432 resultados para Cu-ATPases
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通过高压扭转对Cu试样施加不同程度的变形,利用OM,TEM及差示扫描量热仪(DSC)对变形组织微观结构及其热稳定性进行了分析.在较小的变形程度下,变形组织为高位错密度的位错胞、亚晶组织,试样的变形储能随变形量的增大而增大,在切应变等于13时达到最大,为0.91 J/mol,DSC曲线显示的放热峰随变形量的增大向低温方向偏移;进一步变形,动态回复加剧,高位错密度的亚晶组织逐渐演化成无位错的等轴状晶粒组织,试样的变形储能减小,组织的稳定性提高.显微硬度随退火温度的提高而减小,晶粒的明显长大导致显微硬度急剧减小.出现明显晶粒长大的温度较DSC曲线显示的放热峰起始温度低45℃左右,这主要是由于变形组织的回复再结晶过程是退火温度与时间的函数,降低处理温度并延长处理时间能达到与高温短时处理相同的效果.
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通过高压扭转(HPT)技术在不同转速条件下实现了Cu试样的晶粒细化.利用光学显微镜(OM),透射电镜(TEM)及显微硬度计观察并测试了组织的结构与性能,并基于有限元计算了变形诱导试样的温升,研究了转速对Cu试样的组织细化与性能的影响.结果表明:转速由1/3r.min-1增大至1r.min-1,经1圈扭转变形,试样温度由40.8℃升高到54.1℃,变形组织均为100~600nm的高位错密度位错胞/亚晶组织,显微硬度由初始态的52HV0.05增大至140HV0.05;经16圈扭转变形,试样温度由50.4℃升高到97.4℃,组织细化到200nm.慢速扭转变形试样晶内位错密度高,微观组织处于严重变形状态;而快速扭转试样晶内衬度均匀,位错较少,微观组织经历明显的动态回复,显微硬度较慢速扭转变形试样低6%
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Surface plasmon resonances of arrays of parallel copper nanowires, embedded in ion track-etched polycarbonate membranes, were investigated by systematic changes of nanowires’ topology and arrays area density. The extinction spectra exhibit two peaks which are attributed to interband transitions of Cu bulk metal and to a dipolar surface plasmon resonance, respectively. The resonances were investigated as a function of wire diameter and length, mean distance between adjacent wires, and angle of incidence of the light field with respect to the long wire axis. The dipolar peak shifts to larger wavelengths with increasing diameter and length, and diminishing mean distance between adjacent wires. Additionally, the shape effect on the dipolar peak is investigated.
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Nanopores with diameters between 30 nm and 180 nm have been fabricated by inducing latent track with fast heavy ions and etching process in 25 μm thick,single-crystal muscovite mica.For short etching time,the nanopores are columns with circular cross section.For long etching time the cross section of nanopores becomes rhombic.Thus the shape of nanopores depends on the etching time.Cu nanowires have been fabricated with controlled dimensions by electrodeposition into the nanopores.The ultraviolet-visible lig...中文文摘:利用快重离子辐照的单晶白云母片产生潜径迹,蚀刻得到直径在30—180nm纳米孔道.孔道形状依赖于蚀刻时间,蚀刻时间短得到圆柱形孔道,蚀刻时间长得到菱柱形孔道.从而在云母模板孔道中电化学沉积得到不同直径和形状的Cu纳米线.通过紫外可见光谱分析,发现铜纳米线的尺寸和形状影响其光学性质.直径小于60nm的近似为圆柱状Cu纳米线有一个明显的表面等离子体共振峰和一个微弱的次峰.随着直径增加,菱柱状的Cu纳米线主峰有明显的红移,次峰逐渐增强.同时利用扫描电子显微镜、X射线衍射对Cu纳米线的形貌和晶体结构特征进行了表征.
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利用快重离子辐照的单晶白云母片产生潜径迹,蚀刻得到直径在30—180nm纳米孔道.孔道形状依赖于蚀刻时间,蚀刻时间短得到圆柱形孔道,蚀刻时间长得到菱柱形孔道.从而在云母模板孔道中电化学沉积得到不同直径和形状的Cu纳米线.通过紫外可见光谱分析,发现铜纳米线的尺寸和形状影响其光学性质.直径小于60nm的近似为圆柱状Cu纳米线有一个明显的表面等离子体共振峰和一个微弱的次峰.随着直径增加,菱柱状的Cu纳米线主峰有明显的红移,次峰逐渐增强.同时利用扫描电子显微镜、X射线衍射对Cu纳米线的形貌和晶体结构特征进行了表征.
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IEECAS SKLLQG
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IEECAS SKLLQG
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Excitation energies and electron impact excitation strengths from the ground states of Ni-, Cu- and Zn-like Au ions are calculated. The collision strengths are computed by a 213-levels expansion for the Ni- like Au ion, 405-levels expansion for the Cu-like Au ion and 229-levels expansion for the Zn-like Au ion. Configuration interactions are taken into account for all levels included. The target state wavefunctions are calculated by using the Grasp92 code. The continuum orbits are computed in the distorted-wave approximation, in which the direct and exchange potentials among all the electrons are included. Excellent agreement is found when the results are compared with previous calculations and recent measurements.
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Multilayers with a structure of Si/[Fe(10 nm)/CU(10 nm)](5) were deposited on Si(100) substrates and then irradiated at room temperature by using 2-MeV Xe20+. The modifications of the multilayers were characterized using a depth profile analysis of the Auger electron spectroscopy (AES) data and the evolution of crystallite structures of the multilayers were analyzed by using X-ray diffraction (XRD). The AES depth profiles indicated that de-mixing of the Fe and the Cu layers was observed at low ion fluences, but inter-mixing of the Fe and the Cu layers was found at high ion fluences and destroyed the layered structure of the multilayers. The obtained XRD patterns showed that, after irradiation by 2-MeV Xe20+ at; 2 x 10(16) ions/cm(2), the peaks of the multilayers related to a Cu-based fee solid solution and an Fe-based bee solid solution phase became visible, which implied that the inter-mixing at the Fe/Cu interface resulted in the formation of new phases. A possible mechanism of modification in the Fe/Cu multilayers induced by ion irradiation is briefly discussed.