Computation of Thermal Stress Intensity Factors for Bimaterial Interface Cracks Using Domain Integral Method

The concept of domain integral used extensively for J integral has been applied in this work for the formulation of J(2) integral for linear elastic bimaterial body containing a crack at the interface and subjected to thermal loading. It is shown that, in the presence of thermal stresses, the J(k) domain integral over a closed path, which does not enclose singularities, is a function of temperature and body force. A method is proposed to compute the stress intensity factors for bimaterial interface crack subjected to thermal loading by combining this domain integral with the J(k) integral. The proposed method is validated by solving standard problems with known solutions.

Effect of Stress and Interface defects on Photo Luminescence of Si nano-crystals embedded in SiO2

Effect of stress and interface defects on photo luminescence property of a silicon nano-crystal (Si-nc) embedded in amorphous silicon dioxide (a-SiO2) are studied in this paper using a self-consistent quantum-continuum based modeling framework. Si-ncs or quantum dots show photoluminescence at room temperature. Whether its origin is due to Si-nc/a-SiO2 interface defects or quantum confinement of carriers in Si-nc is still an outstanding question. Earlier reports have shown that stresses greater than 12 GPa change the indirect energy band gap structure of bulk Si to a direct energy band gap structure. Such stresses are observed very often in nanostructures and these stresses influence the carrier confinement energy significantly. Hence, it is important to determine the effect of stress in addition to the structure of interface defects on photoluminescence property of Si-nc. In the present work, first a Si-nc embedded in a-SiO2 is constructed using molecular dynamics simulation framework considering the actual conditions they are grown so that the interface and residual stress in the structure evolves naturally during formation. We observe that the structure thus created has an interface of about 1 nm thick consisting of 41.95% of defective states mostly Sin+ (n = 0 to 3) coordination states. Further, both the Si-nc core and the embedding matrix are observed to be under a compressive strain. This residual strain field is applied in an effective mass k.p Hamiltonian formulation to determine the energy states of the carriers. The photo luminescence property computed based on the carrier confinement energy and interface energy states associated with defects will be analysed in details in the paper.

An early in-situ stress signature of the AlN-Si pre-growth interface for successful integration of nitrides with (111) Si

The integration of Metal Organic Chemical Vapor Deposition (MOCVD) grown group III-A nitride device stacks on Si (111) substrates is critically dependent on the quality of the first AlN buffer layer grown. A Si surface that is both oxide-free and smooth is a primary requirement for nucleating such layers. A single parameter, the AlN layer growth stress, is shown to be an early (within 50 nm), clear (<0.5 GPa versus > 1GPa), and fail-safe indicator of the pre-growth surface, and the AlN quality required for successful epitaxy. Grain coalescence model for stress generation is used to correlate growth stress, the AlN-Si interface, and crystal quality. (C) 2013 AIP Publishing LLC.

Role of interface curvature on stress distribution under indentation for ZrN/Zr multilayer coating

Contact damage in curved interface nano-layeredmetal/nitride (150 (ZrN)/10 (Zr) nm) multilayer is investigated in order to understand the role of interface morphology on contact damage under indentation. A finite element method (FEM) model was formulated with different wavelengths of 1000 nm, 500 nm, 250 nm and common height of 50 nm, which gives insight on the effect of different curvature on stress field generated under indentation. Elastic-plastic properties were assigned to the metal layer and substrate while the nitride layer was assigned perfectly elastic properties. Curved interface multilayers show delamination along the metal/nitride interface and vertical cracks emanating from the ends of the delamination. FEM revealed the presence of tensile stress normal to the interface even under the contact, along with tensile radial stresses, both present at the valley part of the curve, which leads to vertical cracks associated with interfacial delamination. Stress enhancement was seen to be relatively insensitive to curvature. (C) 2014 Elsevier B.V. All rights reserved.

Biaxial-load effects on isopachics for a crack at the interface of dissimilar media

The plane problem of two dissimilar materials, bonded together and containing a crack along their common interface, which were subjected to a biaxial load at infinity, is examined by giving a closed-form expression for the first stress invariant of the normal stresses, which is equally valid everywhere, near to, and far from, the crack-tip region. This exact expression for the first-stress invariant is compared by constructing the respective isopachic-fringe patterns, to the approximate expression with non-singular terms, due to the biaxiality factor, for the same quantity. Significant differences between respective isopachic-patterns were found and their dependence on the elastic properties of both materials and the applied loads was demonstrated. The relative errors between the computedK I - andK II -components by using the approximate expression for the first stress-invariant and the accurate one, derived from closed-form solution along either isopachic-fringes or along circles and radii from the crack-tip have been given, indicating in some cases large discrepancies between exact and approximate solutions.

