A moving-coil designed micro-mechanics tester with application on MEMS

A moving-coil designed micro-mechanics tester, named as MicroUTM (universal testing machine), is in-house developed in this paper for micro-mechanics tests. The main component is a moving coil suspended in a uniform magnetic field through a set of springs. When a current passes through the coil, the electromagnetic force is proportional to the magnitude of the current, so the load can easily be measured by the current. The displacement is measured using a capacitive sensor. The load is calibrated using a Sartorius BP211D analytical balance, with a resolution/range of 0.01 mg/80 g or 0.1 mg/210 g. The displacement is calibrated using a HEIDENHAIN CT-6002 length gauge with an accuracy of +/- 0.1 mu m. The calibration results show that the load range is +/- 1 N and the displacement range is +/- 300 mu m. The noise levels of the load and displacement are 50 mu N and 150 nm, respectively. The nonlinearity of the load is only 0.2%. Several in-plane load tests of the MEMS micro-cantilever are performed using this tester. Experimental results, with excellent repeatability, demonstrate the reliability of the load measurement as well as the flexible function of this tester.

Deflections and curvatures of a film-substrate structure with the presence of gradient stress in MEMS applications

The close form solutions of deflections and curvatures for a film-substrate composite structure with the presence of gradient stress are derived. With the definition of more precise kinematic assumption, the effect of axial loading due to residual gradient stress is incorporated in the governing equation. The curvature of film-substrate with the presence of gradient stress is shown to be nonuniform when the axial loading is nonzero. When the axial loading is zero, the curvature expressions of some structures derived in this paper recover the previous ones which assume the uniform curvature. Because residual gradient stress results in both moment and axial loading inside the film-substrate composite structure, measuring both the deflection and curvature is proposed as a safe way to uniquely determine the residual stress state inside a film-substrate composite structure with the presence of gradient stress.