The foundations of a new approach to additive manufacturing: Characteristics of free space metal deposition

In this paper, we report on the realisation of a free space deposition process (FSD). For the first time the use of a moving support structure to deposit tracks of metal starting from a substrate and extending into free space is characterised. The ability to write metal shapes in free space has wide ranging applications in additive manufacturing and rapid prototyping where the tracks can be layered to build overhanging features without the use of fixed support structures (such as is used in selective laser melting (SLM) and stereo lithography (SLA)). We demonstrate and perform a preliminary characterisation of the process in which a soldering iron was used to deposit lead free solder tracks. The factors affecting the stability of tracks and the effect of operating parameters, temperature, velocity, initial track starting diameter and starting volume were measured. A series of 10 tracks at each setting were compared with a control group of tracks; the track width, taper and variation between tracks were compared. Notable results in free space track deposition were that the initial track diameter and volume affected the repeatability and quality of tracks. The standard deviation of mean track width of tracks from the constrained initial diameter group were half that of the unconstrained group. The amount of material fed to the soldering iron before commencing deposition affected the taper of tracks. At an initial volume of 7 mm3 and an initial track diameter of 0.8 mm, none of the ten tracks deposited broke or showed taper > ∼1°. The maximum deposition velocity for free space track deposition using lead-free solder was limited to 1.5 mm s-1. © 2011 Elsevier B.V. All rights reserved.

Electronic device with self-aligned electrodes fabricated using additive liquid deposition

The invention provides a multilayer electronic device having electrodes, formed on a laterally extending first layer, the lateral position of each of at least two adjacent electrodes being defined by a channel in the first layer. Each channel is adjacent a deposition region, the material which forms each electrode substantially covering the deposition region to form a continuous conductive structure.

The role of damping in steel pan manufacture

Results are presented of systematic studies of vibration damping in steel of a type, and processed by a route, rel-evant to Caribbean steel pans. Damping is likely to be a significant factor in the variation of sound quality be-tween different pans. The main stages in pan manufac-ture are simulated in a controlled manner using sheet steel, cold-rolled to a prescribed level of thickness reduc-tion then annealed at a chosen temperature in a laboratory furnace. Small test strips were cut from the resulting material, and tested in free-free beam bending to deduce the Young’s modulus and its associated loss factor. It is shown that the steel type, the degree of cold working and the annealing temperature all have a significant influence on damping. Furthermore, for each individual specimen damping is found to decrease with rising frequency, ap-proximately following a power law. Comparison with samples cut from a real pan show that there are further influences from the pan’s geometrical details.

ELECTROCHEMICAL DEPOSITION OF MAGNESIUM IN ETHEREAL GRIGNARD SALT SOLUTION WITH IONIC LIQUID ADDITIVE

The electrochemical deposition of magnesium was investigated in ethereal Grignard salt solution with tetraethylammonium bistrifluoro-methanesulfonimidate additive, using cyclic voltammetry, potentiostatic transients, and scanning electron microscope measurements. The voltammograms showed the presence of reduction and oxidation peaks associated with the deposition and dissolution of magnesium. From the analysis of the experimental current transients, it was shown that the magnesium deposition process was characterized as a three-dimensional nucleation. The deposited product obtained from potentiostatic reduction presented a generally uniform and dense film.

Selective oxidation of m-phenoxytoluene to m-phenoxybenzaldehyde with methanol as an additive in acetic acid

With addition of methanol in acetic acid solvent, m-phenoxytoluene could be oxidized to m-phenoxybenzaldehyde selectively by a cobalt bromide catalyst. Paratemters such as the ratio of Co/Br and the reaction time of m-phenoxytoluene oxidation as well as visible spectra of cobalt bromide in acetic acid/methanol solvents, were also investigated. Addition of methanol caused the oxidation of aldehydes to proceed more slowly than it did solely in acetic acid solvent. The decrease of cobaltous-multibromides in acetic acid/methanol solvents was responsible for the improvement in the selective oxidation of m-phenoxytoluene. (C) 1999 Elsevier Science B.V. All rights reserved.

The effect of tungsten additive on the surface characteristics of amorphous Ni-P alloy

The variation of surface compositions on amorphous Ni80.4W1.5P18.1 alloy by O-2 oxidation and H-2 reduction treatments have been studied by XPS, UPS and ISS. It shows that addition of tungsten in the amorphous Ni-P alloy leads to dramatic changes of the relating component distributions in the surface layers before and after these treatments. Oxidation of a Ni80.4W1.5P18.1 amorphous alloy in 1 bar of oxygen at 513 K caused a significant segregation of nickel in different oxide states at the surface. The subsequent reduction of the oxidized surface with I bar hydrogen at 553 K resulted in only a small portion of Ni and P being reduced into elemental states, while most of them was found to combine to form a kind of nickel phosphate compound. On the other hand, under the same conditions, the oxidation and reduction of a Ni80P20 alloy gave rise to metallic Ni and elemental P as the predominate species on the alloy surface. The addition of W in the amorphous alloy might act as nuclei for a favorable formation of the phosphate structure which was proposed to be an active species for hydrogen-relating catalytic reactions. (C) 1999 Elsevier Science B.V. All rights reserved.