Electrodeposition of amorphous Fe-Cr-P-Ni-C alloys. Morphological and structural characteristics

The effect of bath composition and electroplating conditions on structure, morphology and composition of amorphous Fe-Cr-P-Ni-C deposits on Cu substrate was investigated. The deposition efficiency of Fe-Ni-P-C alloy increased significantly with the addition of formic acid, but decreased with the addition of Cr to the plating bath. The increase of charge density activates the inclusion of Cr in the deposit. However, above a specific value of charge density, which depends on deposition current density, the Cr content in the deposit decreases. SEM analysis showed that the increase of Ni, Cr or charge deposition promotes susceptibility to microcracking.

Effects of electroplated zinc-nickel alloy coatings on the fatigue strength of AISI 4340 high strength steel

It is well known that fatigue behaviour is an important parameter to be considered in mechanical components subjected to constant and variable amplitude loadings. In combination with corrosion phenomenon, fatigue effects were responsible for proximally 64% of fails that occur in metallic parts of aeronautical accidents in the last 30 years. Recovered substrates have been extensively used in the aerospace field. Cadmium electroplating has been widely applied to promote protective coatings in aeronautical components, resulting in excellent corrosion protection combined with a good performance in cyclic loading. Ecological considerations allied to the increasing demands for corrosion resistance, resulted in the search for possible alternatives. Zinc-nickel alloys received considerable interest recently, since these coatings showed some advantages such as a good resistance to white and red rust, high plating rates and acceptation in the market. In this study the effects of zinc-nickel coatings electroplated on AISI 4340 high strength steel were analysed on rotating bending and axial fatigue strength, corrosion and adhesion resistance. Compressive residual stress field was measured by a X-ray tensometry prior to fatigue tests. Optical microscopy images showed coating thicknesses, adhesion and the existence of an uniform coverage of nearly all substrates. The fractured fatigue specimens were investigated using a scanning electron microscope. Three different zinc-nickel coating thicknesses were tested and comparison with rotating bending fatigue data from specimens cadmium electroplated and heat treated at 190°C for 3, 8 and 24 hours to avoid the diffusion of hydrogen in the substrate, was performed. Experimental results showed effect of coatings on the AISI 4340 steel behaviour when submitted to fatigue testing and the existence of coating thickness influence on the fatigue strength.

The significance and determination by image analysis of microcrack density in hard chromium plating

It is well known that the microcrack density is a fundamental parameter in hard chromium electroplating. The chemical and mechanical properties of this coating are widely dependent on its microcrack density. In this paper a simple image analysis procedure to determine microcrack density is presented in order to demonstrate it as a fundamental tool to estimate the fatigue, corrosion and wear behavior, as well as the residual stress field of a coated component. For this purpose, the image analysis procedure was carried out on two kinds of hard chromium plating - one called accelerated (high velocity of deposition and fluoride-free) and the other conventional (with fluoride). The coatings were applied on samples of AISI 4340 aeronautical steel, which is widely used in aircraft landing gear components. To characterize the practical significance of this study, the microcrack density results were related to the fatigue, wear and corrosion behavior from previous study and to the residual stress field in the coatings.

Fadiga no aço inox 15-5PH revestido por HVOF: aplicação em trem de pouso

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Estudos dos efeitos no comportamento em fadiga das camadas de níquel eletrolítico, processo sulfamato, em aços de alta resistência

Pós-graduação em Engenharia Mecânica - FEG

Estudo do comportamento eletroquímico e da resistência à corrosão de eletrodepósitos de zinco e ligas de zinco em solução de NaCL e na presença de oxi-ânions do grupo VIB

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

Influência na vida em fadiga da espessura das camadas de níquel e cromo duro em aço ABNT 4340

Pós-graduação em Engenharia Mecânica - FEG

Influência do tratamento superficial 3IP na vida em fadiga dos aços ABNT 4340 e 15-5PH para aplicação aeronáutica

Pós-graduação em Engenharia Mecânica - FEG

Preparation of Coated Microtools for Electrochemical Machining Applications

PREPARATION OF COATED MICROTOOLS FOR ELECTROCHEMICAL MACHINING APPLICATIONS Ajaya K. Swain, M.S. University of Nebraska, 2010 Advisor: K.P. Rajurkar Coated tools have improved the performance of both traditional and nontraditional machining processes and have resulted in higher material removal, better surface finish, and increased wear resistance. However, a study on the performance of coated tools in micromachining has not yet been adequately conducted. One possible reason is the difficulties associated with the preparation of coated microtools. Besides the technical requirement, economic and environmental aspects of the material and the coating technique used also play a significant role in coating microtools. This, in fact, restricts the range of coating materials and the type of coating process. Handling is another major issue in case of microtools purely because of their miniature size. This research focuses on the preparation of coated microtools for pulse electrochemical machining by electrodeposition. The motivation of this research is derived from the fact that although there were reports of improved machining by using insulating coatings on ECM tools, particularly in ECM drilling operations, not much literature was found relating to use of metallic coating materials in other ECM process types. An ideal ECM tool should be good thermal and electrical conductor, corrosion resistant, electrochemically stable, and stiff enough to withstand electrolyte pressure. Tungsten has almost all the properties desired in an ECM tool material except being electrochemically unstable. Tungsten can be oxidized during machining resulting in poor machining quality. Electrochemical stability of a tungsten ECM tool can be improved by electroplating it with nickel which has superior electrochemical resistance. Moreover, a tungsten tool can be coated in situ reducing the tool handling and breakage frequency. The tungsten microtool was electroplated with nickel with direct and pulse current. The effect of the various input parameters on the coating characteristics was studied and performance of the coated microtool was evaluated in pulse ECM. The coated tool removed more material (about 28%) than the uncoated tool under similar conditions and was more electrochemical stable. It was concluded that nickel coated tungsten microtool can improve the pulse ECM performance.

