一种双面键合长波长垂直腔面发射激光器及其制作方法

本发明是一种双面键合长波长垂直腔面发射激光器(VCSEL)及其制作方法。所述激光器包括N电极(1)，N型GaAs衬底(2)，N型GaAs/AlGaAs材料系的下分布布拉格反射镜(DBR)(3)，InP基应变量子阱有源区(4)，GaAs/AlGaAs材料系的上DBR(5)，其中上DBR(5)，由P型DBR(6)和本征DBR(7)组成，SiO2掩膜(8)，P电极(9)，出光窗口(10)。所述结构和所述方法改进了传统长波长VCSEL的DBR材料折射率差较小，热导、电导差的缺点，不仅可实现很好的电流限制，而且降低材料的吸收损耗、生长的难度和免去二次外延工艺步骤。

一种单模高功率垂直腔面发射激光器及其制作方法

本发明是一种单模高功率垂直腔面发射激光器，属半导体光电子领域。其特征在于，包括P型电极(1)，P型Si衬底(2)，金属键合层(3)，P型分布布拉格反射镜(DBR)(4)，氧化限制层(5)，有源区(6)，N型DBR(7)，SiO2掩膜(8)，聚酰亚胺或苯并环丁烯(BCB)(9)，N电极(10)，光子晶体(11)，出光窗口(12)。在该结构的垂直腔面发射激光器中引入光子晶体，可增大氧化孔径，提高单模输出功率，同时采用键合技术将传统VCSEL外延片转移到Si衬底上和采用底部出光的设计，便于拉近VCSEL外延片有源区与Si衬底的距离，改善器件热学特性，进一步提高单模输出功率。

倒锥波导耦合器的制作方法

一种倒锥波导耦合器的制作方法，包括如下步骤:步骤1:在SOI上用电子束光刻和感应耦合等离子体刻蚀技术，将SOI的硅波导层刻蚀为一倒锥波导和微纳波导集成器件;步骤2:利用有机/无机杂化的溶胶凝胶法制备光敏性溶胶薄膜材料;步骤3:在SOI的SiO2隔离层及倒锥波导和微纳波导集成器件上旋涂溶胶薄膜;步骤4:对旋涂的溶胶薄膜进行前烘、凝胶;步骤5:在溶胶薄膜上利用掩模版进行紫外写入;步骤6:腐蚀掉紫外写入区以外的部分溶胶薄膜，形成光纤耦合波导，该光纤耦合波导和倒锥波导构成倒锥波导耦合器;步骤7:后烘，完成倒锥波导耦合器的制作。

折射面入光探测器的制作方法

一种折射面入光探测器的制作方法，制作过程包括如下步骤:步骤1:在衬底上采用MOCVD的方法生长探测器材料结构;步骤2:在探测器材料结构的上面制作p型欧姆接触;步骤3:在p型欧姆接触的周边向下刻蚀，形成探测器台面结构;步骤4:在步骤3形成的器件的上表面生长第一SiO2层;步骤5:在探测器台面结构的一侧腐蚀掉部分第一SiO2层，形成条形掩模图形结构;步骤6:在掩膜图形结构上，采用化学腐蚀的方法，向下腐蚀出燕尾槽;步骤7:腐蚀掉器件表面的第一SiO2层，重新在整个器件的表面生长第二SiO2层;步骤8:在燕尾槽中填入聚合物，使得材料表面平整;腐蚀掉p欧姆接触上的第二SiO2层;步骤9:在探测器台面结构的一侧制作p型金属电极;步骤10:将衬底减薄，在衬底的背面制作金属电极;步骤11:清除掉燕尾槽中的聚合物，解理芯片，完成整个器件的制作。

制备平行取向FePt磁性纳米复合薄膜的方法

本发明一种制备平行取向FePt磁性纳米复合薄膜的方法，其特征在于，包括如下步骤:步骤1:利用双亲嵌段共聚物PS-P4VP在甲苯中自组装成反胶束，然后将金属盐FeCl3和H2PtCl6加入所述反胶束溶液中，形成金属盐负载的反胶束;步骤2:利用旋涂法在硅衬底上获得反胶束阵列，并通过氧等离子体和氢等离子体刻蚀而得到单分散性良好的FePt纳米颗粒阵列;步骤3:用磁控溅射法在FePt纳米颗粒阵列上覆盖一层SiO2保护层;步骤4:保护气氛下对样品进行高温退火，完成平行取向FePt磁性纳米复合薄膜的制作。

Development of high-k gate dielectric materials

The traditional gate dielectric material Of SiO2 can not satisfy the need of the continuous downscaling of CMOS dimensions. High-K gate dielectric materials have attracted extensive research efforts recently and obtained great progress. In this paper, the developments of high-K gate materials were reviewed. Based on the author's background and research work in the area, the latest achievements of high-K gate dielectric materials on the recrystalization temperature, the low-K interface layer, and the dielectric breakdown and metal gate electrode were introduced in detail.

