Telemetría de vehículos FSAE con microcontrolador PIC32 y transceptor de radio CC1101

Quizás el campo de las telecomunicaciones sea uno de los campos en el que más se ha progresado en este último siglo y medio, con la ayuda de otros campos de la ciencia y la técnica tales como la computación, la física electrónica, y un gran número de disciplinas, que se han utilizado estos últimos 150 años en conjunción para mejorarse unas con la ayuda de otras. Por ejemplo, la química ayuda a comprender y mejorar campos como la medicina, que también a su vez se ve mejorada por los progresos en la electrónica creados por los físicos y químicos, que poseen herramientas más potentes para calcular y simular debido a los progresos computacionales. Otro de los campos que ha sufrido un gran avance en este último siglo es el de la automoción, aunque estancados en el motor de combustión, los vehículos han sufrido enormes cambios debido a la irrupción de los avances en la electrónica del automóvil con multitud de sistemas ya ampliamente integrados en los vehículos actuales. La Formula SAE® o Formula Student es una competición de diseño, organizada por la SAE International (Society of Automotive Engineers) para estudiantes de universidades de todo el mundo que promueve la ingeniería a través de una competición donde los miembros del equipo diseñan, construyen, desarrollan y compiten en un pequeño y potente monoplaza. En el ámbito educativo, evitando el sistema tradicional de clases magistrales, se introducen cambios en las metodologías de enseñanza y surge el proyecto de la Fórmula Student para lograr una mejora en las acciones formativas, que permitan ir incorporando nuevos objetivos y diseñar nuevas situaciones de aprendizaje que supongan una oportunidad para el desarrollo de competencias de los alumnos, mejorar su formación como ingenieros y contrastar sus progresos compitiendo con las mejores universidades del mundo. En este proyecto se pretende dotar a los alumnos de las escuelas de ingeniería de la UPM que desarrollan el vehículo de FSAE de una herramienta de telemetría con la que evaluar y probar comportamiento del vehículo de FSAE junto con sus subsistemas que ellos mismos diseñan, con el objetivo de evaluar el comportamiento, introducir mejoras, analizar resultados de una manera más rápida y cómoda, con el objetivo de poder progresar más rápidamente en su desarrollo, recibiendo y almacenando una realimentación directa e instantánea del funcionamiento mediante la lectura de los datos que circulan por el bus CAN del vehículo. También ofrece la posibilidad de inyectar datos a los sistemas conectados al bus CAN de manera remota. Se engloba en el conjunto de proyectos de la FSAE, más concretamente en los basados en la plataforma PIC32 y propone una solución conjunta con otros proyectos o también por sí sola. Para la ejecución del proyecto se fabricó una placa compuesta de dos placas de circuito impreso, la de la estación base que envía comandos, instrucciones y datos para inyectar en el bus CAN del vehículo mediante radiofrecuencia y la placa que incorpora el vehículo que envía las tramas que circulan por el bus CAN del vehículo con los identificadores deseados, ejecuta los comandos recibidos por radiofrecuencia y salva las tramas CAN en una memoria USB o SD Card. Las dos PCBs constituyen el hardware del proyecto. El software se compone de dos programas. Un programa para la PCB del vehículo que emite los datos a la estación base, codificado en lenguaje C con ayuda del entorno de desarrollo MPLAB de Microchip. El otro programa hecho con LabView para la PCB de la estación base que recibe los datos provenientes del vehículo y los interpreta. Se propone un hardware y una capa o funciones de software para los microcontroladores PIC32 (similar al de otros proyectos del FSAE) para la transmisión de las tramas del bus CAN del vehículo de manera inalámbrica a una estación base, capaz de insertar tramas en el bus CAN del vehículo enviadas desde la estación base. También almacena estas tramas CAN en un dispositivo USB o SD Card situado en el vehículo. Para la transmisión de los datos se hizo un estudio de las frecuencias de transmisión, la legislación aplicable y los tipos de transceptores. Se optó por utilizar la banda de radiofrecuencia de uso común ISM de 433MHz mediante el transceptor integrado CC110L de Texas Instruments altamente configurable y con interfaz SPI. Se adquirieron dos parejas de módulos compatibles, con amplificador de potencia o sin él. LabView controla la estación que recoge las tramas CAN vía RF y está dotada del mismo transceptor de radio junto con un puente de comunicaciones SPI-USB, al que se puede acceder de dos diferentes maneras, mediante librerías dll, o mediante NI-VISA con transferencias RAW-USB. La aplicación desarrollada posee una interfaz configurable por el usuario para la muestra de los futuros sensores o actuadores que se incorporen en el vehículo y es capaz de interpretar las tramas CAN, mostrarlas, gráfica, numéricamente y almacenar esta información, como si fuera el cuadro de instrumentos del vehículo. Existe una limitación de la velocidad global del sistema en forma de cuello de botella que se crea debido a las limitaciones del transceptor CC110L por lo que si no se desea filtrar los datos que se crean necesarios, sería necesario aumentar el número de canales de radio para altas ocupaciones del bus CAN. Debido a la pérdida de relaciones con el INSIA, no se pudo probar de manera real en el propio vehículo, pero se hicieron pruebas satisfactorias (hasta 1,6 km) con una configuración de tramas CAN estándar a una velocidad de transmisión de 1 Mbit/s y un tiempo de bit de 1 microsegundo. El periférico CAN del PIC32 se programará para cumplir con estas especificaciones de la ECU del vehículo, que se presupone que es la MS3 Sport de Bosch, de la que LabView interpretará las tramas CAN recibidas de manera inalámbrica. Para poder probar el sistema, ha sido necesario reutilizar el hardware y adaptar el software del primer prototipo creado, que emite tramas CAN preprogramadas con una latencia también programable y que simulará al bus CAN proporcionando los datos a transmitir por el sistema que incorpora el vehículo. Durante el desarrollo de este proyecto, en las etapas finales, el fabricante del puente de comunicaciones SPI-USB MCP2210 liberó una librería (dll) compatible y sin errores, por lo que se nos ofrecía una oportunidad interesante para la