Non-invasive RF built-in testing using on-chip temperature sensors

This poster shows how to efficiently observe high-frequency figures of merit in RF circuits by measuring DC temperature with CMOS-compatible built-in sensors.

Continuous phase shift of sinusoidal signals using injection locked oscillators

This work presents an alternative to generate continuous phase shift of sinusoidal signals based on the use of super harmonic injection locked oscillators (ILO). The proposed circuit is a second harmonic ILO with varactor diodes as tuning elements. In the locking state, by changing the varactor bias, a phase shift instead of a frequency shift is observed at the oscillator output. By combining two of these circuits, relative phases up to 90 could be achieved. Two prototypes of the circuit have been implemented and tested, a hybrid version working in the range of 200-300 MHz and a multichip module (MCM) version covering the 900¿1000 MHz band.

Application of a floating well concept to a latch-up-free, low-cost, smart power high-side switch technology

The aim of this brief is to present an original design methodology that permits implementing latch-up-free smart power circuits on a very simple, cost-effective technology. The basic concept used for this purpose is letting float the wells of the MOS transistors most susceptible to initiate latch-up.

Wireless Sensor Networks for Infrastructure Monitoring, TR-611, 2010

A good system of preventive bridge maintenance enhances the ability of engineers to manage and monitor bridge conditions, and take proper action at the right time. Traditionally infrastructure inspection is performed via infrequent periodical visual inspection in the field. Wireless sensor technology provides an alternative cost-effective approach for constant monitoring of infrastructures. Scientific data-acquisition systems make reliable structural measurements, even in inaccessible and harsh environments by using wireless sensors. With advances in sensor technology and availability of low cost integrated circuits, a wireless monitoring sensor network has been considered to be the new generation technology for structural health monitoring. The main goal of this project was to implement a wireless sensor network for monitoring the behavior and integrity of highway bridges. At the core of the system is a low-cost, low power wireless strain sensor node whose hardware design is optimized for structural monitoring applications. The key components of the systems are the control unit, sensors, software and communication capability. The extensive information developed for each of these areas has been used to design the system. The performance and reliability of the proposed wireless monitoring system is validated on a 34 feet span composite beam in slab bridge in Black Hawk County, Iowa. The micro strain data is successfully extracted from output-only response collected by the wireless monitoring system. The energy efficiency of the system was investigated to estimate the battery lifetime of the wireless sensor nodes. This report also documents system design, the method used for data acquisition, and system validation and field testing. Recommendations on further implementation of wireless sensor networks for long term monitoring are provided.

Compositional influence on the electrical performance of zinc indium tin oxide transparent thin-film transistors

In this work, zinc indium tin oxide layers with different compositions are used as the active layer of thin film transistors. This multicomponent transparent conductive oxide is gaining great interest due to its reduced content of the scarce indium element. Experimental data indicate that the incorporation of zinc promotes the creation of oxygen vacancies. In thin-film transistors this effect leads to a higher threshold voltage values. The field-effect mobility is also strongly degraded, probably due to coulomb scattering by ionized defects. A post deposition annealing in air reduces the density of oxygen vacancies and improves the fieldeffect mobility by orders of magnitude. Finally, the electrical characteristics of the fabricated thin-film transistors have been analyzed to estimate the density of states in the gap of the active layers. These measurements reveal a clear peak located at 0.3 eV from the conduction band edge that could be attributed to oxygen vacancies.

Cap mòbil amb tecnologia led RGBW controlat per DMX

Disseny tant a nivell de hardware com de software d’un cap mòbil amb tecnologia led RGBW controlat pel protocol DMX512. Aquest projecte es limita al disseny i a la realització de tots els elements de software i hardware necessaris per crear un prototipus de cap mòbil que pugui ser controlat mitjançant el protocol DMX. Per tant, està encarat completament cap a la vessant electrònica i de programació sense fer referència als materials i elements constructius utilitzats o sobre el disseny i estètica del producte

On an asymptotic formula for the maximum voltage drop in a on-chip power distribution network

