup

Let A be a simple, separable C*-algebra of stable rank one. We prove that the Cuntz semigroup of C (T, A) is determined by its Murray-von Neumann semigroup of projections and a certain semigroup of lower semicontinuous functions (with values in the Cuntz semigroup of A). This result has two consequences. First, specializing to the case that A is simple, finite, separable and Z-stable, this yields a description of the Cuntz semigroup of C (T, A) in terms of the Elliott invariant of A. Second, suitably interpreted, it shows that the Elliott functor and the functor defined by the Cuntz semigroup of the tensor product with the algebra of continuous functions on the circle are naturally equivalent.

Bayesian nash equilibrium in ''linear'' cournot models with private information about costs

Calculating explicit closed form solutions of Cournot models where firms have private information about their costs is, in general, very cumbersome. Most authors consider therefore linear demands and constant marginal costs. However, within this framework, the nonnegativity constraint on prices (and quantities) has been ignored or not properly dealt with and the correct calculation of all Bayesian Nash equilibria is more complicated than expected. Moreover, multiple symmetric and interior Bayesianf equilibria may exist for an open set of parameters. The reason for this is that linear demand is not really linear, since there is a kink at zero price: the general ''linear'' inverse demand function is P (Q) = max{a - bQ, 0} rather than P (Q) = a - bQ.

Overcoming the ethical dilemmas of skilled migration? An analysis of international narratives on the “brain drain”

Migration-related issues have, since approximately 2000, been the object of increased attention at the international level. This has led, among other things, to the production of international narratives, which aim both at understanding migration and at proposing policy recommendations on how to address it, with the objective of improving the governance of migration at the global level. But this implies overcoming dilemmas stemming from the diverging interests of states and other actors (like NGOs and the private sector). This article examines the way in which international migration narratives address skilled migration, which is characterised by some of the clearest political trade-offs between stakeholders. It argues that these narratives attempt to speak to all parties and conciliate contradictory arguments about what should be done, in order to discursively overcome policy dilemmas and create a consensus. While this is line with the mandate of international organizations, it depoliticises migration issues.

Dynamic adverse selection and debt

This paper argues that the strategic use of debt favours the revelationof information in dynamic adverse selection problems. Our argument is basedon the idea that debt is a credible commitment to end long term relationships.Consequently, debt encourages a privately informed party to disclose itsinformation at early stages of a relationship. We illustrate our pointwith the financing decision of a monopolist selling a good to a buyerwhose valuation is private information. A high level of (renegotiable)debt, by increasing the scope for liquidation, may induce the highvaluation buyer to buy early at a high price and thus increase themonopolist's expected payoff. By affecting the buyer's strategy, it mayreduce the probability of excessive liquidation. We investigate theconsequences of good durability and we examine the way debt mayalleviate the ratchet effect.

Bank liquidity, interbank markets and monetary policy

A major lesson of the recent financial crisis is that the interbank lending marketis crucial for banks facing large uncertainty regarding their liquidity needs. Thispaper studies the efficiency of the interbank lending market in allocating funds. Weconsider two different types of liquidity shocks leading to different implications foroptimal policy by the central bank. We show that, when confronted with a distributional liquidity-shock crisis that causes a large disparity in the liquidity held amongbanks, the central bank should lower the interbank rate. This view implies that thetraditional tenet prescribing the separation between prudential regulation and monetary policy should be abandoned. In addition, we show that, during an aggregateliquidity crisis, central banks should manage the aggregate volume of liquidity. Twodifferent instruments, interest rates and liquidity injection, are therefore required tocope with the two different types of liquidity shocks. Finally, we show that failureto cut interest rates during a crisis erodes financial stability by increasing the riskof bank runs.

Residual thermomechanical stresses in thinned-chip assemblies

A new technology for the three-dimensional (3-D) stacking of very thin chips on a substrate is currently under development within the ultrathin chip stacking (UTCS) Esprit Project 24910. In this work, we present the first-level UTCS structure and the analysis of the thermomechanical stresses produced by the manufacturing process. Chips are thinned up to 10 or 15 m. We discuss potentially critical points at the edges of the chips, the suppression of delamination problems of the peripheral dielectric matrix and produce a comparative study of several technological choices for the design of metallic interconnect structures. The purpose of these calculations is to give inputs for the definition of design rules for this technology. We have therefore undertaken a programme that analyzes the influence of sundry design parameters and alternative development options. Numerical analyses are based on the finite element method.

Thermal modeling and management in ultrathin chip stack technology

This paper presents a thermal modeling for power management of a new three-dimensional (3-D) thinned dies stacking process. Besides the high concentration of power dissipating sources, which is the direct consequence of the very interesting integration efficiency increase, this new ultra-compact packaging technology can suffer of the poor thermal conductivity (about 700 times smaller than silicon one) of the benzocyclobutene (BCB) used as both adhesive and planarization layers in each level of the stack. Thermal simulation was conducted using three-dimensional (3-D) FEM tool to analyze the specific behaviors in such stacked structure and to optimize the design rules. This study first describes the heat transfer limitation through the vertical path by examining particularly the case of the high dissipating sources under small area. First results of characterization in transient regime by means of dedicated test device mounted in single level structure are presented. For the design optimization, the thermal draining capabilities of a copper grid or full copper plate embedded in the intermediate layer of stacked structure are evaluated as a function of the technological parameters and the physical properties. It is shown an interest for the transverse heat extraction under the buffer devices dissipating most the power and generally localized in the peripheral zone, and for the temperature uniformization, by heat spreading mechanism, in the localized regions where the attachment of the thin die is altered. Finally, all conclusions of this analysis are used for the quantitative projections of the thermal performance of a first demonstrator based on a three-levels stacking structure for space application.