comparación de las velocidades de acceso al transceptor de radio, que se presuponía y se comprobó más eficiente que la solución ya hecha mediante NI-VISA. ABSTRACT. The Formula SAE competition is an international university applied to technological innovation in vehicles racing type formula, in which each team, made up of students, should design, construct and test a prototype each year within certain rules. The challenge of FSAE is that it is an educational project farther away than a master class. The goal of the present project is to make a tool for other students to use it in his projects related to FSAE to test and improve the vehicle, and, the improvements that can be provided by the electronics could be materialized in a victory and win the competition with this competitive advantage. A telemetry system was developed. It sends the data provided by the car’s CAN bus through a radio frequency transceiver and receive commands to execute on the system, it provides by a base station on the ground. Moreover, constant verification in real time of the status of the car or data parameters like the revolutions per minute, pressure from collectors, water temperature, and so on, can be accessed from the base station on the ground, so that, it could be possible to study the behaviour of the vehicle in early phases of the car development. A printed circuit board, composed of two boards, and two software programs in two different languages, have been developed, and built for the project implementation. The software utilized to design the PCB is Orcad10.5/Layout. The base station PCB on a PC receives data from the PCB connected to the vehicle’s CAN bus and sends commands like set CAN filters or masks, activate data logger or inject CAN frames. This PCB is connected to a PC via USB and contains a bridge USB-SPI to communicate with a similar transceiver on the vehicle PCB. LabView controls this part of the system. A special virtual Instrument (VI) had been created in order to add future new elements to the vehicle, is a dashboard, which reads the data passed from the main VI and represents them graphically to studying the behaviour of the car on track. In this special VI other alums can make modifications to accommodate the data provided from the vehicle CAN’s bus to new elements on the vehicle, show or save the CAN frames in the form or format they want. Two methods to access to SPI bus of CC110l RF transceiver over LabView have been developed with minimum changes between them. Access through NI-VISA (Virtual Instrument Software Architecture) which is a standard for configuring, programming, USB interfaces or other devices in National Instruments LabView. And access through DLL (dynamic link library) supplied by the manufacturer of the bridge USB-SPI, Microchip. Then the work is done in two forms, but the dll solution developed shows better behaviour, and increase the speed of the system because has less overload of the USB bus due to a better efficiency of the dll solution versus VISA solution. The PCB connected to the vehicle’s CAN bus receives commands from the base station PCB on a PC, and, acts in function of the command or execute actions like to inject packets into CAN bus or activate data logger. Also sends over RF the CAN frames present on the bus, which can be filtered, to avoid unnecessary radio emissions or overflowing the RF transceiver. This PCB consists of two basic pieces: A microcontroller with 32 bit architecture PIC32MX795F512L from Microchip and the radio transceiver integrated circuit CC110l from Texas Instruments. The PIC32MX795F512L has an integrated CAN and several peripherals like SPI controllers that are utilized to communicate with RF transceiver and SD Card. The USB controller on the PIC32 is utilized to store CAN data on a USB memory, and change notification peripheral is utilized like an external interrupt. Hardware for other peripherals is accessible. The software part of this PCB is coded in C with MPLAB from Microchip, and programming over PICkit 3 Programmer, also from Microchip. Some of his libraries have been modified to work properly with this project and other was created specifically for this project. In the phase for RF selection and design is made a study to clarify the general aspects of regulations for the this project in order to understand it and select the proper band, frequency, and radio transceiver for the activities developed in the project. From the different options available it selects a common use band ICM, with less regulation and free to emit with restrictions and disadvantages like high occupation. The transceiver utilized to transmit and receive the data CC110l is an integrated circuit which needs fewer components from Texas Instruments and it can be accessed through SPI bus. Basically is a state machine which changes his state whit commands received over an SPI bus or internal events. The transceiver has several programmable general purpose Inputs and outputs. These GPIOs are connected to PIC32 change notification input to generate an interrupt or connected to GPIO to MCP2210 USB-SPI bridge to inform to the base station for a packet received. A two pair of modules of CC110l radio module kit from different output power has been purchased which includes an antenna. This is to keep away from fabrication mistakes in RF hardware part or designs, although reference design and gerbers files are available on the webpage of the chip manufacturer. A neck bottle is present on the complete system, because the maximum data rate of CC110l transceiver is a half than CAN bus data rate, hence for high occupation of CAN bus is recommendable to filter the data or add more radio channels, because the buffers can’t sustain this load along the time. Unfortunately, during the development of the project, the relations with the INSIA, who develops the vehicle, was lost, for this reason, will be made impossible to test the final phases of the project like integration on the car, final test of integration, place of the antenna, enclosure of the electronics, connectors selection, etc. To test or evaluate the system, it was necessary to simulate the CAN bus with a hardware to feed the system with entry data. An early hardware prototype was adapted his software to send programed CAN frames at a fixed data rate and certain timing who simulate several levels of occupation of the CAN Bus. This CAN frames emulates the Bosch ECU MS3 Sport.

