906 resultados para Bill of Material (BOM)
Resumo:
Selective area growth (SAG) of GaN nanocolumns (NCs), making use of patterned or masked (nanoholes) substrates, yields a periodic, homogeneous distribution of nanostructures, that makes their processing much easier compared with self-assembled ones. In addition, the control on the diameter and density of NCs avoids dispersion in the electrooptical characteristics of the heterostructures based on this type of material (embedded InGaN/GaN quantum disks for example). Selective area growth using a mask with nanohole arrays has been demonstrated by rf-plasma-assisted MBE [1, 2].
Resumo:
Recent applications of Foucauldian categories in geography, spatial history and the history of town planning have opened up interesting new perspectives, with respect to both the evolution of spatial knowledge and the genealogy of territorial techniques and their relation to larger socio-political projects, that would be enriched if combined with other discursive traditions. This article proposes to conceptualise English parliamentary enclosureea favourite episode for Marxist historiography, frequently read in a strictly materialist fashioneas a precedent of a new form of sociospatial governmentality, a political technology that inaugurates a strategic manipulation of territory for social change on the threshold between feudal and capitalist spatial rationalities. I analyse the sociospatial dimensions of parliamentary enclosure’s technical and legal innovations and compare them to the forms of communal self-regulation of land use customs and everyday regionalisations that preceded it. Through a systematic, replicable mechanism of reterritorialisation, enclosure acts normalised spatial regulations, blurred regional differences in the social organisation of agriculture and erased the modes of autonomous social reproduction linked to common land. Their exercise of dispossession of material resources, social capital and community representations is interpreted therefore as an inaugural logic that would pervade the emergent spatial rationality later known as planning.
Resumo:
Monolithical series connection of silicon thin-film solar cells modules performed by laser scribing plays a very important role in the entire production of these devices. In the current laser process interconnection the two last steps are developed for a configuration of modules where the glass is essential as transparent substrate. In addition, the change of wavelength in the employed laser sources is sometimes enforced due to the nature of the different materials of the multilayer structure which make up the device. The aim of this work is to characterize the laser patterning involved in the monolithic interconnection process in a different configurations of processing than the usually performed with visible laser sources. To carry out this study, we use nanosecond and picosecond laser sources working at 355nm of wavelength in order to achieve the selective ablation of the material from the film side. To assess this selective removal of material has been used EDX (energy dispersive using X-ray) analysis
Resumo:
A novel methodology based on instrumented indentation is developed to determine the mechanical properties of amorphous materials which present cohesive-frictional behaviour. The approach is based on the concept of a universal hardness equation, which results from the assumption of a characteristic indentation pressure proportional to the hardness. The actual universal hardness equation is obtained from a detailed finite element analysis of the process of sharp indentation for a very wide range of material properties, and the inverse problem (i.e. how to extract the elastic modulus, the compressive yield strength and the friction angle) from instrumented indentation is solved. The applicability and limitations of the novel approach are highlighted. Finally, the model is validated against experimental data in metallic and ceramic glasses as well as polymers, covering a wide range of amorphous materials in terms of elastic modulus, yield strength and friction angle.