977 resultados para thermal resistance
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A combined mathematical model for predicting heat penetration and microbial inactivation in a solid body heated by conduction was tested experimentally by inoculating agar cylinders with Salmonella typhimurium or Enterococcus faecium and heating in a water bath. Regions of growth where bacteria had survived after heating were measured by image analysis and compared with model predictions. Visualisation of the regions of growth was improved by incorporating chromogenic metabolic indicators into the agar. Preliminary tests established that the model performed satisfactorily with both test organisms and with cylinders of different diameter. The model was then used in simulation studies in which the parameters D, z, inoculum size, cylinder diameter and heating temperature were systematically varied. These simulations showed that the biological variables D, z and inoculum size had a relatively small effect on the time needed to eliminate bacteria at the cylinder axis in comparison with the physical variables heating temperature and cylinder diameter, which had a much greater relative effect. (c) 2005 Elsevier B.V All rights reserved.
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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
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Mode of access: Internet.
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Thermal analysis of electronic devices is one of the most important steps for designing of modern devices. Precise thermal analysis is essential for designing an effective thermal management system of modern electronic devices such as batteries, LEDs, microelectronics, ICs, circuit boards, semiconductors and heat spreaders. For having a precise thermal analysis, the temperature profile and thermal spreading resistance of the device should be calculated by considering the geometry, property and boundary conditions. Thermal spreading resistance occurs when heat enters through a portion of a surface and flows by conduction. It is the primary source of thermal resistance when heat flows from a tiny heat source to a thin and wide heat spreader. In this thesis, analytical models for modeling the temperature behavior and thermal resistance in some common geometries of microelectronic devices such as heat channels and heat tubes are investigated. Different boundary conditions for the system are considered. Along the source plane, a combination of discretely specified heat flux, specified temperatures and adiabatic condition are studied. Along the walls of the system, adiabatic or convective cooling boundary conditions are assumed. Along the sink plane, convective cooling with constant or variable heat transfer coefficient are considered. Also, the effect of orthotropic properties is discussed. This thesis contains nine chapters. Chapter one is the introduction and shows the concepts of thermal spreading resistance besides the originality and importance of the work. Chapter two reviews the literatures on the thermal spreading resistance in the past fifty years with a focus on the recent advances. In chapters three and four, thermal resistance of a twodimensional flux channel with non-uniform convection coefficient in the heat sink plane is studied. The non-uniform convection is modeled by using two functions than can simulate a wide variety of different heat sink configurations. In chapter five, a non-symmetrical flux channel with different heat transfer coefficient along the right and left edges and sink plane is analytically modeled. Due to the edge cooling and non-symmetry, the eigenvalues of the system are defined using the heat transfer coefficient on both edges and for satisfying the orthogonality condition, a normalized function is calculated. In chapter six, thermal behavior of two-dimensional rectangular flux channel with arbitrary boundary conditions on the source plane is presented. The boundary condition along the source plane can be a combination of the first kind boundary condition (Dirichlet or prescribed temperature) and the second kind boundary condition (Neumann or prescribed heat flux). The proposed solution can be used for modeling the flux channels with numerous different source plane boundary conditions without any limitations in the number and position of heat sources. In chapter seven, temperature profile of a circular flux tube with discretely specified boundary conditions along the source plane is presented. Also, the effect of orthotropic properties are discussed. In chapter 8, a three-dimensional rectangular flux channel with a non-uniform heat convection along the heat sink plane is analytically modeled. In chapter nine, a summary of the achievements is presented and some systems are proposed for the future studies. It is worth mentioning that all the models and case studies in the thesis are compared with the Finite Element Method (FEM).
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In this work, all publicly-accessible published findings on Alicyclobacillus acidoterrestris heat resistance in fruit beverages as affected by temperature and pH were compiled. Then, study characteristics (protocols, fruit and variety, °Brix, pH, temperature, heating medium, culture medium, inactivation method, strains, etc.) were extracted from the primary studies, and some of them incorporated to a meta-analysis mixed-effects linear model based on the basic Bigelow equation describing the heat resistance parameters of this bacterium. The model estimated mean D* values (time needed for one log reduction at a temperature of 95 °C and a pH of 3.5) of Alicyclobacillus in beverages of different fruits, two different concentration types, with and without bacteriocins, and with and without clarification. The zT (temperature change needed to cause one log reduction in D-values) estimated by the meta-analysis model were compared to those ('observed' zT values) reported in the primary studies, and in all cases they were within the confidence intervals of the model. The model was capable of predicting the heat resistance parameters of Alicyclobacillus in fruit beverages beyond the types available in the meta-analytical data. It is expected that the compilation of the thermal resistance of Alicyclobacillus in fruit beverages, carried out in this study, will be of utility to food quality managers in the determination or validation of the lethality of their current heat treatment processes.