Scientific bases of human-machine communication by voice.

The scientific bases for human-machine communication by voice are in the fields of psychology, linguistics, acoustics, signal processing, computer science, and integrated circuit technology. The purpose of this paper is to highlight the basic scientific and technological issues in human-machine communication by voice and to point out areas of future research opportunity. The discussion is organized around the following major issues in implementing human-machine voice communication systems: (i) hardware/software implementation of the system, (ii) speech synthesis for voice output, (iii) speech recognition and understanding for voice input, and (iv) usability factors related to how humans interact with machines.

Three Generations of FPGA DAQ Development for the ATLAS Pixel Detector

Thesis (Master's)--University of Washington, 2016-06

Characterization of ultra wideband antennas for personal communication devices using finite difference time domain technique

The current mobile networks don't offer sufficient data rates to support multimedia intensive applications in development for multifunctional mobile devices. Ultra wideband (UWB) wireless technology is being considered as the solution to overcome data rate bottlenecks in the current mobile networks. UWB is able to achieve such high data transmission rates because it transmits data over a very large chunk of the frequency spectrum. As currently approved by the U.S. Federal Communication Commission it utilizes 7.5 GHz of spectrum between 3.1 GHz and 10.6 GHz. ^ Successful transmission and reception of information data using UWB wireless technology in mobile devices, requires an antenna that has linear phase, low dispersion and a voltage standing wave ratio (VSWR) ≤ 2 throughout the entire frequency band. Compatibility with an integrated circuit requires an unobtrusive and electrically small design. The previous techniques that have been used to optimize the performance of UWB wireless systems, involve proper design of source pulses for optimal UWB performance. The goal of this work is directed towards the designing of antennas for personal communication devices, with optimal UWB bandwidth performance. Several techniques are proposed for optimal UWB bandwidth performance of the UWB antenna designs in this Ph.D. dissertation. ^ This Ph.D. dissertation presents novel UWB antenna designs for personal communication devices that have been characterized and optimized using the finite difference time domain (FDTD) technique. The antenna designs reported in this research are physically compact, planar for low profile use, with sufficient impedance bandwidth (>20%), antenna input impedance of 50-Ω, and an omni-directional (±1.5 dB) radiation pattern in the operating bandwidth. ^

