中国东北植被生态学研究中的焦点问题

中国东北植被经过半个多世纪的系统研究 ,但有关植被生态学一些争论性问题尚未统一 .本文仅就作者近年来研究工作涉及到的内容和关注的问题 ,提出一些看法 :1)中国东北植被地带性分布规律可用Kira的温暖指数 (WI)、寒冷指数 (CI)和作者的湿度指数 (HI)进行定量解释 .2 )大兴安岭北部山地 ,在海拔14 0 0m以上存在冻原植被 ,是作者于 196 3年首次发现的我国第三块冻原植被 ,其WI <15℃·月 .3)大小兴安岭植被分界线是我国植被区划中第一级分区界线 ,其位置在爱辉 -果松沟 -嫩江以南附近 ,WI为 4 5℃·月 .4 )大兴安岭植被地带性分异显著 ,南段、中段为典型草原地带和森林草原地带 ,北段为针叶林地带 ,HI值分别为 3 5～ 5 5、5 5～ 7 5、>7 5mm/℃·月 .大兴安岭东麓阔叶林是森林草原带上的森林植被类型 .5 )东北东部山地岳桦林是山地植被垂直带谱重要组成部分之一 ,是山地森林垂直分布林线 ,WI为 2 0～ 15℃·月为地带性植被类型 ,而WI>2 0℃·月为非地带性植被类型 .6 )内蒙古浑善达克沙地云杉林是陆地上非常罕见的森林生态系统类型 ,但这种云杉林究竟是哪一树种组成 ,在中国植物分类上一直是个争论性问题 ,作者通过核型分析和同工酶实验进一步证明是一个新种即沙地云杉Piceamongolica(H .Q .Wu)W .D .

Influence of annealing on structure of Nylon 11

Differential scanning calorimeter (DSC), wide-angle X-ray diffraction (WAXD), small-angle X-ray scattering (SAXS), and density techniques have been used to investigate the structural parameters of the solid state of Nylon 11 annealed at different temperatures. The equilibrium heat of fusion Delta H-m(0) and equilibrium melting temperature T-m(0) were estimated to be 189.05 J g(-1) and 202.85 degrees C respectively by using the Hoffman-Weeks approach. The degree of crystallinity (W-c,W-x) ranged approximately 24-42% was calculated by WAXD and compared with those by calorimetry (W-c,W-h) and density (W-c,W-d) measurements. The radius of gyration R-g, crystalline thickness L-c, noncrystalline thickness L-a, long period L, semiaxes of the particles (a, b), electron-density difference between the crystalline and noncrystalline regions eta(c) - eta(a), and the invariant Q increased with increasing annealing temperature. The analysis of the SAXS data was based upon the particle characteristic function and the one-dimensional electron-density correlation function. An interphase region existed between the crystalline and noncrystalline region with a clear dimension of about 2 nm for semicrystalline Nylon 11. Instead of the traditional two-phase model, a three-phase model has been proposed to explain these results by means of SAXS.

Variation of crystallographic parameters in PEEKK with heat treatment temperature

Using the wide-angle X-ray diffraction method, the variation of crystallographic parameters of poly(aryl ether ether ketone ketone) (PEEKK) has been studied in different heat treatment temperatures. All the reflections and their intensities as well as their Miller indices are presented in detail according to an orthorhombic system. The investigation indicates that the unit cell parameters a, b, c and the unit cell volume V systematically decrease with increasing heat treatment temperature. This variation is interpreted by the change of conformation of polymer molecular chains during thermal treatment. The results calculated from the formula of degree of crystallinity (W-c,W-x) for PEEKK, which was derived based on X-ray scattering intensity theory and the graphic multipeak resolution method, are compatible with the density measurement (W-c,W-d) and calorimetry (W-c,W-h) values. (C) 1997 Elesevier Science Ltd.

Crystal structure and crystallinity of poly(aryl ether biphenyl ether ketone ketone)

The crystal structure of poly(aryl ether biphenyl ether ketone ketone) (PEDEKK) was determined to comprise a two-chain orthorhombic unit cell with dimensions a 0.778 nm, b = 0.606 nm and c = 2.375 nm by using wide-angle X-ray diffraction (WAXD). According to the orthorhombic system, the 12 reflections of this polymer were indexed. The crystallite size increases with increasing the crystallization temperature. The results of the degree of crystallinity (W-c,W-x) calculated from WAXD were compatible with those from density (W-c,W-d) and calorimetry (W-c,W-h) measurements.

Analise computacional para estudo de genômica funcional. I. Identificação do domínio de ligação de calmodulina em proteinas HSP70 e BIP.

2003

Estudo de modelagem molecular por homologia para análise genômica funcional. I - BIP (Binding Protein).

2005

Produção de grãos em ambientes com nematoides de galhas.

2001

In the wake of the war canoe ; a stirring record of forty years' successful labour, peril & adventure amongst the savage Indian tribes of the Pacific coast, and the piratical headhunting Haidas of the Queen Charlotte Islands, B.C., with an introduction by the Lord Bishop of Derry.

http://www.archive.org/details/inwakeofwarcanoe00collrich

Arthur Douglas : missionary on Lake Nyasa, the story of his life

http://www.archive.org/details/arthurdouglasmi00douguoft

G. Ernest Wright Papers, 1957-1972

This collection primarily contains correspondence from Wright’s years as president of ASOR. Material dates as far back as 1957, and proceed into the early 1970’s. Some of Wright’s more notable correspondents include William F. Albright, A. Henry Detweiler, Paul W. Lapp, William Reed, and Dean Seiler. Subject-specific correspondence includes records of expenditures, budget planning, corporate memberships, and the Jerusalem School.