We present a new asymptotic formula for the maximum static voltage in a simplified model for on-chip power distribution networks of array bonded integrated circuits. In this model the voltage is the solution of a Poisson equation in an infinite planar domain whose boundary is an array of circular pads of radius ", and we deal with the singular limit Ɛ → 0 case. In comparison with approximations that appear in the electronic engineering literature, our formula is more complete since we have obtained terms up to order Ɛ15. A procedure will be presented to compute all the successive terms, which can be interpreted as using multipole solutions of equations involving spatial derivatives of functions. To deduce the formula we use the method of matched asymptotic expansions. Our results are completely analytical and we make an extensive use of special functions and of the Gauss constant G

Re-usable ASIC integrationverification software architecture

Mikropiirien valmistus- ja suunnittelutekniikoiden kehittyminen mahdollistaa yhä monimutkaisempien mikropiirien valmistamisen. Piirien verifioinnista onkin tullut prosessin aikaa vievin osa,sillä kompleksisuuden kasvaessa kasvaa verifioinnin tarve eksponentiaalisesti. Vaikka erinäisiä strategioita piirien integroinnin verifiointiin on esitetty, mm. verifioinnin jakaminen koko suunnitteluprosessin ajalle, jopa yli puolet koko piirin suunnitteluun ja valmistukseen käytetystä työmäärästä kuluu verifiointiin. Uudelleenkäytettävät komponentit ovat pääosassa piirin suunnittelussa, mutta verifioinnissa uudelleenkäytettävyyttä ei ole otettu kunnolla käyttöön ainakaan verifiointiohjelmistojen osalta. Tämä diplomityö esittelee uudelleenkäytettävän mikropiirien verifiointiohjelmistoarkkitehtuurin, jolla saadaan verifiointitaakkaa vähennettyä poistamalla verifioinnissa käytettävien ohjelmistojen uudelleensuunnittelun ja toteuttamisen tarvetta.

Compositional influence on the electrical performance of zinc indium tin oxide transparent thin-film transistors

In this work, zinc indium tin oxide layers with different compositions are used as the active layer of thin film transistors. This multicomponent transparent conductive oxide is gaining great interest due to its reduced content of the scarce indium element. Experimental data indicate that the incorporation of zinc promotes the creation of oxygen vacancies. In thin-film transistors this effect leads to a higher threshold voltage values. The field-effect mobility is also strongly degraded, probably due to coulomb scattering by ionized defects. A post deposition annealing in air reduces the density of oxygen vacancies and improves the fieldeffect mobility by orders of magnitude. Finally, the electrical characteristics of the fabricated thin-film transistors have been analyzed to estimate the density of states in the gap of the active layers. These measurements reveal a clear peak located at 0.3 eV from the conduction band edge that could be attributed to oxygen vacancies.

Process variability-aware proactive reconfiguration technique for mitigating aging effects in nanos scale SRAM lifetime

Postprint (published version)

Exploring Adaptive Implementation of On-Chip Networks

As technology geometries have shrunk to the deep submicron regime, the communication delay and power consumption of global interconnections in high performance Multi- Processor Systems-on-Chip (MPSoCs) are becoming a major bottleneck. The Network-on- Chip (NoC) architecture paradigm, based on a modular packet-switched mechanism, can address many of the on-chip communication issues such as performance limitations of long interconnects and integration of large number of Processing Elements (PEs) on a chip. The choice of routing protocol and NoC structure can have a significant impact on performance and power consumption in on-chip networks. In addition, building a high performance, area and energy efficient on-chip network for multicore architectures requires a novel on-chip router allowing a larger network to be integrated on a single die with reduced power consumption. On top of that, network interfaces are employed to decouple computation resources from communication resources, to provide the synchronization between them, and to achieve backward compatibility with existing IP cores. Three adaptive routing algorithms are presented as a part of this thesis. The first presented routing protocol is a congestion-aware adaptive routing algorithm for 2D mesh NoCs which does not support multicast (one-to-many) traffic while the other two protocols are adaptive routing models supporting both unicast (one-to-one) and multicast traffic. A streamlined on-chip router architecture is also presented for avoiding congested areas in 2D mesh NoCs via employing efficient input and output selection. The output selection utilizes an adaptive routing algorithm based on the congestion condition of neighboring routers while the input selection allows packets to be serviced from each input port according to its congestion level. Moreover, in order to increase memory parallelism and bring compatibility with existing IP cores in network-based multiprocessor architectures, adaptive network interface architectures are presented to use multiple SDRAMs which can be accessed simultaneously. In addition, a smart memory controller is integrated in the adaptive network interface to improve the memory utilization and reduce both memory and network latencies. Three Dimensional Integrated Circuits (3D ICs) have been emerging as a viable candidate to achieve better performance and package density as compared to traditional 2D ICs. In addition, combining the benefits of 3D IC and NoC schemes provides a significant performance gain for 3D architectures. In recent years, inter-layer communication across multiple stacked layers (vertical channel) has attracted a lot of interest. In this thesis, a novel adaptive pipeline bus structure is proposed for inter-layer communication to improve the performance by reducing the delay and complexity of traditional bus arbitration. In addition, two mesh-based topologies for 3D architectures are also introduced to mitigate the inter-layer footprint and power dissipation on each layer with a small performance penalty.

