Development of heat sink device by using topology optimization

Small scale fluid flow systems have been studied for various applications, such as chemical reagent dosages and cooling devices of compact electronic components. This work proposes to present the complete cycle development of an optimized heat sink designed by using Topology Optimization Method (TOM) for best performance, including minimization of pressure drop in fluid flow and maximization of heat dissipation effects, aiming small scale applications. The TOM is applied to a domain, to obtain an optimized channel topology, according to a given multi-objective function that combines pressure drop minimization and heat transfer maximization. Stokes flow hypothesis is adopted. Moreover, both conduction and forced convection effects are included in the steady-state heat transfer model. The topology optimization procedure combines the Finite Element Method (to carry out the physical analysis) with Sequential Linear Programming (as the optimization algorithm). Two-dimensional topology optimization results of channel layouts obtained for a heat sink design are presented as example to illustrate the design methodology. 3D computational simulations and prototype manufacturing have been carried out to validate the proposed design methodology.

Microchannel heat exchangers: An attractive option for the regenerator of a mobile orc waste heat recovery system

The performance of microchannel heat exchangers was assessed in gas-to-liquid applications in the order of several tens of kWth . The technology is suitable for exhaust heat recovery systems based on organic Rankine cycle. In order to design a light and compact microchannel heat exchanger, an optimization process is developed. The model employed in the procedure is validated through computational fluid-dynamics analysis with commercial software. It is shown that conjugate effects have a significant impact on the heat transfer performance of the device.

Preliminary analysis of the capabilities of a composite slab for an advanced heat-sink design /

"January 1961."

Experimental and Numerical Analysis of Gas Forced Convection through Microtubes and Micro Heat Exchangers

The last decade has witnessed very fast development in microfabrication technologies. The increasing industrial applications of microfluidic systems call for more intensive and systematic knowledge on this newly emerging field. Especially for gaseous flow and heat transfer at microscale, the applicability of conventional theories developed at macro scale is not yet completely validated; this is mainly due to scarce experimental data available in literature for gas flows. The objective of this thesis is to investigate these unclear elements by analyzing forced convection for gaseous flows through microtubes and micro heat exchangers. Experimental tests have been performed with microtubes having various inner diameters, namely 750 m, 510 m and 170 m, over a wide range of Reynolds number covering the laminar region, the transitional zone and also the onset region of the turbulent regime. The results show that conventional theory is able to predict the flow friction factor when flow compressibility does not appear and the effect of fluid temperature-dependent properties is insignificant. A double-layered microchannel heat exchanger has been designed in order to study experimentally the efficiency of a gas-to-gas micro heat exchanger. This microdevice contains 133 parallel microchannels machined into polished PEEK plates for both the hot side and the cold side. The microchannels are 200 µm high, 200 µm wide and 39.8 mm long. The design of the micro device has been made in order to be able to test different materials as partition foil with flexible thickness. Experimental tests have been carried out for five different partition foils, with various mass flow rates and flow configurations. The experimental results indicate that the thermal performance of the countercurrent and cross flow micro heat exchanger can be strongly influenced by axial conduction in the partition foil separating the hot gas flow and cold gas flow.

Experimental and analytical study of the effect of contact angle on liquid convective heat transfer in microchannels

In this paper we examine the effect of contact angle (or surface wettability) on the convective heat transfer coefficient in microchannels. Slip flow, where the fluid velocity at the wall is non-zero, is most likely to occur in microchannels due to its dependence on shear rate or wall shear stress. We show analytically that for a constant pressure drop, the presence of slip increases the Nusselt number. In a microchannel heat exchanger we modified the surface wettability from a contact angle of 20 degrees-120 degrees using thin film coating technology. Apparent slip flow is implied from pressure and flow rate measurements with a departure from classical laminar friction coefficients above a critical shear rate of approximately 10,000 s(-1). The magnitude of this departure is dependant on the contact angle with higher contact angles surfaces exhibiting larger pressure drop decreases. Similarly, the non-dimensional heat flux is found to decrease relative to laminar non-slip theory, and this decrease is also a function of the contact angle. Depending on the contact angle and the wall shear rate, variations in the heat transfer rate exceeding 10% can be expected. Thus the contact angle is an important consideration in the design of micro, and even more so, nano heat exchangers. (c) 2006 Elsevier Ltd. All rights reserved.

