Recent advances in radar technology

The technical developments and advances that have taken place thus far are reviewed in those areas impacting future phased array active aperture radar systems. The areas covered are printed circuit antennas and antenna arrays, GaAs MMIC design and fabrication leading to affordable transmitter-receiver (T-R) modules, and novel hardware and software developments. The use of fiber-optic distribution networks to interconnect the monolithically integrated optical components with the T-R modules is discussed. Beamforming and sidelobe control techniques for active phased array systems are also examined.

Biomass gasification: Environmentally sound technology for decentralized power generation, a case study from India

This study aims at understanding the need for decentralized power generation systems and to explore the potential, feasibility and environmental implications of biomass gasifier-based electricity generation systems for village electrification. Electricity needs of villages are in the range of 5–20 kW depending on the size of the village. Decentralized power generation systems are desirable for low load village situations as the cost of power transmission lines is reduced and transmission and distribution losses are minimised. A biomass gasifier-based electricity generation system is one of the feasible options; the technology is readily available and has already been field tested. To meet the lighting and stationary power needs of 500,000 villages in India the land required is only 16 Mha compared to over 100 Mha of degraded land available for tree planting. In fact all the 95 Mt of woody biomass required for gasification could be obtained through biomass conservation programmes such as biogas and improved cook stoves. Thus dedication of land for energy plantations may not be required. A shift to a biomass gasifier-based power generation system leads to local benefits such as village self reliance, local employment and skill generation and promotion of in situ plant diversity plus global benefits like no net CO2 emission (as sustainable biomass harvests are possible) and a reduction in CO2 emissions (when used to substitute thermal power and diesel in irrigation pump sets).

Processing maps for hot-working of powder metallurgy 1100 Al-10 vol % SiC-particulate metal-matrix composite

The hot-working characteristics of the metal-matrix composite (MMC) Al-10 vol % SiC-particulate (SiCp) powder metallurgy compacts in as-sintered and in hot-extruded conditions were studied using hot compression testing. On the basis of the stress-strain data as a function of temperature and strain rate, processing maps depicting the variation in the efficiency of power dissipation, given by eegr = 2m/(m+1), where m is the strain rate sensitivity of flow stress, have been established and are interpreted on the basis of the dynamic materials model. The as-sintered MMC exhibited a domain of dynamic recrystallization (DRX) with a peak efficiency of about 30% at a temperature of about 500°C and a strain rate of 0.01 s�1. At temperatures below 350°C and in the strain rate range 0.001�0.01 s�1 the MMC exhibited dynamic recovery. The as-sintered MMC was extruded at 500°C using a ram speed of 3 mm s�1 and an extrusion ratio of 10ratio1. A processing map was established on the extruded product, and this map showed that the DRX domain had shifted to lower temperature (450°C) and higher strain rate (1 s�1). The optimum temperature and strain rate combination for powder metallurgy billet conditioning are 500°C and 0.01 s�1, and the secondary metal-working on the extruded product may be done at a higher strain rate of 1 s�1 and a lower temperature of 425°C.

Solar pond technology

Solar pond technology has made substantial progress in the last fifteen years. This paper reviews the basic principles of solar ponds and the problems encountered in their operation and maintenance. The factors which influence the technical and economic viability of solar ponds for thermal applications and power generation have been discussed.

Structural refinement using high-resolution powder X-ray diffraction data of Ca0.5Ti2P3O12, a low-thermal-expansion material

The structures of Ca0.5Ti2P3O12 and Sr0.5Ti2P3O12, low-thermal-expansion materials, have been refined by the Rietveld method using high-resolution powder X-ray diffraction (XRD) data. The assignment of space group R[3 with combining macron] to NASICON-type compounds containing divalent cations is confirmed. 31P magic-angle spinning nuclear magnetic resonance (MASNMR) data are presented as supporting data. A comparison of changes in the polyhedral network resulting from the cation distribution, is made with NaTi2P3O12 and Nb2P3O12. Factors that may govern thermal expansion in this family of compounds are discussed.