Analogisen tunnisteanalyysin käyttö korjauspalveluissa mikropiirien ylijännitteestä aiheutuneiden vaurioiden paikantamisen

Korjauspalveluissa aikaa vieviä tapauksia ovat mikropiirien vaikeasti paikannettavat viat. Tällaista vianetsintää varten yrityksemme oli ostanut Polar Fault Locator 780 –mittalaitteen, jolla voidaan mitata mikropiirien toimintaa käyttämällä analogista tunnisteanalyysiä. Diplomityön tavoitteena oli selvittää, miten mittaustapaa voidaan käyttää korjauspalveluissa. Tutkintaa lähestyttiin joidenkin tyypillisten komponenttien näkökulmasta, mutta pääpaino oli mikropiireissä. Joitain mikropiirejä vaurioitettiin tahallisesti, jolloin mittaustulokset uusittiin ja tutkittiin miten vaurioituminen näkyy mittaustuloksissa. Tutkimusmenetelmänä oli kirjallisuus ja empiirinen kokeellisuus. Diplomityön tuloksena oli, että tätä mittaustapaa käyttämällä mikropiirien kuntoa voidaan tutkia. Ongelmiksi osoittautuivat alkuperäinen oletus mittalaitteen tuloksien tulkinnasta ja taustamateriaalin heikko saatavuus. Täten mittalaite parhaiten soveltuu tilanteisiin, joissa sen antamia tuloksia verrataan suoraan toisen toimivaksi tunnetun yksikön mittaustuloksiin. Vaurioitettaessa komponenteissa oli kuitenkin havaittavissa selvä poikkeavuus.

Synthèse de couches ultra-minces de siliciures sur silicium cristallin et endommagé étudiée par microscopie et profilométrie en profondeur

Les siliciures métalliques constituent un élément crucial des contacts électriques des transistors que l'on retrouve au coeur des circuits intégrés modernes. À mesure qu'on réduit les dimensions de ces derniers apparaissent de graves problèmes de formation, liés par exemple à la limitation des processus par la faible densité de sites de germination. L'objectif de ce projet est d'étudier les mécanismes de synthèse de siliciures métalliques à très petite échelle, en particulier le NiSi, et de déterminer l’effet de l’endommagement du Si par implantation ionique sur la séquence de phase. Nous avons déterminé la séquence de formation des différentes phases du système Ni-Si d’échantillons possédant une couche de Si amorphe sur lesquels étaient déposés 10 nm de Ni. Celle-ci a été obtenue à partir de mesures de diffraction des rayons X résolue en temps et, pour des échantillons trempés à des températures critiques du processus, l’identité des phases et la composition et la microstructure ont été déterminées par mesures de figures de pôle, spectrométrie par rétrodiffusion Rutherford et microscopie électronique en transmission (TEM). Nous avons constaté que pour environ la moitié des échantillons, une réaction survenait spontanément avant le début du recuit thermique, le produit de la réaction étant du Ni2Si hexagonal, une phase instable à température de la pièce, mélangée à du NiSi. Dans de tels échantillons, la température de formation du NiSi, la phase d’intérêt pour la microélectronique, était significativement abaissée.