Influence of composition on the structure, electric and magnetic properties of Pd-Mn-P and Pd-Co-P amorphous alloys

The influence of composition on the structure and on the electric and magnetic properties of amorphous Pd-Mn-P and Pd-Co-P prepared by rapid quenching techniques were investigated in terms of (1) the 3d band filling of the first transition metal group, (2) the phosphorus concentration effect which acts as an electron donor and (3) the transition metal concentration.

The structure is essentially characterized by a set of polyhedra subunits essentially inverse to the packing of hard spheres in real space. Examination of computer generated distribution functions using Monte Carlo random statistical distribution of these polyhedra entities demonstrated tile reproducibility of the experimentally calculated atomic distribution function. As a result, several possible "structural parameters" are proposed such as: the number of nearest neighbors, the metal-to-metal distance, the degree of short-range order and the affinity between metal-metal and metal-metalloid. It is shown that the degree of disorder increases from Ni to Mn. Similar behavior is observed with increase in the phosphorus concentration.

The magnetic properties of Pd-Co-P alloys show that they are ferromagnetic with a Curie temperature between 272 and 399°K as the cobalt concentration increases from 15 to 50 at.%. Below 20 at.% Co the short-range exchange interactions which produce the ferromagnetism are unable to establish a long-range magnetic order and a peak in the magnetization shows up at the lowest temperature range . The electric resistivity measurements were performed from liquid helium temperatures up to the vicinity of the melting point (900°K). The thermomagnetic analysis was carried out under an applied field of 6.0 kOe. The electrical resistivity of Pd-Co-P shows the coexistence of a Kondo-like minimum with ferromagnetism. The minimum becomes less important as the transition metal concentration increases and the coefficients of ℓn T and T^2 become smaller and strongly temperature dependent. The negative magnetoresistivity is a strong indication of the existence of localized moment.

The temperature coefficient of resistivity which is positive for Pd- Fe-P, Pd-Ni-P, and Pd-Co-P becomes negative for Pd-Mn-P. It is possible to account for the negative temperature dependence by the localized spin fluctuation model and the high density of states at the Fermi energy which becomes maximum between Mn and Cr. The magnetization curves for Pd-Mn-P are typical of those resulting from the interplay of different exchange forces. The established relationship between susceptibility and resistivity confirms the localized spin fluctuation model. The magnetoresistivity of Pd-Mn-P could be interpreted in tenns of a short-range magnetic ordering that could arise from the Rudennan-Kittel type interactions.

A generalized treatment of the order-disorder transformation in alloys and its effects on their magnetic properties

A theory of the order-disorder transformation is developed in complete generality. The general theory is used to calculate long range order parameters, short range order parameters, energy, and phase diagrams for a face centered cubic binary alloy. The theoretical results are compared to the experimental determination of the copper-gold system, Values for the two adjustable parameters are obtained.

An explanation for the behavior of magnetic alloys is developed, Curie temperatures and magnetic moments of the first transition series elements and their alloys in both the ordered and disordered states are predicted. Experimental agreement is excellent in most cases. It is predicted that the state of order can effect the magnetic properties of an alloy to a considerable extent in alloys such as Ni₃Mn. The values of the adjustable parameter used to fix the level of the Curie temperature, and the adjustable parameter that expresses the effect of ordering on the Curie temperature are obtained.

Heteroepitaxy of Group IV and Group III-V semiconductor alloys for photovoltaic applications

Photovoltaic energy conversion represents a economically viable technology for realizing collection of the largest energy resource known to the Earth -- the sun. Energy conversion efficiency is the most leveraging factor in the price of energy derived from this process. This thesis focuses on two routes for high efficiency, low cost devices: first, to use Group IV semiconductor alloy wire array bottom cells and epitaxially grown Group III-V compound semiconductor alloy top cells in a tandem configuration, and second, GaP growth on planar Si for heterojunction and tandem cell applications.

Metal catalyzed vapor-liquid-solid grown microwire arrays are an intriguing alternative for wafer-free Si and SiGe materials which can be removed as flexible membranes. Selected area Cu-catalyzed vapor-liquid solid growth of SiGe microwires is achieved using chlorosilane and chlorogermane precursors. The composition can be tuned up to 12% Ge with a simultaneous decrease in the growth rate from 7 to 1 μm/min^-1. Significant changes to the morphology were observed, including tapering and faceting on the sidewalls and along the lengths of the wires. Characterization of axial and radial cross sections with transmission electron microscopy revealed no evidence of defects at facet corners and edges, and the tapering is shown to be due to in-situ removal of catalyst material during growth. X-ray diffraction and transmission electron microscopy reveal a Ge-rich crystal at the tip of the wires, strongly suggesting that the Ge incorporation is limited by the crystallization rate.