Viscoelastic Properties of Nanocrystalline Films of Semiconducting Chalcogenides at Liquid/Liquid Interface

The interfacial shear rheological properties of a continuous single-crystalline film of CuS and a 3D particulate gel of CdS nanoparticles (3−5 nm in diameter) formed at toluene−water interfaces have been studied. The ultrathin films (50 nm in thickness) are formed in situ in the shear cell through a reaction at the toluene−water interface between a metal−organic compound in the organic layer and an appropriate reagent for sulfidation in the aqueous layer. Linear viscoelastic spectra of the nanofilms reveal solid-like rheological behavior with the storage modulus higher than the loss modulus over the range of angular frequencies probed. Large strain amplitude sweep measurements on the CdS nanofilms formed at different reactant concentrations suggest that they form a weakly flocculated gel. Under steady shear, the films exhibit a yield stress, followed by a steady shear thinning at high shear rates. The viscoelastic and flow behavior of these films that are in common with those of many 3D “soft” materials like gels, foams, and concentrated colloidal suspensions can be described by the “soft” glassy rheology model.

'Wet N2O oxidation' process and interface state density characterization of nanoscale nitrided SiO2 for flash memory application

In this paper we first present the 'wet N2O' furnace oxidation process to grow nitrided tunnel oxides in the thickness range 6 to 8 nm on silicon at a temperature of 800 degrees C. Electrical characteristics of MOS capacitors and MOSFETs fabricated using this oxide as gate oxide have been evaluated and the superior features of this oxide are ascertained The frequency response of the interface states, before and after subjecting the MOSFET gate oxide to constant current stress, is studied using a simple analytical model developed in this work.

Elastic stress analysis of jointed half-planes

Using a Fourier-integral approach, the problem of stress analysis in a composite plane consisting of two half-planes of different elastic properties rigidly joined along their boundaries has been solved. The analysis is done for a force acting in one of the half-planes for both cases when the force acts parallel and perpendicular to the interface. As a particular case, the interface stresses are evaluated when the interface is smooth. Some properties of the normal stress at the interface are discussed both for plane stress and plane strain conditions.

An Experimental Study to Show the Effect of Thermal Stress on Thermal Contact Conductance at Sub-megapascal Contact Pressures

Experimental studies are presented to show the effect of thermal stresses on thermal contact conductance (TCC) at low contact pressures. It is observed that in a closed contact assembly, contact pressure acting on the interface changes with the changing temperature of contact members. This change in contact pressure consequently causes variations in the TCC of the junction. A relationship between temperature change and the corresponding magnitude of developed thermal stress in a contact assembly is determined experimentally. Inclusion of a term called temperature dependent load correction factor is suggested in the theoretical model for TCC to make it capable of predicting TCC values more accurately in contact assemblies that experience large temperature fluctuations. [DOI: 10.1115/1.4001615]

Stress and strength analysis of pin joints in laminated anisotropic plates

Mechanical joints in composites can be tailored to achieve improved performance and better life by appropriately selecting the laminate parameters. In order to gain the best advantage of this possibility of tailoring the laminate, it is necessary to understand the influence of laminate parameters on the behaviour of joints in composites. Most of the earlier studies in this direction were based on simplified assumptions regarding load transfer at the pin-plate interface and such studies were only carried out on orthotropic and quasi-isotropic laminates. In the present study, a more rigorous analysis is carried out to study pin joints in laminates with anisotropic properties. Two types of laminates with (0/ + ?4/90)s and (0/ ± ?2/90)s layups made out of graphite epoxy T300/5208 material system are considered. The analysis mainly concentrates on clearance fit in which the pin is of smaller diameter compared to the hole. The main aspect of the analysis of pin joints is the changing contact between the pin and the plate with increasing load levels. The analysis is carried out by an iterative finite element technique and a computationally efficient routine is developed for this purpose. Numerical studies indicate that the location and magnitude of the peak stresses along the hole boundary are functions of fibre angle and the overall anisotropic properties. It is also shown that the conventional assumption of cosine distribution for the contact pressure between pin and the plate in the analysis lead to underestimation of bearing failure load and overestimation of shear and tensile failure loads in typical (0/905)s cross-ply laminates.