Surrogate-based analysis and optimization for the design of heat sinks with jet impingement

Heat sinks are widely used for cooling electronic devices and systems. Their thermal performance is usually determined by the material, shape, and size of the heat sink. With the assistance of computational fluid dynamics (CFD) and surrogate-based optimization, heat sinks can be designed and optimized to achieve a high level of performance. In this paper, the design and optimization of a plate-fin-type heat sink cooled by impingement jet is presented. The flow and thermal fields are simulated using the CFD simulation; the thermal resistance of the heat sink is then estimated. A Kriging surrogate model is developed to approximate the objective function (thermal resistance) as a function of design variables. Surrogate-based optimization is implemented by adaptively adding infill points based on an integrated strategy of the minimum value, the maximum mean square error approach, and the expected improvement approaches. The results show the influence of design variables on the thermal resistance and give the optimal heat sink with lowest thermal resistance for given jet impingement conditions.

Embedded heat pipes in cofired ceramic substrates for enhanced thermal management of electronics

A novel and new thermal management technology for advanced ceramic microelectronic packages has been developed incorporating miniature heat pipes embedded in the ceramic substrate. The heat pipes use an axially grooved wick structure and water as the working fluid. Prototype substrate/heat pipe systems were fabricated using high temperature co-fired ceramic (alumina). The heat pipes were nominally 81 mm in length, 10 mm in width, and 4 mm in height, and were charged with approximately 50–80 μL of water. Platinum thick film heaters were fabricated on the surface of the substrate to simulate heat dissipating electronic components. Several thermocouples were affixed to the substrate to monitor temperature. One end of the substrate was affixed to a heat sink maintained at constant temperature. The prototypes were tested and shown to successful and reliably operate with thermal loads over 20 Watts, with thermal input from single and multiple sources along the surface of the substrate. Temperature distributions are discussed for the various configurations and the effective thermal resistance of the substrate/heat pipe system is calculated. Finite element analysis was used to support the experimental findings and better understand the sources of the system's thermal resistance. ^

Numerical investigation on the heat transfer enhancement using micro/nano phase-change particulate flow

The introduction of phase change material fluid and nanofluid in micro-channel heat sink design can significantly increase the cooling capacity of the heat sink because of the unique features of these two kinds of fluids. To better assist the design of a high performance micro-channel heat sink using phase change fluid and nanofluid, the heat transfer enhancement mechanism behind the flow with such fluids must be completely understood. ^ A detailed parametric study is conducted to further investigate the heat transfer enhancement of the phase change material particle suspension flow, by using the two-phase non-thermal-equilibrium model developed by Hao and Tao (2004). The parametric study is conducted under normal conditions with Reynolds numbers of Re = 90–600 and phase change material particle concentrations of ϵp ≤ 0.25, as well as extreme conditions of very low Reynolds numbers (Re < 50) and high phase change material particle concentration (ϵp = 50%–70%) slurry flow. By using the two newly-defined parameters, named effectiveness factor ϵeff and performance index PI, respectively, it is found that there exists an optimal relation between the channel design parameters L and D, particle volume fraction ϵp, Reynolds number Re, and the wall heat flux qw. The influence of the particle volume fraction ϵp, particle size dp, and the particle viscosity μ p, to the phase change material suspension flow, are investigated and discussed. The model was validated by available experimental data. The conclusions will assist designers in making their decisions that relate to the design or selection of a micro-pump suitable for micro or mini scale heat transfer devices. ^ To understand the heat transfer enhancement mechanism of the nanofluid flow from the particle level, the lattice Boltzmann method is used because of its mesoscopic feature and its many numerical advantages. By using a two-component lattice Boltzmann model, the heat transfer enhancement of the nanofluid is analyzed, through incorporating the different forces acting on the nanoparticles to the two-component lattice Boltzmann model. It is found that the nanofluid has better heat transfer enhancement at low Reynolds numbers, and the Brownian motion effect of the nanoparticles will be weakened by the increase of flow speed. ^

