Fatores que influenciam a formação da fase β-PbO2 em filmes eletrossintetizados galvanostaticamente sobre substrato de tecido de carbono

PbO2 films were electroformed onto carbon cloth substrates (twill woven type) in acid conditions using the nitrate precursor by changing the electrodeposition current density, temperature and pH, in order to optimize the formation of the β-PbO2 phase. The crystal structure and morphology of the PbO2 films were investigated using X-ray diffraction (XRD) and scanning electronic microscopy (SEM) techniques. The optimum conditions obtained for formation of the β-PbO2 were presented and discussed.

Electrodeposition of copper on titanium wires: Taguchi experimental design approach

Electrodeposition of thin copper layer was carried out on titanium wires in acidic sulphate bath. The influence of titanium surface preparation, cathodic current density, copper sulphate and sulphuric acid concentrations, electrical charge density and stirring of the solution on the adhesion of the electrodeposits was studied using the Taguchi statistical method. A L(16) orthogonal array with the six factors of control at two levels each and three interactions was employed. The analysis of variance of the mean adhesion response and signal-to-noise ratio showed the great influence of cathodic current density on adhesion. on the contrary, the other factors as well as the three investigated interactions revealed low or no significant effect. From this study optimized electrolysis conditions were defined. The copper electrocoating improved the electrical conductivity of the titanium wire. This shows that copper electrocoated titanium wires could be employed for both electrical purpose and mechanical reinforcement in superconducting magnets. (C) 2008 Elsevier B.V. All rights reserved.

Electrodeposition and characterization of Cu-Nb composite coatings

Copper coatings containing well-distributed Nb particles were obtained by co-electrodeposition in an acidic sulfate bath. Nb particle concentration in the bath was the most significant factor for the incorporation of Nb particles in copper, followed by stirring rate, whereas current density presented low significance. High Nb particle concentration and low stirring rate led to a higher incorporated Nb particle content. The microhardness of the composite layers was higher than that of pure copper deposits obtained under the same conditions due to copper matrix grain refinement and increased with the increase of both current density and incorporated Nb particle volume fraction. The corrosion resistance of Cu-Nb composites in 0.5 wt.% H(2)SO(4) solution at room temperature was higher than that of pure copper and increased with the increase of the Nb content. (C) 2010 Elsevier B.V. All rights reserved.

Co-electrodeposition and characterization of Cu-Si(3)N(4) composite coatings

Smooth copper coatings containing well-distributed silicon nitride particles were obtained by co-electrodeposition in acidic sulfate bath. The cathodic current density did not show significant influence on incorporated particle volume fraction, whereas the increase of particle concentration in the bath led to its decrease. The increase of stirring rate increased the amount of embedded particles. The microhardness of the composite layers was higher than that of pure copper deposits obtained under the same conditions due to dispersion-strengthening and copper matrix grain refinement and increased with the increase of incorporated particle volume fraction. The microhardness of composites also increased with the increase of current density due to copper matrix grain refining. The composite coatings presented higher strength but lower ductility than pure copper layers. Pure copper and composite coatings showed the same corrosion resistance in 0.5 wt.% H(2)SO(4) solution at room temperature. (C) 2011 Elsevier B.V. All rights reserved.

Quasi-two-dimensional electrodeposition under forced fluid flow

Experimental quasi-two-dimensional Zn electrodeposits are grown under forced convection conditions. Large-scale effects, with preferential growth towards the impinging flow, together with small-scale roughness suppression effects are evidenced and separately analyzed by using two different radial cell configurations. Interpretations are given in terms of primary concepts concerning current and concentration distributions.

Electrochemical study about zinc electrodeposition onto GCE and HOPG substrates

We carried out an electrochemical study about zinc electrodeposition onto GCE and HOPG substrates from an electrolytic plating bath containing 0.01M ZnSO4 + 1M (NH4)2SO4 at pH 7. Under our experimental conditions the predominant chemical species was the complex [ZnSO4(H2O)5]. The chronoamperometric study showed that zinc electrodeposition follows a typical 3D nucleation mechanism in both substrates. The average dG calculated for the stable nucleus formation was 6.92 x 10-21 J nuclei"1 and 1.35 x 10-20 J nuclei"1 for GCE and HOPG, respectively. The scanning electron microscopy (SEM) images showed different nucleation and growth processes on GCE and HOPG substrates at same overpotential.

Kinetical study about the cobalt electrodeposition onto polycrystalline platinum

An electrochemical study of Co electrodeposition onto polycrystalline Pt from an aqueous solution containing 10-2 M CoCl2 + 1 M NH4CI (pH = 9.3) was conducted at overpotential conditions. The current density transients showed two maxima that corresponded to two nucleation and growth processes. The entire transient behavior was adequately predicted considering the contribution to the total current of four different processes: a Langmuir-type adsorption process, a diffusion-controlled two-dimensional instantaneous nucleation, and two three-dimensional nucleation and growth processes.