The Quick Mild Cognitive Impairment (Qmci) screen: developing a new screening test for mild cognitive impairment and dementia

Introduction: Identifying mild cognitive impairment (MCI) is challenging. Few short instruments have sufficient sensitivity and specificity for use in busy clinical practice. This thesis explores the development, psychometric evaluation and validation of a new short (3–5 min) cognitive screening instrument, designed to screen for MCI and early dementia, called the Quick Mild Cognitive Impairment (Q

Phase II Archaeological Excavations at 99 Main Street, 18AP21 (Sign of the Whale), Annapolis, Maryland

Historical Annapolis Foundation (HAF) conducted terrestrial archaeological investigations at site 18AP21 in the city of Annapolis, Maryland. Excavations were carried out at this National Register site ostensibly as a Phase II project to evaluate the site and assess the need for further work. The site is at 99 Main Street in the center of downtown Annapolis, near the Annapolis waterfront. The project was carried out as part of the advanced work for the Annapolis History Center project, to be built in the adjoining buildings of 99 Main and 196 Green Streets. The buildings are the property of the Historic Annapolis Foundation and located in Maryland Research Unit 7. The excavations were undertaken by HAF, and funded by HAFF. The work was conducted for HAF and MHT, who holds an archaeological easement on the property. This preliminary phase of work included stratigraphic excavation of two testpit units. These two units revealed that the site of the existing 99 Main Street building was the location of three previous constructions. The current building at 99 Main Street, built in 1791, was preceded by an earlier brick dwelling, evidenced by a stout pier of bricks, which was attached to a wooden-sided structure that stood on a foundation of brick and stone. Ceramics indicate that these buildings date to the early-middle of the 18th century. A third structure of post-in-ground construction, evidenced by recovery of burned posts and wood fragments, likely existed prior to these, but evidence was scant. These excavations reveal that the site of 18AP21 holds potential for understanding Annapolis's early cultural developments, especially in the area of initial settlement and the origins of waterfront commerce. The assemblage of artifacts recovered includes a broad sample of common 18th century pottery such as creamware and Chinese export porcelain, and also includes some early colonial types such as tin-glazed earthenware and various red-bodied slipwares. The excavations do not provide conclusive evidence of the construction sequence. Consultation with MHT representatives indicates that further work at the site will likely be needed before modifications to the floor of the building can progress.

Thermal-mechanical modelling of power electronic module packaging

In this paper the reliability of the isolation substrate and chip mountdown solder interconnect of power modules under thermal-mechanical loading has been analysed using a numerical modelling approach. The damage indicators such as the peel stress and the accumulated plastic work density in solder interconnect are calculated for a range of geometrical design parameters, and the effects of these parameters on the reliability are studied by using a combination of the finite element analysis (FEA) method and optimisation techniques. The sensitivities of the reliability of the isolation substrate and solder interconnect to the changes of the design parameters are obtained and optimal designs are studied using response surface approximation and gradient optimization method

Wire bond reliability for power electronic modules - effect of bonding temperature

In this paper, thermal cycling reliability along with ANSYS analysis of the residual stress generated in heavy-gauge Al bond wires at different bonding temperatures is reported. 99.999% pure Al wires of 375 mum in diameter, were ultrasonically bonded to silicon dies coated with a 5mum thick Al metallisation at 25degC (room temperature), 100degC and 200degC, respectively (with the same bonding parameters). The wire bonded samples were then subjected to thermal cycling in air from -60degC to +150degC. The degradation rate of the wire bonds was assessed by means of bond shear test and via microstructural characterisation. Prior to thermal cycling, the shear strength of all of the wire bonds was approximately equal to the shear strength of pure aluminum and independent of bonding temperature. During thermal cycling, however, the shear strength of room temperature bonded samples was observed to decrease more rapidly (as compared to bonds formed at 100degC and 200degC) as a result of a high crack propagation rate across the bonding area. In addition, modification of the grain structure at the bonding interface was also observed with bonding temperature, leading to changes in the mechanical properties of the wire. The heat and pressure induced by the high temperature bonding is believed to promote grain recovery and recrystallisation, softening the wires through removal of the dislocations and plastic strain energy. Coarse grains formed at the bonding interface after bonding at elevated temperatures may also contribute to greater resistance for crack propagation, thus lowering the wire bond degradation rate

Multi-physics modelling for microelectronics and microsystems - current capabilities and future challenges

At present the vast majority of Computer-Aided- Engineering (CAE) analysis calculations for microelectronic and microsystems technologies are undertaken using software tools that focus on single aspects of the physics taking place. For example, the design engineer may use one code to predict the airflow and thermal behavior of an electronic package, then another code to predict the stress in solder joints, and then yet another code to predict electromagnetic radiation throughout the system. The reason for this focus of mesh-based codes on separate parts of the governing physics is essentially due to the numerical technologies used to solve the partial differential equations, combined with the subsequent heritage structure in the software codes. Using different software tools, that each requires model build and meshing, leads to a large investment in time, and hence cost, to undertake each of the simulations. During the last ten years there has been significant developments in the modelling community around multi- physics analysis. These developments are being followed by many of the code vendors who are now providing multi-physics capabilities in their software tools. This paper illustrates current capabilities of multi-physics technology and highlights some of the future challenges