Embedded Heat Pipes in Cofired Ceramic Substrates for Enhanced Thermal Management of Electronics

A novel and new thermal management technology for advanced ceramic microelectronic packages has been developed incorporating miniature heat pipes embedded in the ceramic substrate. The heat pipes use an axially grooved wick structure and water as the working fluid. Prototype substrate/heat pipe systems were fabricated using high temperature co-fired ceramic (alumina). The heat pipes were nominally 81 mm in length, 10 mm in width, and 4 mm in height, and were charged with approximately 50-80 mL of water. Platinum thick film heaters were fabricated on the surface of the substrate to simulate heat dissipating electronic components. Several thermocouples were affixed to the substrate to monitor temperature. One end of the substrate was affixed to a heat sink maintained at constant temperature. The prototypes were tested and shown to successful and reliably operate with thermal loads over 20 Watts, with thermal input from single and multiple sources along the surface of the substrate. Temperature distributions are discussed for the various configurations and the effective thermal resistance of the substrate/heat pipe system is calculated. Finite element analysis was used to support the experimental findings and better understand the sources of the system's thermal resistance.

Design and analysis of micro-channel heat-exchanger embedded in Low Temperature Co-fire Ceramic (LTCC)

Increased device density, switching speeds of integrated circuits and decrease in package size is placing new demands for high power thermal-management. The convectional method of forced air cooling with passive heat sink can handle heat fluxes up-to 3-5W/cm2; however current microprocessors are operating at levels of 100W/cm2, This demands the usage of novel thermal-management systems. In this work, water-cooling systems with active heat sink are embedded in the substrate. The research involved fabricating LTCC substrates of various configurations - an open-duct substrate, the second with thermal vias and the third with thermal vias and free-standing metal columns and metal foil. Thermal testing was performed experimentally and these results are compared with CFD results. An overall thermal resistance for the base substrate is demonstrated to be 3.4oC/W-cm2. Addition of thermal vias reduces the effective resistance of the system by 7times and further addition of free standing columns reduced it by 20times.

Numerical Investigation on the Heat Transfer Enhancement Using Micro/Nano Phase-Change Particulate Flow

The introduction of phase change material fluid and nanofluid in micro-channel heat sink design can significantly increase the cooling capacity of the heat sink because of the unique features of these two kinds of fluids. To better assist the design of a high performance micro-channel heat sink using phase change fluid and nanofluid, the heat transfer enhancement mechanism behind the flow with such fluids must be completely understood. A detailed parametric study is conducted to further investigate the heat transfer enhancement of the phase change material particle suspension flow, by using the two-phase non-thermal-equilibrium model developed by Hao and Tao (2004). The parametric study is conducted under normal conditions with Reynolds numbers of Re=600-900 and phase change material particle concentrations ¡Ü0.25 , as well as extreme conditions of very low Reynolds numbers (Re < 50) and high phase change material particle concentration (0.5-0.7) slurry flow. By using the two newly-defined parameters, named effectiveness factor and performance index, respectively, it is found that there exists an optimal relation between the channel design parameters, particle volume fraction, Reynolds number, and the wall heat flux. The influence of the particle volume fraction, particle size, and the particle viscosity, to the phase change material suspension flow, are investigated and discussed. The model was validated by available experimental data. The conclusions will assist designers in making their decisions that relate to the design or selection of a micro-pump suitable for micro or mini scale heat transfer devices. To understand the heat transfer enhancement mechanism of the nanofluid flow from the particle level, the lattice Boltzmann method is used because of its mesoscopic feature and its many numerical advantages. By using a two-component lattice Boltzmann model, the heat transfer enhancement of the nanofluid is analyzed, through incorporating the different forces acting on the nanoparticles to the two-component lattice Boltzmann model. It is found that the nanofluid has better heat transfer enhancement at low Reynolds numbers, and the Brownian motion effect of the nanoparticles will be weakened by the increase of flow speed.