In Situ Quantification of Cu(II) during an Electrodeposition Reaction Using Time-Domain NMR Relaxometry

The use of a low-cost benchtop time-domain NMR (TD-NMR) spectrometer to monitor copper electrodeposition in situ is presented. The measurements are based on the strong linear correlation between the concentration of paramagnetic ions and the transverse relaxation rates (R-2) of the solvent protons Two electrochemical NMR (EC-NMR) cells were constructed and applied to monitor the Cu2+ concentration during the electrodeposition reaction. The results show that TD-NMR relaxometry using the Carr-Purcell-Meiboom-Gill pulse sequence can be a very fast, simple, and efficient technique to monitor, in real time, the variation in the Cu2+ concentration during an electrodeposition reaction. This methodology can also be applied to monitor the electrodeposition of other paramagnetic ions, such as Ni2+ and Cr3+, which are commonly used in electroplating.

Reduced-order modelling, circuit-level design and SOI fabrication of microelectromechanical resonators

This thesis deals with two important research aspects concerning radio frequency (RF) microresonators and switches. First, a new approach for compact modeling and simulation of these devices is presented. Then, a combined process flow for their simultaneous fabrication on a SOI substrate is proposed. Compact models for microresonators and switches are extracted by applying mathematical model order reduction (MOR) to the devices finite element (FE) description in ANSYS c° . The behaviour of these devices includes forms of nonlinearities. However, an approximation in the creation of the FE model is introduced, which enables the use of linear model order reduction. Microresonators are modeled with the introduction of transducer elements, which allow for direct coupling of the electrical and mechanical domain. The coupled system element matrices are linearized around an operating point and reduced. The resulting macromodel is valid for small signal analysis around the bias point, such as harmonic pre-stressed analysis. This is extremely useful for characterizing the frequency response of resonators. Compact modelling of switches preserves the nonlinearity of the device behaviour. Nonlinear reduced order models are obtained by reducing the number of nonlinearities in the system and handling them as input to the system. In this way, the system can be reduced using linear MOR techniques and nonlinearities are introduced directly in the reduced order model. The reduction of the number of system nonlinearities implies the approximation of all distributed forces in the model with lumped forces. Both for microresonators and switches, a procedure for matrices extraction has been developed so that reduced order models include the effects of electrical and mechanical pre-stress. The extraction process is fast and can be done automatically from ANSYS binary files. The method has been applied for the simulation of several devices both at devices and circuit level. Simulation results have been compared with full model simulations, and, when available, experimental data. Reduced order models have proven to conserve the accuracy of finite element method and to give a good description of the overall device behaviour, despite the introduced approximations. In addition, simulation is very fast, both at device and circuit level. A combined process-flow for the integrated fabrication of microresonators and switches has been defined. For this purpose, two processes that are optimized for the independent fabrication of these devices are merged. The major advantage of this process is the possibility to create on-chip circuit blocks that include both microresonators and switches. An application is, for example, aswitched filter bank for wireless transceiver. The process for microresonators fabrication is characterized by the use of silicon on insulator (SOI) wafers and on a deep reactive ion etching (DRIE) step for the creation of the vibrating structures in single-crystal silicon and the use of a sacrificial oxide layer for the definition of resonator to electrode distance. The fabrication of switches is characterized by the use of two different conductive layers for the definition of the actuation electrodes and by the use of a photoresist as a sacrificial layer for the creation of the suspended structure. Both processes have a gold electroplating step, for the creation of the resonators electrodes, transmission lines and suspended structures. The combined process flow is designed such that it conserves the basic properties of the original processes. Neither the performance of the resonators nor the performance of the switches results affected by the simultaneous fabrication. Moreover, common fabrication steps are shared, which allows for cheaper and faster fabrication.