VLSI testing and characterization system for micro electro-mechanical (MEM) sensors

The purpose of this investigation was to develop and implement a general purpose VLSI (Very Large Scale Integration) Test Module based on a FPGA (Field Programmable Gate Array) system to verify the mechanical behavior and performance of MEM sensors, with associated corrective capabilities; and to make use of the evolving System-C, a new open-source HDL (Hardware Description Language), for the design of the FPGA functional units. System-C is becoming widely accepted as a platform for modeling, simulating and implementing systems consisting of both hardware and software components. In this investigation, a Dual-Axis Accelerometer (ADXL202E) and a Temperature Sensor (TMP03) were used for the test module verification. Results of the test module measurement were analyzed for repeatability and reliability, and then compared to the sensor datasheet. Further study ideas were identified based on the study and results analysis. ASIC (Application Specific Integrated Circuit) design concepts were also being pursued.

System-on-a-Chip (SoC) based hardware acceleration in Register Transfer Level (RTL) design

Today, modern System-on-a-Chip (SoC) systems have grown rapidly due to the increased processing power, while maintaining the size of the hardware circuit. The number of transistors on a chip continues to increase, but current SoC designs may not be able to exploit the potential performance, especially with energy consumption and chip area becoming two major concerns. Traditional SoC designs usually separate software and hardware. Thus, the process of improving the system performance is a complicated task for both software and hardware designers. The aim of this research is to develop hardware acceleration workflow for software applications. Thus, system performance can be improved with constraints of energy consumption and on-chip resource costs. The characteristics of software applications can be identified by using profiling tools. Hardware acceleration can have significant performance improvement for highly mathematical calculations or repeated functions. The performance of SoC systems can then be improved, if the hardware acceleration method is used to accelerate the element that incurs performance overheads. The concepts mentioned in this study can be easily applied to a variety of sophisticated software applications. The contributions of SoC-based hardware acceleration in the hardware-software co-design platform include the following: (1) Software profiling methods are applied to H.264 Coder-Decoder (CODEC) core. The hotspot function of aimed application is identified by using critical attributes such as cycles per loop, loop rounds, etc. (2) Hardware acceleration method based on Field-Programmable Gate Array (FPGA) is used to resolve system bottlenecks and improve system performance. The identified hotspot function is then converted to a hardware accelerator and mapped onto the hardware platform. Two types of hardware acceleration methods – central bus design and co-processor design, are implemented for comparison in the proposed architecture. (3) System specifications, such as performance, energy consumption, and resource costs, are measured and analyzed. The trade-off of these three factors is compared and balanced. Different hardware accelerators are implemented and evaluated based on system requirements. 4) The system verification platform is designed based on Integrated Circuit (IC) workflow. Hardware optimization techniques are used for higher performance and less resource costs. Experimental results show that the proposed hardware acceleration workflow for software applications is an efficient technique. The system can reach 2.8X performance improvements and save 31.84% energy consumption by applying the Bus-IP design. The Co-processor design can have 7.9X performance and save 75.85% energy consumption.

Amplificador integrador com ganho programável por largura de pulso

This work deals with the research and development of a Pulse Width Programmable Gain Integrating Amplifier. Two Pulse Width Programmable Gain Amplifier architectures are proposed, one based on discrete components and another based on switched capacitors. From the operating requirements defined for the study, parameters are defined and simulations are carried out to validate the architecture. Subsequently, the circuit and the software are developed and tested. It is performed the evaluation of the circuits regarding the two proposed architectures, and from that, an architecture is selected to be improved, aiming the development of an integrated circuit in a future work.