AIR SIDE HEAT TRANSFER ENHANCEMENT IN HEAT EXCHANGERS UTILIZING INNOVATIVE DESIGNS AND THE ADDITIVE MANUFACTURING TECHNIQUE

Over the last decade, rapid development of additive manufacturing techniques has allowed the fabrication of innovative and complex designs. One field that can benefit from such technology is heat exchanger fabrication, as heat exchanger design has become more and more complex due to the demand for higher performance particularly on the air side of the heat exchanger. By employing the additive manufacturing, a heat exchanger design was successfully realized, which otherwise would have been very difficult to fabricate using conventional fabrication technologies. In this dissertation, additive manufacturing technique was implemented to fabricate an advanced design which focused on a combination of heat transfer surface and fluid distribution system. Although the application selected in this dissertation is focused on power plant dry cooling applications, the results of this study can directly and indirectly benefit other sectors as well, as the air-side is often the limiting side for in liquid or single phase cooling applications. Two heat exchanger designs were studied. One was an advanced metallic heat exchanger based on manifold-microchannel technology and the other was a polymer heat exchanger based on utilization of prime surface technology. Polymer heat exchangers offer several advantages over metals such as antifouling, anticorrosion, lightweight and often less expensive than comparable metallic heat exchangers. A numerical modeling and optimization were performed to calculate a design that yield an optimum performance. The optimization results show that significant performance enhancement is noted compared to the conventional heat exchangers like wavy fins and plain plate fins. Thereafter, both heat exchangers were scaled down and fabricated using additive manufacturing and experimentally tested. The manifold-micro channel design demonstrated that despite some fabrication inaccuracies, compared to a conventional wavy-fin surface, 15% - 50% increase in heat transfer coefficient was possible for the same pressure drop value. In addition, if the fabrication inaccuracy can be eliminated, an even larger performance enhancement is predicted. Since metal based additive manufacturing is still in the developmental stage, it is anticipated that with further refinement of the manufacturing process in future designs, the fabrication accuracy can be improved. For the polymer heat exchanger, by fabricating a very thin wall heat exchanger (150μm), the wall thermal resistance, which usually becomes the limiting side for polymer heat exchanger, was calculated to account for only up to 3% of the total thermal resistance. A comparison of air-side heat transfer coefficient of the polymer heat exchanger with some of the commercially available plain plate fin surface heat exchangers show that polymer heat exchanger performance is equal or superior to plain plate fin surfaces. This shows the promising potential for polymer heat exchangers to compete with conventional metallic heat exchangers when an additive manufacturing-enabled fabrication is utilized. Major contributions of this study are as follows: (1) For the first time demonstrated the potential of additive manufacturing in metal printing of heat exchangers that benefit from a sophisticated design to yield a performance substantially above the respective conventional systems. Such heat exchangers cannot be fabricated with the conventional fabrication techniques. (2) For the first time demonstrated the potential of additive manufacturing to produce polymer heat exchangers that by design minimize the role of thermal conductivity and deliver a thermal performance equal or better that their respective metallic heat exchangers. In addition of other advantages of polymer over metal like antifouling, anticorrosion, and lightweight. Details of the work are documented in respective chapters of this thesis.