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The study of the thermal behavior of complex packages as multichip modules (MCM¿s) is usually carried out by measuring the so-called thermal impedance response, that is: the transient temperature after a power step. From the analysis of this signal, the thermal frequency response can be estimated, and consequently, compact thermal models may be extracted. We present a method to obtain an estimate of the time constant distribution underlying the observed transient. The method is based on an iterative deconvolution that produces an approximation to the time constant spectrum while preserving a convenient convolution form. This method is applied to the obtained thermal response of a microstructure as analyzed by finite element method as well as to the measured thermal response of a transistor array integrated circuit (IC) in a SMD package.
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:ofiedian lethal temperatures ( LT50' s ) were determined for rainbow trout, Salmo gairdnerii, acclimated for a minimum of 21 days at 5 c onstant temperatures between 4 and 20 0 C. and 2 diel temperature fluctuations ( sinewave curves of amplitudes ± 4 and ± 7 0 C. about a mean temperature of 12 0 C. ) . Twenty-four-, 48-, and 96-hour LT50 estimates were c alculated f ollowing standard flow-through aquatic bioassay techniques and probi t transformation of mortality data. The phenomenon of delayed thermal mortality was also investigated. Shifts in upper incipient lethal temperature occurred as a result of previous thermal conditioning. It was shown that increases in constant acclimation temperature result in proportional l inear increases in thermal tolerances. The increase i n estimated 96-hour LT50's was approximately 0.13 0 c. X 1 0 C:1 between 8 and 20 0 C. The effect of acclimation to both cyclic temperature regimes was an increase in LT50 to values between the mean and maximum constant equivalent daily temperatures of the cycles. Twenty-four-, 48-, and 96-hour LT50 estimates of both cycles corresponded approximately to the LT50 values of the 16 0 C. c onstant temperature equivalent . This increase i n thermal tolerance was further demonstrated by the delayed thermal mortality experiments . Cycle amplitudes appeared to i nfluence thermal resistance through alterations in initi al mortality since mortality patterns characteristic of base temperature acclimations re-appeared after approximately 68 hours exposure to test temperatures for the 12 + 4 0 C. group, whereas mortality patterns stabilized and remained constant for a period greater than 192 hours with the larger therma l cycle ( 12 + 7 0 C. ). NO s ignificant corre lations between s pecimen weight and time-to-death was apparent. Data are discussed in relation to the establishment of thermal criteria for important commercial and sport fishes , such as the salmonids , as is the question whether previously reported values on lethal temperature s may have been under estimated.
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A laser-induced photoacoustic technique was employed to investigate thermal transport through nanocrystalline CePO4 samples prepared via the sol–gel route. Evaluation of thermal diffusivity was carried out using the one-dimensional model of Rosencwaig and Gersho for the reflection configuration of the photoacoustic method. Structural analyses of samples revealed that they are nanoporous in nature, possessing micron-sized grains. Analysis of results shows that thermal diffusivity value varies with sintering temperature. Results are explained in terms of the variation in porosity with sintering temperature and the effects of various scattering mechanisms on the propagation of phonons through the nanoporous ceramic matrix. Further analyses confirm that apart from porosity, grain boundary resistance and interface thermal resistance influence the effective value of thermal diffusivity of the samples under investigation.
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This study investigates the utilisation of a simplified model in the transient analysis of a thermal cooling process. In such process the external thermal resistance between the surface and the surroundings is high compared to the system internal thermal resistance, so that the first controls the heat transfer process. In this case the Biot number is lower than 0.1. Aluminium reels were utilised, which, with proper internal instrumentation, furnished experimental results for the thermal cooling process. Based on experimental data, a simplified model for the determination of the process film coefficient was used. Subsequently, experimental and theoretical results were compared. The change of the airflow direction was also investigated for the cooling process, aiming at process time optimisation. (C) 2001 Elsevier B.V. Ltd.