Mecanismo de tolerância a falhas através de escalonamento para uma arquitetura reconfigurável de grão grosso

The continuous evolution of integrated circuit technology has allowed integrating thousands of transistors on a single chip. This is due to the miniaturization process, which reduces the diameter of wires and transistors. One drawback of this process is that the circuit becomes more fragile and susceptible to break, making the circuit more susceptible to permanent faults during the manufacturing process as well as during their lifetime. Coarse Grained Reconfigurable Architectures (CGRAs) have been used as an alternative to traditional architectures in an attempt to tolerate such faults due to its intrinsic hardware redundancy and high performance. This work proposes a fault tolerance mechanism in a CGRA in order to increase the architecture fault tolerance even considering a high fault rate. The proposed mechanism was added to the scheduler, which is the mechanism responsible for mapping instructions onto the architecture. The instruction mapping occurs at runtime, translating binary code without the need for recompilation. Furthermore, to allow faster implementation, instruction mapping is performed using a greedy module scheduling algorithm, which consists of a software pipeline technique for loop acceleration. The results show that, even with the proposed mechanism, the time for mapping instructions is still in order of microseconds. This result allows that instruction mapping process remains at runtime. In addition, a study was also carried out mapping scheduler rate. The results demonstrate that even at fault rates over 50% in functional units and interconnection components, the scheduler was able to map instructions onto the architecture in most of the tested applications.

The morphology of ordered block copolymer patterns as probed by high resolution imaging

The microphase separation of block copolymer (BCP) thin films can afford a simple and cost-effective means to studying nanopattern surfaces, and especially the fabrication of nanocircuitry. However, because of complex interface effects and other complications, their 3D morphology, which is often critical for application, can be more complex than first thought. Here, we describe how emerging microscopic methods may be used to study complex BCP patterns and reveal their rich detail. These methods include helium ion microscopy (HIM) and high resolution x-section transmission electron microscopy (XTEM), and complement conventional secondary electron and atomic force microscopies (SEM and TEM). These techniques reveal that these structures are quite different to what might be expected. We illustrate the advances in the understanding of BCP thin film morphology in several systems, which result from this characterization. The systems described include symmetric, lamellar forming polystyrene-b-polymethylmethacrylate (PS-b-PMMA), cylinder forming polystyrene-b-polydimethylsiloxane (PS-b-PDMS), as well as lamellar and cylinder forming patterns of polystyrene-b-polyethylene oxide (PS-b-PEO) and polystyrene-b-poly-4-vinylpyridine (PS-b-P4VP). Each of these systems exhibits more complex arrangements than might be first thought. Finding and developing techniques whereby complex morphologies, particularly at very small dimensions, can be determined is critical to the practical use of these materials in many applications. The importance of quantifying these complex morphologies has implications for their use in integrated circuit manufacture, where they are being explored as alternative pattern forming methods to conventional UV lithography.

Lennar Technology: The Connected Consumer Has Arrived in Multifamily

As multifamily homebuilders progress into the 21st century, they have looked to integrate electronics and technology to simplify and enhance their businesses. The use of programs like Yardi and MRI for both property management and accounting have become the standard. Like Moore’s Law – the observation that the number of transistors in a dense integrated circuit will double approximately every two years – the use of technology in multifamily properties must equal both the pace and demand of present and future tenants.

The Design and Implementation of a SD Card File System

SD card (Secure Digital Memory Card) is widely used in portable storage medium. Currently, latest researches on SD card, are mainly SD card controller based on FPGA (Field Programmable Gate Array). Most of them are relying on API interface (Application Programming Interface), AHB bus (Advanced High performance Bus), etc. They are dedicated to the realization of ultra high speed communication between SD card and upper systems. Studies about SD card controller, really play a vital role in the field of high speed cameras and other sub-areas of expertise. This design of FPGA-based file systems and SD2.0 IP (Intellectual Property core) does not only exhibit a nice transmission rate, but also achieve the systematic management of files, while retaining a strong portability and practicality. The file system design and implementation on a SD card covers the main three IP innovation points. First, the combination and integration of file system and SD card controller, makes the overall system highly integrated and practical. The popular SD2.0 protocol is implemented for communication channels. Pure digital logic design based on VHDL (Very-High-Speed Integrated Circuit Hardware Description Language), integrates the SD card controller in hardware layer and the FAT32 file system for the entire system. Secondly, the document management system mechanism makes document processing more convenient and easy. Especially for small files in batch processing, it can ease the pressure of upper system to frequently access and process them, thereby enhancing the overall efficiency of systems. Finally, digital design ensures the superior performance. For transmission security, CRC (Cyclic Redundancy Check) algorithm is for data transmission protection. Design of each module is platform-independent of macro cells, and keeps a better portability. Custom integrated instructions and interfaces may facilitate easily to use. Finally, the actual test went through multi-platform method, Xilinx and Altera FPGA developing platforms. The timing simulation and debugging of each module was covered. Finally, Test results show that the designed FPGA-based file system IP on SD card can support SD card, TF card and Micro SD with 2.0 protocols, and the successful implementation of systematic management for stored files, and supports SD bus mode. Data read and write rates in Kingston class10 card is approximately 24.27MB/s and 16.94MB/s.