Kinetics of oxidation of boron powder

The kinetics of the oxidation of electrodeposited boron powder and the boron powder produced by the reduction process were studied using thermogravimetry (TG). The oxidation was carried out by heating boron powder in a stream of oxygen. Both isothermal and non-isothermal methods were used to study the kinetics. Model-free isoconversional method was used to derive the kinetics parameters. A two step oxidation reaction (exothermic) was observed. The oxidation reaction could not be completed due to the formation of glassy layer of boric oxide on the surface of boron powder which acts as a barrier for further diffusion of oxygen into the particle. The activation energy obtained using model-free method for electrodeposited boron is 122 +/- 7 kJ mol(-1) whereas a value of 205 +/- 9 kJ mol(-1) was obtained for boron produced by the reduction process (commercially procured boron). Mechanistic interpretation of the oxidation reaction was done using model based method. The activation energy was found to depend on the size distribution of the particles and specific surface area of the powder. (C) 2010 Elsevier B.V. All rights reserved.

Electro-magnetically Actuated Minute Polymer Pump Fabricated using Packaging Technology

Design, fabrication and preliminary testing of a flat pump with millimetre thickness are described in this paper. The pump is entirely made of polymer materials barring the magnet and copper coils used for electromagnetic actuation. The fabrication is carried out using widely available microelectronic packaging machinery and techniques. Therefore, the fabrication of the pump is straightforward and inexpensive. Two types of prototypes are designed and built. One consists of copper coils that are etched on an epoxy plate and the other has wound insulated wire of 90 mu m diameter to serve as a coil. The overall size of the first pump is 25 mm x 25 mm x 3.6 mm including the 3.1 mm-thick NdFeB magnet of diameter 12 mm. It consists of a pump chamber of 20 mm x 20 mm x 0.8 mm with copper coils etched from a copper-clad epoxy plate using dry-film lithography and milled using a CNC milling machine, two passive valves and the pump-diaphragm made of Kapton film of 0.089 mm thickness. The second pump has an overall size of 35 mm x 35 mm x 4.4 mm including the magnet and the windings. A breadboard circuit and DC power supply are used to test the pump by applying an alternating square-wave voltage pulse. A water slug in a tube attached to the inlet is used to observe and measure the air-flow induced by the pump against atmospheric pressure. The maximum flow rate was found to be 15 ml/min for a voltage of 2.5 V and a current of 19 mA at 68 Hz.

An aqueous-solution based low-temperature pathway to synthesize giant dielectric CaCu3Ti4O12-Highly porous ceramic matrix and submicron sized powder

A simple, cost-effective and environment-friendly pathway for preparing highly porous matrix of giant dielectric material CaCu3Ti4O12 (CCTO) through combustion of a completely aqueous precursor solution is presented. The pathway yields phase-pure and impurity-less CCTO ceramic at an ultra-low temperature (700 degrees C) and is better than traditional solid-state reaction schemes which fail to produce pure phase at as high temperature as 1000 degrees C (Li, Schwartz, Phys. Rev. B 75, 012104). The porous ceramic matrix on grinding produced CCTO powder having particle size in submicron order with an average size 300 nm. On sintering at 1050 degrees C for 5 h the powder shows high dielectric constants (>10(4) at all frequencies from 100 Hz to 100 kHz) and low loss (with 0.05 as the lowest value) which is suitable for device applications. The reaction pathway is expected to be extended to prepare other multifunctional complex perovskite materials. (C) 2010 Elsevier B.V. All rights reserved.

Integrated optics � technology and applications

The emergence of optoelectronics and photonics as viable alternatives to electronics in many key areas of engineering relevance is indeed significant. This paper presents a tutorial review of integrated optics � a technologically important development in photonics. Materials, processes, device technology and applications are highlighted.

Sputter deposited LiPON thin films from powder target as electrolyte for thin film battery applications

Lithium phosphorus oxynitride (LiPON) thin films as solid electrolytes were prepared by reactive radio frequency (rf) magnetron sputtering from Li3PO4 powder compact target. High deposition rates and ease of manufacturing powder target compared with conventional ceramic Li3PO4 targets offer flexibility in handling and reduce the cost associated. Rf power density varied from 1.7 Wcm(-2) to 3 Wcm(-2) and N-2 flow from 10 to 30 sccm for a fixed substrate to target distance of 4 cm for best ionic conductivity. The surface chemical analysis done by X-ray photoelectron spectroscopy showed incorporation of nitrogen into the film as both triply, NE and doubly. Nd coordinated form. With increased presence of NE, ionic conductivity of LiPON was found to be increasing. The electrochemical impedance spectroscopy of LiPON films confirmed an ionic conductivity of 1.1 x 10(-6) Scm(-1) for optimum rf power and N-2 flow conditions. (C) 2011 Elsevier B.V. All rights reserved.