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The stagnant effective thermal conductivities (K0) of sugar cane bagasse (SCB), wheat bran (WB), orange pulp and peel (OPP) and their combination (weight proportion 1:2:2 SCB/OPP/WB) were obtained using the line heat source method. These solid materials were applied to pectinase production via solid-state fermentation. The moisture content ranged from 4 to 80% (w.b.). A conduction mechanism through the porous media was observed, along with conduction through a liquid film and contact thermal resistance between the samples and the probe. K0 was low for intermediate moisture contents and approached the molecular conductivity of water for high moisture contents. © 2013 Copyright Taylor and Francis Group, LLC.
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Thermal characterization of Concentrating Photovoltaics (CPV) modules and Arrays is needed to determine their performance and modelling of energy forecast. Module-ambient thermal resistance is easily obtained from its definition but the cell-module thermal resistant needs to be estimated from indirect procedures, two of them are presented in this paper. In addition, an equivalent parameter is defined, the Concentrator Nominal Operating Module/Cell Temperature (CNOMT/CNOCT), the temperature at Concentrator Standard Operating Conditions (CSOC). Definitions and expression to relate (CNOMT/CNOCT) to thermal resistances are presented, plus several examples of estimations from real operating arrays.
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The use of vegetal systems in facades affects the reduction of the buildings' energy demand, the attenuation of the urban heat island (UHI) and the filtration of pollutants present in the air. Even so, up to now the knowledge about the effect of this type of systems on the thermal performance of insulated facades is limited. This article presents the results of an experimental study carried out in a vegetal facade located in a continental Mediterranean climate zone. The objective is to study the effect of a vegetal finishing, formed by plants and substrate, on the thermal-energy performance of an insulated facade under summer conditions. To this effect, the thermal data obtained from two full-scale experimental mock-ups of the same dimensions and composition of the enclosure and only different in the south facade's enclosure where one incorporates a vegetation layer are compared and analysed. The results show that, in spite of the high thermal resistance of the enclosure, the effect of the vegetation is very positive, particularly in the warmer hours of the day. Therefore, vegetal facades can be used as a passive cooling strategy, reducing the consumption of energy for refrigeration and improving the comfort conditions of the users. (C) 2014 Elsevier Ltd. All rights reserved.
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The geothermal regime of the western margin of the Great Bahama Bank was examined using the bottom hole temperature and thermal conductivity measurements obtained during and after Ocean Drilling Program (ODP) Leg 166. This study focuses on the data from the drilling transect of Sites 1003 through 1007. These data reveal two important observational characteristics. First, temperature vs. cumulative thermal resistance profiles from all the drill sites show significant curvature in the depth range of 40 to 100 mbsf. They tend to be of concave-upward shape. Second, the conductive background heat-flow values for these five drill sites, determined from deep, linear parts of the geothermal profiles, show a systematic variation along the drilling transect. Heat flow is 43-45 mW/m**2 on the seafloor away from the bank and decreases upslope to ~35 mW/m**2. We examine three mechanisms as potential causes for the curved geothermal profiles. They are: (1) a recent increase in sedimentation rate, (2) influx of seawater into shallow sediments, and (3) temporal fluctuation of the bottom water temperature (BWT). Our analysis shows that the first mechanism is negligible. The second mechanism may explain the data from Sites 1004 and 1005. The temperature profile of Site 1006 is most easily explained by the third mechanism. We reconstruct the history of BWT at this site by solving the inverse heat conduction problem. The inversion result indicates gradual warming throughout this century by ~1°C and is agreeable to other hydrographic and climatic data from the western subtropic Atlantic. However, data from Sites 1003 and 1007 do not seem to show such trends. Therefore, none of the three mechanisms tested here explain the observations from all the drill sites. As for the lateral variation of the background heat flow along the drill transect, we believe that much of it is caused by the thermal effect of the topographic variation. We model this effect by obtaining a two-dimensional analytical solution. The model suggests that the background heat flow of this area is ~43 mW/m**2, a value similar to the background heat flow determined for the Gulf of Mexico in the opposite side of the Florida carbonate platform.