Asymptotic and finite element analyses of mode III dynamic crack growth at a ductile-brittle interface

In this work, dynamic crack growth along a ductile-brittle interface under anti-plane strain conditions is studied. The ductile solid is taken to obey the J(2) flow theory of plasticity with linear isotropic strain hardening, while the substrate is assumed to exhibit linear elastic behavior. Firstly, the asymptotic near-tip stress and velocity fields are derived. These fields are assumed to be variable-separable with a power singularity in the radial coordinate centered at the crack tip. The effects of crack speed, strain hardening of the ductile phase and mismatch in elastic moduli of the two phases on the singularity exponent and the angular functions are studied. Secondly, full-field finite element analyses of the problem under small-scale yielding conditions are performed. The validity of the asymptotic fields and their range of dominance are determined by comparing them with the results of the full-field finite element analyses. Finally, theoretical predictions are made of the variations of the dynamic fracture toughness with crack velocity. The influence of the bi-material parameters on the above variation is investigated.

Elasto-plastic contact stress analysis of joints subjected to cyclic loading

Rigorous elastic-plastic finite element analysis of joints subjected to cyclic loading is carried out. An incremental-iterative algorithm is developed in a modular form combining elasto-plastic material behaviour and contact stress analysis. For the case of the interference fit, the analysis sequentially carries out insertion of the pin and application of the load on the joint, covering possible initiation of separation (and/or yielding) and progressively the receding/advancing contact at the pin-plate interface. Deformations of both the plate and the pin are considered in the analysis. Numerical examples are presented for the case of an interference fit pin in a large plate under remote cyclic tension, and for an interference fit pin lug joint subjected to cyclic loading. A detailed study is carried out for the latter problem considering the effect of change in contact/separation at the pin-plate interface on local stresses, strains and redistribution of these stresses with the spread of a plastic zone. The results of the study are a useful input for the estimation of the fatigue life of joints. Copyright (C) 1996 Elsevier Science Ltd

Re-examination of crack opening model of interface fracture

The complex singularity associated with a crack at the interface between two dissimilar, isotropic and homogeneous materials leads to mathematical artefacts, such as stress oscillations and crack face interpenetrations in the vicinity of the crack tip. To avoid these unrealistic features, Sinclair (Sinclair GB. On the stress singularity at an interface crack. International Journal of Fracture 1980;16(2):111-9) assumed a finite crack opening angle (COA) such that the singularity lambda became real equal to 1/2. This paper extends the COA model by considering real singularities not necessarily equal to 1/2. When COA is 0 degrees: the interface crack singularity is complex with a real part equal to 1/2. On increasing COA, the imaginary part of the singularity decreases and becomes zero at a threshold value of COA; at this point, the singularity is a real, repeated value. A further increase in COA results in a pair of real singularities. Different crack opening configurations and material combinations are studied, and results presented for threshold COAs and associated values of singularity. Stress analyses for these three regimes: (a) complex, (b) real pair and (c) real repeated singularities, are reported. It is seen that additional complexities are present in the last case. Typical results for stress fields are also included for comparing with standard fields. (C) 1999 Elsevier Science Ltd. All rights reserved.

Influence of interface properties on fracture behaviour of concrete

Hardened concrete is a three-phase composite consisting of cement paste, aggregate and interface between cement paste and aggregate. The interface in concrete plays a key role on the overall performance of concrete. The interface properties such as deformation, strength, fracture energy, stress intensity and its influence on stiffness and ductility of concrete have been investigated. The effect of composition of cement, surface characteristics of aggregate and type of loading have been studied. The load-deflection response is linear showing that the linear elastic fracture mechanics (LEFM) is applicable to characterize interface. The crack deformation increases with large rough aggregate surfaces. The strength of interface increases with the richness of concrete mix. The interface fracture energy increases as the roughness of the aggregate surface increases. The interface energy under mode II loading increases with the orientation of aggregate surface with the direction of loading. The chemical reaction between smooth aggregate surface and the cement paste seems to improve the interface energy. The ductility of concrete decreases as the surface area of the strong interface increases. The fracture toughness (stress intensity factor) of the interface seems to be very low, compared with hardened cement paste, mortar and concrete.