Physical Design Methodologies for Low Power and Reliable 3D ICs

As the semiconductor industry struggles to maintain its momentum down the path following the Moore's Law, three dimensional integrated circuit (3D IC) technology has emerged as a promising solution to achieve higher integration density, better performance, and lower power consumption. However, despite its significant improvement in electrical performance, 3D IC presents several serious physical design challenges. In this dissertation, we investigate physical design methodologies for 3D ICs with primary focus on two areas: low power 3D clock tree design, and reliability degradation modeling and management. Clock trees are essential parts for digital system which dissipate a large amount of power due to high capacitive loads. The majority of existing 3D clock tree designs focus on minimizing the total wire length, which produces sub-optimal results for power optimization. In this dissertation, we formulate a 3D clock tree design flow which directly optimizes for clock power. Besides, we also investigate the design methodology for clock gating a 3D clock tree, which uses shutdown gates to selectively turn off unnecessary clock activities. Different from the common assumption in 2D ICs that shutdown gates are cheap thus can be applied at every clock node, shutdown gates in 3D ICs introduce additional control TSVs, which compete with clock TSVs for placement resources. We explore the design methodologies to produce the optimal allocation and placement for clock and control TSVs so that the clock power is minimized. We show that the proposed synthesis flow saves significant clock power while accounting for available TSV placement area. Vertical integration also brings new reliability challenges including TSV's electromigration (EM) and several other reliability loss mechanisms caused by TSV-induced stress. These reliability loss models involve complex inter-dependencies between electrical and thermal conditions, which have not been investigated in the past. In this dissertation we set up an electrical/thermal/reliability co-simulation framework to capture the transient of reliability loss in 3D ICs. We further derive and validate an analytical reliability objective function that can be integrated into the 3D placement design flow. The reliability aware placement scheme enables co-design and co-optimization of both the electrical and reliability property, thus improves both the circuit's performance and its lifetime. Our electrical/reliability co-design scheme avoids unnecessary design cycles or application of ad-hoc fixes that lead to sub-optimal performance. Vertical integration also enables stacking DRAM on top of CPU, providing high bandwidth and short latency. However, non-uniform voltage fluctuation and local thermal hotspot in CPU layers are coupled into DRAM layers, causing a non-uniform bit-cell leakage (thereby bit flip) distribution. We propose a performance-power-resilience simulation framework to capture DRAM soft error in 3D multi-core CPU systems. In addition, a dynamic resilience management (DRM) scheme is investigated, which adaptively tunes CPU's operating points to adjust DRAM's voltage noise and thermal condition during runtime. The DRM uses dynamic frequency scaling to achieve a resilience borrow-in strategy, which effectively enhances DRAM's resilience without sacrificing performance. The proposed physical design methodologies should act as important building blocks for 3D ICs and push 3D ICs toward mainstream acceptance in the near future.