Processing map for controlling microstructure in hot working of hot isostatically pressed powder metallurgy NIMONIC AP-1 superalloy

The hot deformation behavior of hot isostatically pressed (HIP) NIMONIC AP-1 superalloy is characterized using processing maps in the temperature range 950-degrees-C to 1200-degrees-C and strain rate range 0.001 to 100 s-1. The dynamic materials model has been used for developing the processing maps which show the variation of the efficiency of power dissipation given by [2m/(m +1)] with temperature and strain rate, with m being the strain rate sensitivity of flow stress. The processing map revealed a domain of dynamic recrystallization with a peak efficiency of 40 pct at 1125-degrees-C and 0.3 s-1, and these are the optimum parameters for hot working. The microstructure developed under these conditions is free from prior particle boundary (PPB) defects, cracks, or localized shear bands. At 100 s-1 and 1200-degrees-C, the material exhibits inter-crystalline cracking, while at 0.001 s-1, the material shows wedge cracks at 1200-degrees-C and PPB cracking at 1000-degrees-C. Also at strain rates higher than 10 s-1, adiabatic shear bands occur; the limiting conditions for this flow instability are accurately predicted by a continuum criterion based on the principles of irreversible thermodynamics of large plastic flow.

Processing map for hot working of powder

The constitutive flow behavior of a metal matrix composite (MMC) with 2124 aluminum containing 20 vol pct silicon carbide particulates under hot-working conditions in the temperature range of 300 °C to 550 °C and strain-rate range of 0.001 to 1 s-1 has been studied using hot compression testing. Processing maps depicting the variation of the efficiency of power dissipation given by [2m/(m + 1)] (wherem is the strain-rate sensitivity of flow stress) with temperature and strain rate have been established for the MMC as well as for the matrix material. The maps have been interpreted on the basis of the Dynamic Materials Model (DMM). [3] The MMC exhibited a domain of superplasticity in the temperature range of 450 °C to 550 °C and at strain rates less than 0.1 s-1. At 500 °C and 1 s-1 strain rate, the MMC undergoes dynamic recrystallization (DRX), resulting in a reconstitution of microstructure. In comparison with the map for the matrix material, the DRX domain occurred at a strain rate higher by three orders of magnitude. At temperatures lower than 400 °C, the MMC exhibited dynamic recovery, while at 550 °C and 1 s-1, cracking occurred at the prior particle boundaries (representing surfaces of the initial powder particles). The optimum temperature and strain-rate combination for billet conditioning of the MMC is 500 °C and 1 s-1, while secondary metalworking may be done in the super- plasticity domain. The MMC undergoes microstructural instability at temperatures lower than 400 °C and strain rates higher than 0.1 s-1.

Design and realization of high-performance wave-pipelined 8×8 b multiplier in CMOS technology

Wave pipelining is a design technique for increasing the throughput of a digital circuit or system without introducing pipelining registers between adjacent combinational logic blocks in the circuit/system. However, this requires balancing of the delays along all the paths from the input to the output which comes the way of its implementation. Static CMOS is inherently susceptible to delay variation with input data, and hence, receives a low priority for wave pipelined digital design. On the other hand, ECL and CML, which are amenable to wave pipelining, lack the compactness and low power attributes of CMOS. In this paper we attempt to exploit wave pipelining in CMOS technology. We use a single generic building block in Normal Process Complementary Pass Transistor Logic (NPCPL), modeled after CPL, to achieve equal delay along all the propagation paths in the logic structure. An 8×8 b multiplier is designed using this logic in a 0.8 ?m technology. The carry-save multiplier architecture is modified suitably to support wave pipelining, viz., the logic depth of all the paths are made identical. The 1 mm×0.6 mm multiplier core supports a throughput of 400 MHz and dissipates a total power of 0.6 W. We develop simple enhancements to the NPCPL building blocks that allow the multiplier to sustain throughputs in excess of 600 MHz. The methodology can be extended to introduce wave pipelining in other circuits as well