Blue-green optically pumped GaN-based vertical cavity surface emitting laser

Blue-green GaN-based vertical cavity surface emitting lasers (VCSELs) were fabricated with two dielectric Ta2O5/SiO2 distributed Bragg reflectors. Lasing action was observed at a wavelength of 498.8 nm at room temperature under optical pumping. Threshold energy density and emission linewidth were 189 mJ/cm(2) and 0.15 nm, respectively. The result demonstrates that blue-green VCSELs can be realised using III-nitride semiconductors.

Doped polycrystalline 3C-SiC films deposited by LPCVD for radio-frequency MEMS applications

Polycrystalline 3C-SiC films are deposited on SiO2 coated Si substrates by low pressure chemical vapour deposition (LPCVD) with C3H8 and SiH4 as precursors. Controlled nitrogen doping is performed by adding NH3 during SiC growth to obtain the low resistivity 3C-SiC films. X-ray diffraction (XRD) patterns indicate that the deposited films are highly textured (111) orientation. The surface morphology and roughness are determined by scanning electron microscopy (SEM) and atomic force microscopy (AFM). The surface features are spherulitic texture with average grain size of 100 nm, and the rms roughness is 20nm (AFM 5 x 5 mu m images). Polycrystalline 3C-SiC films with highly orientational texture and good surface morphology deposited on SiO2 coated Si substrates could be used to fabricate rf microelectromechanical systems (MEMS) devices such as SiC based filters.

Fabrication of nano-patterned sapphire substrates and their application to the improvement of the performance of GaN-based LEDs

Nano-patterned sapphire substrates (NPSSs) were fabricated by a chemical wet etching technology using nano-sized SiO2 as masks. The NPSS was applied to improve the performance of GaN-based light emitting diodes (LEDs). GaN-based LEDs on NPSSs were grown by metal organic chemical vapour deposition. The characteristics of LEDs grown on NPSSs and conventional planar sapphire substrates were studied. The light output powers of the LEDs fabricated on NPSSs were considerably enhanced compared with that of the conventional LEDs grown on planar sapphire substrates.

Recent progresses of Si-based photonics in chinese main land

Si-based photonic materials and devices, including SiGe/Si quantum structures, SOI and InGaAs bonded on Si, PL of Si nanocrystals, SOI photonic crystal filter, Si based RCE (Resonant Cavity Enhanced) photodiodes, SOI TO (thermai-optical) switch matrix were investigated in Institute of Serniconductors, Chinese Academy of Sciences. The main results in recent years are presented in the paper. The mechanism of PL from Si NCs embedded in SiO2 matrix was studied, a greater contribution of the interface state recombination (PL peak in 850 similar to 900 nm) is associated with larger Si NCs and higher interface state density. Ge dots with density of order of 10(11) cm(-2) were obtained by UHV/CVD growth and 193 nm excimer laser annealing. SOI photonic crystal filter with resonant wavelength of 1598 nm and Q factor of 1140 was designed and made. Si based hybrid InGaAs RCE PD with eta of 34.4% and FWHM of 27 nut were achieved by MOCVD growth and bonding technology between InGaAs epitaxial and Si wafers. A 16x16 SOI optical switch matrix were designed and made. A new current driving circuit was used to improve the response speed of a 4x4 SOI rearrangeable nonblocking TO switch matrix, rising and failing time is 970 and 750 ns, respectively.

