Influence of Particle Size, Applied Compression, and Substratum Material on Particle-Surface Adhesion Force Using the Centrifuge Technique

The centrifuge technique was used to investigate the influence of particle size, applied compression, and substrate material (stainless steel, glass, Teflon, and poly(vinyl chloride)) on particle-surface adhesion force. For this purpose, phosphatic rock (rho(p) = 3090 kg/m(3)) and manioc starch particles (rho(p) = 1480 kg/m(3)) were used as test particles. A microcentrifuge that reached a maximum rotation speed of 14 000 rpm and which contained specially designed centrifuge tubes was used in the adhesion force measurements. The curves showed that the adhesion force profile followed a normal log distribution. The adhesion force increased linearly with particle size and with the increase of each increment of compression force. The manioc starch particles presented greater adhesion forces than the phosphatic rock particles for all particle sizes studied. The glass substrate showed a higher adherence than the other materials, probably due to its smoother topographic surface roughness in relation to the other substrata.

Interface tailoring for adhesion enhancement of diamond-like carbon thin films

We have explored the suitability and characteristics of interface tailoring as a tool for enhancing the adhesion of hydrogen-free diamond-like carbon (DLC) thin films to silicon substrates. DLC films were deposited on silicon with and without application of an initial high energy carbon ion bombardment phase that formed a broad Si-C interface of gradually changing Si:C composition. The interface depth profile was calculated using the TRIDYN simulation program, revealing a gradient of carbon concentration including a region with the stoichiometry of silicon carbide. DLC films on silicon, with and without interface tailoring, were characterized using Raman spectroscopy, scanning electron microscopy, atomic force microscopy and scratch tests. The Raman spectroscopy results indicated sp3-type carbon bonding content of up to 80%. Formation of a broadened Si:C interface as formed here significantly enhances the adhesion of DLC films to the underlying silicon substrate. (C) 2012 Elsevier B.V. All rights reserved.