Increasing the value of household appliances by adding a heat pump system

Historically, domestic tasks such as preparing food and washing and drying clothes and dishes were done by hand. In a modern home many of these chores are taken care of by machines such as washing machines, dishwashers and tumble dryers. When the first such machines came on the market customers were happy that they worked at all! Today, the costs of electricity and customers’ environmental awareness are high, so features such as low electricity, water and detergent use strongly influence which household machine the customer will buy. One way to achieve lower electricity usage for the tumble dryer and the dishwasher is to add a heat pump system. The function of a heat pump system is to extract heat from a lower temperature source (heat source) and reject it to a higher temperature sink (heat sink) at a higher temperature level. Heat pump systems have been used for a long time in refrigerators and freezers, and that industry has driven the development of small, high quality, low price heat pump components. The low price of good quality heat pump components, along with an increased willingness to pay extra for lower electricity usage and environmental impact, make it possible to introduce heat pump systems in other household products. However, there is a high risk of failure with new features. A number of household manufacturers no longer exist because they introduced poorly implemented new features, which resulted in low quality and product performance. A manufacturer must predict whether the future value of a feature is high enough for the customer chain to pay for it. The challenge for the manufacturer is to develop and produce a high-performance heat pump feature in a household product with high quality, predict future willingness to pay for it, and launch it at the right moment in order to succeed. Tumble dryers with heat pump systems have been on the market since 2000. Paper I reports on the development of a transient simulation model of a commercial heat pump tumble dryer. The measured and simulated results were compared with good similarity. The influence of the size of the compressor and the condenser was investigated using the validated simulation model. The results from the simulation model show that increasing the cylinder volume of the compressor by 50% decreases the drying time by 14% without using more electricity.  Paper II is a concept study of adding a heat pump system to a dishwasher in order to decrease the total electricity usage. The dishwasher, dishware and water are heated by the condenser, and the evaporator absorbs the heat from a water tank. The majority of the heat transfer to the evaporator occurs when ice is generated in the water tank. An experimental setup and a transient simulation model of a heat pump dishwasher were developed. The simulation results show a 24% reduction in electricity use compared to a conventional dishwasher heated with an electric element. The simulation model was based on an experimental setup that was not optimised. During the study it became apparent that it is possible to decrease electricity usage even more with the next experimental setup.

Experimental and Numerical Analysis of Gas Flows in Microchannels and Micro Heat Exchanger

Due to increased interest in miniaturization, great attention has been given in the recent decade to the micro heat exchanging systems. Literature survey suggests that there is still a limited understanding of gas flows in micro heat exchanging systems. The aim of the current thesis is to further the understanding of fluid flow and heat transfer phenomenon inside such geometries when a compressible working fluid is utilized. A combined experimental and numerical approach has been utilized in order to overcome the lack of employable sensors for micro dimensional channels. After conducting a detailed comparison between various data reduction methodologies employed in the literature, the best suited methodology for gas microflow experimentalists is proposed. A transitional turbulence model is extensively validated against the experimental results of the microtubes and microchannels under adiabatic wall conditions. Heat transfer analysis of single microtubes showed that when the compressible working fluid is used, Nusselt number results are in partial disagreement with the conventional theory at highly turbulent flow regime for microtubes having a hydraulic diameter less than 250 microns. Experimental and numerical analysis on a prototype double layer microchannel heat exchanger showed that compressibility is detrimental to the thermal performance. It has been found that compressibility effects for micro heat exchangers are significant when the average Mach number at the outlet of the microchannel is greater than 0.1 compared to the adiabatic limit of 0.3. Lastly, to avoid a staggering amount of the computational power needed to simulate the micro heat exchanging systems with hundreds of microchannels, a reduced order model based on the porous medium has been developed that considers the compressibility of the gas inside microchannels. The validation of the proposed model against experimental results of average thermal effectiveness and the pressure loss showed an excellent match between the two.

Komponenttien lämpöteknisten parametrien karakterisointilaitteiston suunnittelu ja toteutus

Elektroniikan pienentyessä ja tehotiheyden kasvaessa tarvitaan paremmin suunniteltuja jäähdytysjärjestelyjä. Suunnittelun apuna voidaan käyttää perinteisiä lämmönsiirtoyhtälöitä, virtauslaskentaa ja mittauksia. Tässä työssä on suunniteltu ja rakennettu mittauslaitteisto nimenomaan elektroniikan komponenttien ja jäähdytyselementtien lämpötilojen ja painehäviöiden mittaamiseen. Koeajona laitteistolla on mitattu jäähdytyselementin lämpötilajakauma kahdella eri virtausnopeudella ja lämpötilalla sekä verrattu niitä aikaisemmin mitattuihin tapauksiin sekä Fluent- virtauslaskentaohjelmalla laskettuihin tuloksiin.