34 resultados para Process engineering
em Chinese Academy of Sciences Institutional Repositories Grid Portal
Resumo:
Pulsed fluidization is of considerable interest in process engineering for improving fluidization quality. Quantitative understanding of the pulsed two-phase flow behaviors is very important for proper design and optimum operation of such contactors. The
Resumo:
On the basis of the Local Equilibrium Model (LEM), fine particles with large Richardson-Zaki exponent n show, under certain conditions during bed expansion and collapse, different dynamic behavior from particles with small n. For an expansion process there may be a concentration discontinuity propagating upward from the distributor, and, on the contrary, for a collapse process there may be a progressively broadening and upward-propagating continuous transition zone instead of discontinuity. The predictions of the bed height variation and the discontinuity trace have been validated experimentally. (c) 2007 Chinese Society of Particuology and Institute of Process Engineering, Chinese Academy of Sciences. Published by Elsevier B.V. All rights reserved.
Resumo:
<正> 国际尖端材料技术协会(SAMPE:Society for the Advancement of Material and Process Engineering)于1992年10月20—22月在加拿大多伦多市召开了两个国际学术会议:第24届国际SAMPE技术会议(24th Int.SAMPE Techn。Coaf。)和第3届国际金属与金属加工会议(3rd Int.SAMPE Metals and Metals Processin Conf.)。两个会议同时举行,全体会议(Plenary Session)在一个会场举行。前者的主题是“先进材料迎接经济的挑战”;后者的主题是“合成与加工的新进展”.尽管此二会议是在西方发达国家经济很不景
Resumo:
SPEM(software process engineering metamodel)是国际标准化组织制定的标准元模型,正日益成为软件过程建模领域的行业标准,但在过程执行方面,SPEM还存在不足.将软件过程看作是一种特殊的工作流,提出了一种应用工作流运行机制支持软件过程执行的方法.通过将SPEM模型转换为XPDL(XML process definition language)模型,利用XPDL引擎支持SPEM模型的执行.制定了SPEM和XPDL之间的映射规则,设计了转换算法并开发了转换引擎.该方法被应用在SoftPM项目中,成功地基于XPDL引擎Shark实现了对软件过程模型的执行支持.
Resumo:
Sand storm is a serious environmental threat to humans. Sand particles are transported by saltation and suspension, causing soil erosion in one place and deposition in another. In order to prevent and predict sand storms, the causes and the manners of particle motions must be studied in detail. In this paper a standard k-epsilon model is used for the gas phase simulation and the discrete element method (DEM) is used to predict the movements of particles using an in-house procedure. The data are summarized in an Eulerian-Eulerian regime after simulation to get the statistical particle Reynolds stress and particle collision stress. The results show that for the current case the Reynolds stress and the air shear stress predominate in the region 20-250 mm above the initial sand bed surface. However, in the region below 3 mm, the collision stress must be taken into account in predicting particle movement. (C) 2010 Chinese Society of Particuology and Institute of Process Engineering, Chinese Academy of Sciences. Published by Elsevier B.V. All rights reserved.
A NEW THERMOPLASTIC POLYIMIDE COMPOSITE PREPARED BY THE POLYMERIZATION OF MONOMER REACTANTS APPROACH
Resumo:
A novel amorphous thermoplastic polyimide (PTI) is being developed as a potential matrix resin for advanced composites. This paper describes the manufacture of the resin, prepreg, and processing of the composite. The chemical and physical behavior of the resin during the processing was determined by infrared spectroscopy and rheology. The influence of processing conditions on the composite properties was investigated. Mechanical properties of the unidirectional carbon fiber/PTI laminates were also presented.
Resumo:
Surface micro-roughness, surface chemical properties, and surface wettability are three important aspects of wafer surfaces during a wafer cleaning process, which determine the bonding quality of ordinary direct wafer bonding. In this study, InP wafers are divided into four groups and treated by different chemical processes. Subsequently, the characteristics of the treated InP surfaces are carefully studied by X-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), and contact angle measurements. The optimal wafer treatment method for wafer bonding is determined by comparing the results of the processes as a whole. This optimization is later evaluated by a scanning electronic microscope (SEM), and the ridge waveguide 1.55 mu m Si-based InP/InGaAsP multi-quantum-well laser chips are also fabricated. (c) 2005 Elsevier B.V. All rights reserved.
Resumo:
Two biosensors for fermentation process control have been introduced, which were developed in our lab recently. One is an enzyme electrode-based on-line monitoring system for glutamate fermentation process control and the other is an H+-ISFET-based ENFET for penicillin G fermentation process control.
Resumo:
Oxidizing thick porous silicon layer into silicon dioxide is a timesaving and low-cost process for producing thick silicon dioxide layer used in silicon-based optical waveguide devices. The solution of H2O2 is proposed to post-treat thick porous silicon (PS) films. The prepared PS layer as the cathode is applied about 10 mA/cm(2) current in mixture of ethanol, HF, and H2O2 solutions, in order to improve the stability and the smoothness of the surface. With the low-temperature dry-O-2 pre-oxidizations and high-temperature wet O-2 oxidizations process, a high-quality SiO2 30 mu m thickness layer that fit for the optical waveguide device was prepared. The SEM images show significant improved smoothness on the surface of oxidized PS thick films, the SiO2 film has a stable and uniformity reflex index that measured by the prism coupler, the uniformity of the reflex index in different place of the wafer is about 0.0003.
Resumo:
The State Key Laboratory of Computer Science (SKLCS) is committed to basic research in computer science and software engineering. The research topics of the laboratory include: concurrency theory, theory and algorithms for real-time systems, formal specifications based on context-free grammars, semantics of programming languages, model checking, automated reasoning, logic programming, software testing, software process improvement, middleware technology, parallel algorithms and parallel software, computer graphics and human-computer interaction. This paper describes these topics in some detail and summarizes some results obtained in recent years.