Electrodeposition of copper on titanium wires: Taguchi experimental design approach

Electrodeposition of thin copper layer was carried out on titanium wires in acidic sulphate bath. The influence of titanium surface preparation, cathodic current density, copper sulphate and sulphuric acid concentrations, electrical charge density and stirring of the solution on the adhesion of the electrodeposits was studied using the Taguchi statistical method. A L(16) orthogonal array with the six factors of control at two levels each and three interactions was employed. The analysis of variance of the mean adhesion response and signal-to-noise ratio showed the great influence of cathodic current density on adhesion. on the contrary, the other factors as well as the three investigated interactions revealed low or no significant effect. From this study optimized electrolysis conditions were defined. The copper electrocoating improved the electrical conductivity of the titanium wire. This shows that copper electrocoated titanium wires could be employed for both electrical purpose and mechanical reinforcement in superconducting magnets. (C) 2008 Elsevier B.V. All rights reserved.

Preparation of Fe-Cr-P-Co amorphous alloys by electrodeposition

The effects of bath composition and electroplating conditions on structure, morphology, and composition of amorphous Fe-Cr-P-Co deposits on AISI 1020 steel substrate, priorly plated with a thin Cu deposit, were investigated. The increase of charge density activates the inclusion of Cr in the deposit. However, above specific values of the charge density, which depend on the deposition current density, the Cr content in the deposit decreases. This Cr content decreasing is probably due to the significant hydrogen evolution with the increasing of deposition cur-rent and charge density. The effect of charge density on the content of Fe and Co is not clear. However, there is a tendency of increasing of Fe content and decreasing of Co content with the raising of current density. The Co is more easily deposited than the P, and its presence results in a more intense inhibition effect on the Cr deposition than the inhibition effect caused by P presence. Scanning electron microscope (SEM) analysis showed that Co increasing in the Fe-Cr-P-Co alloys analyzed does not promote the susceptibility to microcracks, which led to a good quality deposit. The passive film of the Fe-Cr-P-Co alloy shows a high ability formation and high protective capacity, and the results obtained by current density of corrosion, j(cor), show that the deposit with addition of Co, Fe31Cr11P28Co30, presents a higher corrosion resistance than the deposit with addition of Ni, Fe54Cr21P20Ni5. (C) 2004 Published by Elsevier B.V.

Electrodeposition of amorphous Fe-Cr-P-Ni-C alloys. Morphological and structural characteristics

The effect of bath composition and electroplating conditions on structure, morphology and composition of amorphous Fe-Cr-P-Ni-C deposits on Cu substrate was investigated. The deposition efficiency of Fe-Ni-P-C alloy increased significantly with the addition of formic acid, but decreased with the addition of Cr to the plating bath. The increase of charge density activates the inclusion of Cr in the deposit. However, above a specific value of charge density, which depends on deposition current density, the Cr content in the deposit decreases. SEM analysis showed that the increase of Ni, Cr or charge deposition promotes susceptibility to microcracking.

Solid electrolytes for electrochromic devices based on reversible metal electrodeposition

Air conditioning and lighting costs can be reduced substantially by changing the optical properties of "intelligent windows." The electrochromic devices studied to date have used copper as an additive. Copper, used here as an electrochromic material, was dissolved in an aqueous animal protein-derived gel electrolyte. This combination constitutes the electrochromic system for reversible electrodeposition. Cyclic voltammetry, chronoamperometric and chromogenic analyses indicated that were obtained good conditions of transparency (initial transmittance of 70%), optical reversibility, small potential window (2.1 V), variation of transmittance in visible light (63.6%) and near infrared (20%) spectral regions. Permanence in the darkened state was achieved by maintaining a lower pulse potential (-0.16 V) than the deposition potential (-1.0 V). Increasing the number of deposition and dissolution cycles favored the transmittance and photoelectrochemical reversibility of the device. The conductivity of the electrolyte (10(-3) S/cm) at several concentrations of CuCl2 was determined by electrochemical impedance spectroscopy. A thermogravimetric analysis confirmed the good thermal stability of the electrolyte, since the mass loss detected up to 100 degrees C corresponded to water evaporation and decomposition of the gel started only at 200 degrees C. Micrographic and small angle X-ray scattering analyses indicated the formation of a persistent deposit of copper particles on the ITO. (C) 2012 Elsevier B.V. All rights reserved.

The Electrodeposition of Iron-Manganese Alloys

Various electrolytes were experimented with in an attempt to deposit an iron-manganese alloy. An Alloy was obtained from a solution containing ferrous ammonium sulfate, manganous sulfate, and ammonium sulfate. Further experimentation was done in an effort to determine the optimum conditions of deposition and the highest manganese alloy which could be produced.

The Electrodeposition of Iron-Manganese Alloys

An electrodeposition of an iron-manganese alloy was made from the same conditions determined by previous re­search. Various addition agents were experimented with in an attempt to produce better conditions for electro-deposition. It was found advantageous to add small a­mounts of sodium lauryl sulfate and ammonium sulfite to the electrolyte.

Remote Control Electrodeposition: Patterning on Substrates without Direct Electrical Connections

Thesis (Ph.D.)--University of Washington, 2016-06

Electrodeposition of composite copper/liquid-containing microcapsule coatings

This paper presents results on the preparation of microcapsules containing liquid organosilica, and their co-deposition with copper in an acidic copper electrolyte onto a carbon steel cathode to form a copper/microcapsule composite coating. Microscopic analyses of the surface and the cross-section of the coating confirm the incorporation of the liquid-containing microcapsules in the coating layer. The influence of microcapsules in the electrolyte on the cathode polarization, as well as that of process conditions on the microcapsule inclusion, is also discussed. (C) 2004 Kluwer Academic Publishers.