936 resultados para Photonics packaging
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An abstract of this work will be presented at the Compiler, Architecture and Tools Conference (CATC), Intel Development Center, Haifa, Israel November 23, 2015.
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The compression properties of octave-spanning supercontinuum spectra generated in photonic crystal fibers are studied using stochastic nonlinear Schrödinger equation simulations. The conditions under which sub-5 fs pulses can be obtained after compression are identified. © 2004 Optical Society of America.
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En el Perú, el mercado de galletas se caracteriza por su gran nivel de innovación y constantes lanzamientos, siendo la más común la introducción de nuevos sabores en el segmento de galletas dulces. La Pastelería y Dulcería Velazco S.A. cuenta con una buena aceptación del mercado de la ciudad de Ica-Perú. Sin embargo, a fin de que la empresa pueda mejorar su posicionamiento en el mercado frente a un avance de la competencia se realiza una investigación considerando la situación actual de la empresa y del mercado Iqueño. Para ello se propone aumentar su cobertura de mercado mediante la estrategia de marketing estiramiento de línea ascendente a su producto estrella, la galleta Paciencia. Mediante esta estrategia empleada nace un nuevo packaging más llamativo de la galleta, que llevará como nombre Paciencia tradición Iqueña, la cual pretende posicionar el producto, asociando las costumbres y la tradición con el sabor exquisito y la naturalidad del mismo. A través de la utilización de esta estrategia de marketing se espera que la empresa pueda seguir liderando en el mercado de pastelería y dulcería en la ciudad de Ica.
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The attachment of electronic components to printed circuit boards using solder material is a complex process. This paper presents a novel modeling methodology, which integrates the governing physics taking place. Multiphysics modeling technology, imbedded into the simulation tool—PHYSICA is used to simulate fluid flow, heat transfer, solidification, and stress evolution in an integrated manner. Results using this code are presented, detailing the mechanical response of two solder materials as they cool, solidify and then deform. The shape that a solder joint takes upon melting is predicted using the SURFACE EVOLVER code. Details are given on how these predictions can be used in the PHYSICA code to provide a modeling route by which the shape, solidification history, and resulting stress profiles can be predicted.
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A flip chip component is a silicon chip mounted to a substrate with the active area facing the substrate. This paper presents the results of an investigation into the relationship between a number of important material properties and geometric parameters on the thermal-mechanical fatigue reliability of a standard flip chip design and a flip chip design with the use of microvias. Computer modeling has been used to analyze the mechanical conditions of flip chips under cyclic thermal loading where the Coffin-Manson empirical relationship has been used to predict the life time of the solder interconnects. The material properties and geometry parameters that have been investigated are the Young's modulus, the coefficient of thermal expansion (CTE) of the underfill, the out-of-plane CTE (CTEz) of the substrate, the thickness of the substrate, and the standoff height. When these parameters vary, the predicted life-times are calculated and some of the features of the results are explained. By comparing the predicted lifetimes of the two designs and the strain conditions under thermal loading, the local CTE mismatch has been found to be one of most important factors in defining the reliability of flip chips with microvias.
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Solder is often used as an adhesive to attach optical fibers to a circuit board. In this proceeding we will discuss efforts to model the motion of an optical fiber during the wetting and solidification of the adhesive solder droplet. The extent of motion is determined by several competing forces, during three “stages” of solder joint formation. First, capillary forces of the liquid phase control the fiber position. Second, during solidification, the presence of the liquid-solid-vapor triple line as well as a reduced liquid solder volume leads to a change in the net capillary force on the optical fiber. Finally, the solidification front itself impinges on the fiber. Publicly-available finite element models are used to calculate the time-dependent position of the solidification front and shape of the free surface.