Classification of suppressor additives based on synergistic and antagonistic ensemble effects

Three fundamental types of suppressor additives for copper electroplating could be identified by means of potential Transient measurements. These suppressor additives differ in their synergistic and antagonistic interplay with anions that are chemisorbed on the metallic copper surface during electrodeposition. In addition these suppressor chemistries reveal different barrier properties with respect to cupric ions and plating additives (Cl, SPS). While the type-I suppressor selectively forms efficient barriers for copper inter-diffusion on chloride-terminated electrode surfaces we identified a type-II suppressor that interacts non-selectively with any kind of anions chemisorbed on copper (chloride, sulfate, sulfonate). Type-I suppressors are vital for the superconformal copper growth mode in Damascene processing and show an antagonistic interaction with SPS (Bis-Sodium-Sulfopropyl-Disulfide) which involves the deactivation of this suppressor chemistry. This suppressor deactivation is rationalized in terms of compositional changes in the layer of the chemisorbed anions due to the competition of chloride and MPS (Mercaptopropane Sulfonic Acid) for adsorption sites on the metallic copper surface. MPS is the product of the dissociative SPS adsorption within the preexisting chloride matrix on the copper surface. The non-selectivity in the adsorption behavior of the type-II suppressor is rationalized in terms of anion/cation pairing effects of the poly-cationic suppressor and the anion-modified copper substrate. Atomic-scale insights into the competitive Cl/MPS adsorption are gained from in situ STM (Scanning Tunneling Microscopy) using single crystalline copper surfaces as model substrates. Type-III suppressors are a third class of suppressors. In case of type-land type-II suppressor chemistries the resulting steady-state deposition conditions are completely independent on the particular succession of additive adsorption. In contrast to that a strong dependence of the suppressing capabilities on the sequence of additive adsorption ("first comes, first serves" principle) is observed for the type-IIIsuppressor. This behavior:is explained by a suppressor barrier that impedes not only the copper inter-diffusion but also the transport of other additives (e.g. SPS) to the copper surface. (C) 2011 Elsevier Ltd. All rights reserved.

Adsorption behavior of redox-active suppressor additives: Combined electrochemical and STM studies

The redox chemistry and the related surface phase behavior of Safranine (SAF) and Janus Green B (JGB) have been studied by means of cyclic voltammetry in combination with in situ Scanning Tunneling Microscopy using HOPG (Highly Oriented Pyrolytic Graphite) and single crystalline Cu(1 0 0) as model substrates, both revealing different widths of the accessible potential windows. JGB and SAF serve as prototypical heterocyclic suppressor/leveler additives that are used for the metallization of 3D-TSVs (3D Through Silicon Vias) following a classical "leveling" concept. SAF can be considered as the reductive decomposition product of JGB that is formed at the copper/electrolyte interface upon electroplating. Both additives reveal a pronounced pH-dependent redox-chemistry with redox-transitions lying close to or even beyond the anodic limit of the copper potential window. Affected by these redox-processes are in particular the aromatic cores of those heterocycles that can be (quasi)reversibly reduced by a two electron transfer process within the potential window of copper. Therefore we identify the reduced form of those dyes as the active components for the suppressing/leveling effect in copper plating. STM data clearly shows a dye surface phase behavior that is crucially determined by its potential-dependent redox-chemistry. This will be exemplarily discussed for the SAF dye. On chloride-modified Cu(1 0 0) mono-reduced SAF forms a structurally well-defined monolayer of cationic stacking polymers. However, this coupled anion/cation layer reveals only minor suppressing capabilities with respect to the copper dissolution and deposition processes. Complete reduction of the aromatic heterocycle finally leads to the 3D precipitation of hydrophobic reaction products. 3D clusters of this SAF precipitate are discussed as the active structural motif for the suppressing effect of these dyes. (C) 2011 Elsevier Ltd. All rights reserved.

An Investigation into the Recovery of Indium from Fume Residue

Several months were required to produce a single gram of indium. Consequently, the industrial history of the metal is extremely short. In view of the unique properties that indium has demonstrated in this short period, it is probable that indium is still in its early stage of development. However, the commer­cial applications of the metal are well established and indium is now produced on a commercial scale. It is obtainable as the metal or in solution for electroplat­ing.

Surface-patterned micromechanical elements by polymer injection molding with hybrid molds

Hybrid molds enable the fabrication of polymeric parts with features of different length scales by injection molding. The resulting polymer microelements combine optical or biological functionalities with designed mechanical properties. Two applications are chosen for illustration of this concept: As a first example, microelements for optical communication via fiber-to-fiber coupling are manufactured by combining two molds to a small mold insert. Both molds are fabricated using lithography and electroplating. As a second example, microcantilevers (μCs) for chemical sensing are surface patterned using a modular mold composed of a laser-machined cavity defining the geometry of the μCs, and an opposite flat tool side which is covered by a patterned polymer foil. Injection molding results in an array of 35 μm-thick μCs with microscale surface topographies. In both cases, when the mold is assembled and closed, reliefs are transferred onto one surface of the molded element whose outlines are defined by the micromold cavity. The main advantage of these hybrid methods lies in the simple integration of optical surface structures and gratings onto the surface of microcomponents with different sizes and orientations. This allows for independent development of functional properties and combinations thereof.