System-on-a-Chip (SoC) based Hardware Acceleration in Register Transfer Level (RTL) Design

Today, modern System-on-a-Chip (SoC) systems have grown rapidly due to the increased processing power, while maintaining the size of the hardware circuit. The number of transistors on a chip continues to increase, but current SoC designs may not be able to exploit the potential performance, especially with energy consumption and chip area becoming two major concerns. Traditional SoC designs usually separate software and hardware. Thus, the process of improving the system performance is a complicated task for both software and hardware designers. The aim of this research is to develop hardware acceleration workflow for software applications. Thus, system performance can be improved with constraints of energy consumption and on-chip resource costs. The characteristics of software applications can be identified by using profiling tools. Hardware acceleration can have significant performance improvement for highly mathematical calculations or repeated functions. The performance of SoC systems can then be improved, if the hardware acceleration method is used to accelerate the element that incurs performance overheads. The concepts mentioned in this study can be easily applied to a variety of sophisticated software applications. The contributions of SoC-based hardware acceleration in the hardware-software co-design platform include the following: (1) Software profiling methods are applied to H.264 Coder-Decoder (CODEC) core. The hotspot function of aimed application is identified by using critical attributes such as cycles per loop, loop rounds, etc. (2) Hardware acceleration method based on Field-Programmable Gate Array (FPGA) is used to resolve system bottlenecks and improve system performance. The identified hotspot function is then converted to a hardware accelerator and mapped onto the hardware platform. Two types of hardware acceleration methods – central bus design and co-processor design, are implemented for comparison in the proposed architecture. (3) System specifications, such as performance, energy consumption, and resource costs, are measured and analyzed. The trade-off of these three factors is compared and balanced. Different hardware accelerators are implemented and evaluated based on system requirements. 4) The system verification platform is designed based on Integrated Circuit (IC) workflow. Hardware optimization techniques are used for higher performance and less resource costs. Experimental results show that the proposed hardware acceleration workflow for software applications is an efficient technique. The system can reach 2.8X performance improvements and save 31.84% energy consumption by applying the Bus-IP design. The Co-processor design can have 7.9X performance and save 75.85% energy consumption.

Calibration of the detector flight models for the HERMES and SPIRIT nanosatellite missions

The High Energy Rapid Modular Ensemble of Satellites (HERMES) is a new mission concept involving the development of a constellation of six CubeSats in low Earth orbit with new miniaturized instruments that host a hybrid Silicon Drift Detector/GAGG:Ce based system for X-ray and γ-ray detection, aiming to monitor high-energy cosmic transients, such as Gamma Ray Bursts and the electromagnetic counterparts of gravitational wave events. The HERMES constellation will also operate together with the Australian-Italian SpIRIT mission, which will house a HERMES-like detector. The HERMES pathfinder mini-constellation, consisting of six satellites plus SpIRIT, is likely to be launched in 2023. The HERMES detectors are based on the heritage of the Italian ReDSoX collaboration, with joint design and production by INFN-Trieste and Fondazione Bruno Kessler, and the involvement of several Italian research institutes and universities. An application-specific, low-noise, low-power integrated circuit (ASIC) called LYRA was conceived and designed for the HERMES readout electronics. My thesis project focuses on the ground calibrations of the first HERMES and SpIRIT flight detectors, with a performance assessment and characterization of the detectors. The first part of this work addresses measurements and experimental tests on laboratory prototypes of the HERMES detectors and their front-end electronics, while the second part is based on the design of the experimental setup for flight detector calibrations and related functional tests for data acquisition, as well as the development of the calibration software. In more detail, the calibration parameters (such as the gain of each detector channel) are determined using measurements with radioactive sources, performed at different operating temperatures between -20°C and +20°C by placing the detector in a suitable climate chamber. The final part of the thesis involves the analysis of the calibration data and a discussion of the results.

A 5GHz/1.8V CMOS Active Balun Integrated with LNA

The development of high performance monolithic RF front-ends requires innovative RF circuit design to make the best of a good technology. A fully differential approach is usually preferred, due to its well-known properties. Although the differential approach must be preserved inside the chip, there are cases where the input signal is single-ended such as RF image filters and IF filters in a RF receiver. In these situations, a stage able to convert single-ended into differential signals (balun) is needed. The most cited topology, which is capable of providing high gain, consists on a differential stage with one of the two inputs grounded. Unfortunately, this solution has some drawbacks when implemented monolithically. This work presents the design and simulated results of an innovative high-performance monolithic single to differential converter, which overcomes the limitations of the circuits.The integration of the monolithic active balun circuit with an LNA on a 0.18μm CMOS process is also reported. The circuits presented here are aimed at 802.11a. Section 2 describes the balun circuit and section 3 presents its performance when it is connected to a conventional single-ended LNA. Section 4 shows the simulated performance results focused at phase/amplitude balance and noise figure. Finally, the last section draws conclusions and future work.