VLSI testing and characterization system for micro electro-mechanical (MEM) sensors

The purpose of this investigation was to develop and implement a general purpose VLSI (Very Large Scale Integration) Test Module based on a FPGA (Field Programmable Gate Array) system to verify the mechanical behavior and performance of MEM sensors, with associated corrective capabilities; and to make use of the evolving System-C, a new open-source HDL (Hardware Description Language), for the design of the FPGA functional units. System-C is becoming widely accepted as a platform for modeling, simulating and implementing systems consisting of both hardware and software components. In this investigation, a Dual-Axis Accelerometer (ADXL202E) and a Temperature Sensor (TMP03) were used for the test module verification. Results of the test module measurement were analyzed for repeatability and reliability, and then compared to the sensor datasheet. Further study ideas were identified based on the study and results analysis. ASIC (Application Specific Integrated Circuit) design concepts were also being pursued.