915 resultados para Diamond coating
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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
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Pós-graduação em Odontologia Restauradora - ICT
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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
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This study aimed to evaluate the effect of Er:YAG (L) and diamond drills (DD) on: 1) the microshear bond strength (MPa); 2) the adhesive interface of two-step (TS) – Adper Scotchbond Multipurpose and one-step (OS) adhesives – Adper EasyOne, both from 3M ESPE. Material and methods: According to the preparation condition and adhesives, the samples were divided into four groups: DD_TS (control); DD_OS; L_TS and L_OS. 60 bovine incisors were randomly divided into experimental and groups: 40 for microshear bond strength (n = 10) and 20 for the adhesive interface morphology [6 to measure the thickness of the hybrid layer (HL) and length of tags (t) by CLSM (n = 3); 12 to the adhesive interface morphology by SEM (n = 3) and 2 to illustrate the effect of the instruments on dentine by SEM (n = 1)]. To conduct the microshear bond strength test, four cylinders (0.7 mm in diameter and 1 mm in height with area of adhesion of 0.38 mm) were constructed with resin composite (Filtek Z350 XT – 3M ESPE) on each dentin surface treated by either L or DD and after adhesives application. Microshear bond strength was performed in universal testing machine (EMIC 2000) with load cell of 500 kgf and a crosshead speed of 0.5 mm / min. Adhesive interface was characterized by thickness of hybrid layer (HL) and length of tags (t) in nm, with the aid of UTHSCSA ImageTool software. Results: Microshear bond strength values were: L_TS 34.10 ± 19.07, DD_TS 24.26 ± 9.35, L_OS 33.18 ± 12.46, DD_OS 21.24 ± 13.96. Two-way ANOVA resulted in statistically significant differences only for instruments (p = 0.047). Mann-Whitney identified the instruments which determined significant differences for HL thickness and tag length (t). Concerning to the adhesive types, these differences were only observed for (t). Conclusion: It can be concluded that 1) laser Er:YAG results in higher microshear bond strength values regardless of the adhesive system (TS and OS); 2) the tags did not significant affect the microshear bond strength; 3) the adhesive interface was affected by both the instruments for cavity preparation and the type of adhesive system used.
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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
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Objectives: This study investigated the repairs of resin composite restorations after using different surface treatments.Design: Eighty four truncated cones of Filtek Z350 were prepared and thermo-cycled (20,000 cycles). Surfaces were roughened with diamond bur and etched with 37% phosphoric acid. Those cones were divided into 7 groups (N=12): 1) Prime&Bond 2.1; 2) aluminum oxide sandblasting+Prime&Bond 2.1; 3) Er:YAG laser treatment+Prime&Bond 2.1; 4) 9.6% hydrofluoric acid for 2 min-Fsilane coupling agent.; 5) silane coupling agent; 6) auto-polymerized acrylic monomer+Prime&Bond 2.1; 7) Adper Scothbond SE. Teflon device was used to fabricate inverted truncated cones of repair composite over the surface-treated. The bonded specimens were stressed to failure under tension. The data were analyzed with oneway ANOVA and Tukey tests.Results: Mean repair strengths (SD, in MPa) were, Group-2: 18.8a; Group-1: 18.7a; Group-6: 13.4ab; Group-7: 9.5bc; Group-3: 7.5bcd; Group-4: 5.2cd; Group-5: 2.6d.Conclusions: The use of diamond bur and a conventional adhesive and the use of aluminum oxide sandblasting prior to adhesive provided a simple and cost-effective solutions to composite repair. Er:YAG laser, silane alone, 9.6% hydrofluoric acid plus silane or a self-etching adhesive results in inferior composite repair strengths. (C) 2015 Elsevier Ltd. All rights reserved.
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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
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With the currently strict environmental law in present days, researchers and industries are seeking to reduce the amount of cutting fluid used in machining. Minimum quantity lubrication is a potential alternative to reduce environmental impacts and overall process costs. This technique can substantially reduce cutting fluids in grinding, as well as provide better performance in relation to conventional cutting fluid application (abundant fluid flow). The present work aims to test the viability of minimum quantity lubrication (with and without water) in grinding of advanced ceramics, when compared to conventional method (abundant fluid flow). Measured output variables were grinding power, surface roughness, roundness errors and wheel wear, as well as scanning electron micrographs. The results show that minimum quantity lubrication with water (1:1) was superior to conventional lubrication-cooling in terms of surface quality, also reducing wheel wear, when compared to the other methods tested.
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Pós-graduação em Biopatologia Bucal - ICT
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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
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We have explored the suitability and characteristics of interface tailoring as a tool for enhancing the adhesion of hydrogen-free diamond-like carbon (DLC) thin films to silicon substrates. DLC films were deposited on silicon with and without application of an initial high energy carbon ion bombardment phase that formed a broad Si-C interface of gradually changing Si:C composition. The interface depth profile was calculated using the TRIDYN simulation program, revealing a gradient of carbon concentration including a region with the stoichiometry of silicon carbide. DLC films on silicon, with and without interface tailoring, were characterized using Raman spectroscopy, scanning electron microscopy, atomic force microscopy and scratch tests. The Raman spectroscopy results indicated sp3-type carbon bonding content of up to 80%. Formation of a broadened Si:C interface as formed here significantly enhances the adhesion of DLC films to the underlying silicon substrate. (C) 2012 Elsevier B.V. All rights reserved.