Fabrication and Infrared Optical Properties of Nano Vanadium Dioxide Thin Films

Vanadium dioxide thin films were fabricated by ion beam sputtering on Si3N4/SiO2/Si after a post reductive annealing process in a nitrogen atmosphere. X-ray Diffraction (XRD), scanning electron microscope (SEM), and X-ray photoelectron spectroscopy (XPS) were employed to analyze the effects of post annealing temperature on crystallinity, morphology, and composition of the vanadium oxide thin films. Transmission properties of vanadium dioxide thin films were measured by Fourier transform-infrared (FT-IR) spectroscopy. The results showed that the as-deposited vanadium oxide thin films were composed of non-crystalline V2O5 and a tetragonal rutile VO2. After annealing at 400 degrees C for 2 h, the mixed phase vanadium oxide (VOx) thin film changed its composition and structure to VO2 and had a (011) oriented monoclinic rutile structure. When increasing the temperature to 450 degrees C, nano VO2 thin films with smaller grains were obtained. FT-IR results showed that the transmission contrast factor of the nano VO2 thin film was more than 0.99 and the transmission of smaller grain nano VO2 thin film was near zero at its switched state. Nano VO2 thin film with smaller grains is an ideal material for application in optical switching devices.

Role of interface dipole in metal gate/high-k effective work function modulation by aluminum incorporation

The interface dipole and its role in the effective work function (EWF) modulation by Al incorporation are investigated. Our study shows that the interface dipole located at the high-k/SiO2 interface causes an electrostatic potential difference across the metal/high-k interface, which significantly shifts the band alignment between the metal and high-k, consequently modulating the EWF. The electrochemical potential equalization and electrostatic potential methods are used to evaluate the interface dipole and its contribution. The calculated EWF modulation agrees with experimental data and can provide insight to the control of EWF in future pMOS technology.

Photostability of single-photon emission from a single quantum dot in the 650-nm wavelength band at room temperature

The photoluminescence correlation from a single CdSe nanocrystal under pulsed excitation is studied, and a single photon is realized at wavelength 655 nm at room temperature. The single colloidal CdSe quantum dot is prepared on a SiO2/silicon surface by a drop-and-drag technique. The long-term stability of the single-photon source is investigated; it is found that the antibunching effect weakens with excitation time, and the reason for the weakening is attributed to photobleaching. The lifetimes of photoluminescence from a single quantum dot are analyzed at different excitation times. By analyzing the probability distribution of on and off times of photoluminescence, the Auger assisted tunneling and Auger assisted photobleaching models are applied to explain the antibunching phenomenon.

Blue-violet Lasing of Optically Pumped GaN-Based Vertical Cavity Surface-Emitting Laser With Dielectric Distributed Bragg Reflectors

Optically pumped GaN-based vertical cavity surface-emitting laser (VCSEL) with two Ta2O5/SiO2 dielectric distributed Bragg reflectors (DBRs) was fabricated via a simplifled procedure direct deposition of the top DBR onto the GaN surface exposed after substrate removal and no use of etching and polishing processes. Blue-violet lasing action was observed at a wavelength of 397.3 ran under optical pumping at room temperature with a threshold pumping energy density of about 71.5 mJ/cm(2). The laser action was further confirmed by a narrow emission linewidth of 0.13 nm and a degree of polarization of about 65%. The result suggests that practical blue-violet GaN-bsaed VCSEL can be realized by optimizing the laser lift-off technique for substrate removal.

Bulge testing and fracture properties of plasma-enhanced chemical vapor deposited silicon nitride thin films

The mechanical properties and fracture behavior of silicon nitride (SiNx) thin film fabricated by plasma-enhanced chemical vapor deposition is reported. Plane-strain moduli, prestresses, and fracture strengths of silicon nitride thin film; deposited both oil a bare Si substrate and oil a thermally oxidized Si substrate were extracted using bulge testing combined with a refined load-deflection model of long rectangular membranes. The plane-strain modu i and prestresses of SiNx thin films have little dependence on the substrates, that is, for the bare Si substrate, they are 133 +/- 19 GPa and 178 +/- 22 MPa, respectively, while for the thermally oxidized substrate, they are 140 +/- 26 Gila and 194 +/- 34 MPa, respectively. However, the fracture strength values of SiNx films grown on the two substrates are quite different, i.e., 1.53 +/- 0.33 Gila and 3.08 +/- 0.79 GPa for the bare Si substrate a A the oxidized Si substrate, respectively. The reference stresses were computed by integrating the local stress of the membrane at the fracture over the edge, Surface, and volume of the specimens and fitted with the Weibull distribution function. For SiNx thin film produced oil the bare Si Substrate, the Volume integration gave a significantly better agreement between data and model, implying that the volume flaws re the dominant fracture origin. For SiNx thin film grown on the oxidized Si substrate, the fit quality of surface and edge integration was significantly better than the Volume integration, and the dominant surface and edge flaws could be caused by buffered HF attacking the SiNx layer during SiO2 removal. Crown Copyright (C) 2008 Published by Elsevier B.V. All rights reserved.