1000 resultados para stress locking


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The stress distribution in silica optical waveguides on silicon is calculated by using finite element method (FEM). The waveguides are mainly subjected to compressive stress along the x direction and the z direction, and it is accumulated near the interfaces between the core and cladding layers. The shift of central wavelength of silica arrayed waveguide grating (AWG) on silicon-substrate with the designed wavelength and the polarization dependence are caused by the stress in the silica waveguides.

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We theoretically study the electronic structure, spin splitting, effective mass, and spin orientation of InAs nanowires with cylindrical symmetry in the presence of an external electric field and uniaxial stress. Using an eight-band k center dot p theoretical model, we deduce a formula for the spin splitting in the system, indicating that the spin splitting under uniaxial stress is a nonlinear function of the momentum and the electric field. The spin splitting can be described by a linear Rashba model when the wavevector and the electric field are sufficiently small. Our numeric results show that the uniaxial stress can modulate the spin splitting. With the increase of wavevector, the uniaxial tensile stress first restrains and then amplifies the spin splitting of the lowest electron state compared to the no strain case. The reverse is true under a compression. Moreover, strong spin splitting can be induced by compression when the top of the valence band is close to the bottom of the conductance band, and the spin orientations of the electron stay almost unchanged before the overlap of the two bands.

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A universal Biot number, which not only describes the susceptibility of ceramic cylinders to quenching but also determines the duration that ceramic cylinders are subjected to thermal stress during thermal shock, is theoretically obtained. The analysis proves that thermal shock failure of ceramic cylinders with a Biot number greater than the critical value is a rapid process, which only occurs in the initial heat conduction regime. The results provide a guide to the selection of ceramic materials for thermostructural engineering, with particular reference to thermal shock.

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A new criterion for shear band formation in metallic glasses is proposed based on the shear plane criterion proposed by Packard and Schuh [1]. This modified shear plane (MSP) criterion suggests that a shear band is not initiated randomly throughout the entire material under stress but is initiated at the physical boundaries or defects and at locations where the highest normal stress modified maximum shear stress occurs. Moreover, the same as in the shear plan criterion, the shear stress all over the shear band should exceed the shear yield strength of the material. For a complete shear band to form, both requirements need to be fulfilled. The shear yield strength of the material is represented by the shear stress of the point at which the shear band stops. The new criterion agrees very well with experimental results in both the determination of the shear yield strength and the shear band path. (C) 2010 Elsevier B.V. All rights reserved.

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Sand storm is a serious environmental threat to humans. Sand particles are transported by saltation and suspension, causing soil erosion in one place and deposition in another. In order to prevent and predict sand storms, the causes and the manners of particle motions must be studied in detail. In this paper a standard k-epsilon model is used for the gas phase simulation and the discrete element method (DEM) is used to predict the movements of particles using an in-house procedure. The data are summarized in an Eulerian-Eulerian regime after simulation to get the statistical particle Reynolds stress and particle collision stress. The results show that for the current case the Reynolds stress and the air shear stress predominate in the region 20-250 mm above the initial sand bed surface. However, in the region below 3 mm, the collision stress must be taken into account in predicting particle movement. (C) 2010 Chinese Society of Particuology and Institute of Process Engineering, Chinese Academy of Sciences. Published by Elsevier B.V. All rights reserved.

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Finite Element Method is used in this article to analyze the stress of CR superferric magnet. Magnetic force and the stress caused by this force are calculated. The thermal stress and strain of the coil caused by cooling down is also analyzed. The result will be taken as a check for the design of the coil and coilcase, and also as a reference for the optimization of further design and quench protection.