Tandem Ga_1-xIn_xP/Si microwire array solar cells are a route towards a high efficiency, low cost, flexible, wafer-free solar technology. Realizing tandem Group III-V compound semiconductor/Si wire array devices requires optimization of materials growth and device performance. GaP and Ga_1-xIn_xP layers were grown heteroepitaxially with metalorganic chemical vapor deposition on Si microwire array substrates. The layer morphology and crystalline quality have been studied with scanning electron microscopy and transmission electron microscopy, and they provide a baseline for the growth and characterization of a full device stack. Ultimately, the complexity of the substrates and the prevalence of defects resulted in material without detectable photoluminescence, unsuitable for optoelectronic applications.

Coupled full-field optical and device physics simulations of a Ga_0.51In_0.49P/Si wire array tandem are used to predict device performance. A 500 nm thick, highly doped "buffer" layer between the bottom cell and tunnel junction is assumed to harbor a high density of lattice mismatch and heteroepitaxial defects. Under simulated AM1.5G illumination, the device structure explored in this work has a simulated efficiency of 23.84% with realistic top cell SRH lifetimes and surface recombination velocities. The relative insensitivity to surface recombination is likely due to optical generation further away from the free surfaces and interfaces of the device structure.

Finally, GaP has been grown free of antiphase domains on Si (112) oriented substrates using metalorganic chemical vapor deposition. Low temperature pulsed nucleation is followed by high temperature continuous growth, yielding smooth, specular thin films. Atomic force microscopy topography mapping showed very smooth surfaces (4-6 Å RMS roughness) with small depressions in the surface. Thin films (~ 50 nm) were pseudomorphic, as confirmed by high resolution x-ray diffraction reciprocal space mapping, and 200 nm thick films showed full relaxation. Transmission electron microscopy showed no evidence of antiphase domain formation, but there is a population of microtwin and stacking fault defects.

Avaliação da microestrutura, microdureza e resistência à corrosão de juntas soldadas de uma liga de Ni-Cr obtidas através de diferentes processos de soldagem

Este trabalho avaliou o comportamento eletroquímico do metal de base (MB) de uma liga a base de níquel-cromo em relação a juntas soldadas desta liga obtidas pelos processos de brasagem (BRA) e Tungsten Inert Gas (TIG), imersos em saliva artificial com pH 2,5 e 5,5. Foram também realizados ensaios de microdureza e caracterização microestrutural, por meio de microscopia óptica e eletrônica de varredura e análise química semi-quantitativa por EDS, nos grupos MB, TIG, BRA e no cordão de solda a laser (LAS). O MB apresentou uma matriz rica em níquel e cromo, distribuída em um arranjo dendrítico típico, apresentando inclusões metálicas de silício e titânio, além de porosidades. As soldas TIG e LAS revelaram uma microestrutura mais refinada que o MB, mostrando, entretanto, uma mesma composição química e distribuição de seus elementos. A solda BRA apresentou diferenças marcantes em sua microestrutura, composição química e distribuição de seus elementos em relação ao MB. Os dados de microdureza Vickers (HV), potencial de corrosão (Ecorr) e densidade de corrente de corrosão (jcorr) foram analisados com ANOVA e teste de Tukey (p<0,05). Para determinação da influência do pH quanto a resistência à corrosão dos grupos MB, TIG e BRA, empregou-se o teste t de Student (p<0,05). O MB apresentou menor média de microdureza (256,13 9,39 HV), seguido pelos grupos TIG (271,53 8,07 HV), LAS (303,73 13,93 HV) e BRA (551,99 37,73 HV). Em pH 2,5 as médias do Ecorr (mV) para o MB, TIG e BRA foram, respectivamente, -67,9 8,43, -52,78 16,74, e -284,33 19,04; e em pH 5,5, médias de -54,03 21,15, -62,08 20,16 e -278,8 28,96. Os valores médios de jcorr (A.cm-2) para o MB, TIG e BRA em pH 2,5 foram, respectivamente, 2,49 0,95, 5,584 1,64 e 27,45 4,9; e em pH 5,5, médias de 1,929 0,83, 4,267 1,51 e 54,2 11,96. Os grupos MB e TIG apresentaram boa resistência à corrosão, com maior módulo de impedância em relação ao grupo BRA. As diferenças no pH da saliva artificial não alteraram o comportamento corrosivo dos grupos MB e TIG. Entretanto, observou-se uma redução marcante na jcorr e no módulo de impedância nas soldas obtidas pelo processo de brasagem. O grupo BRA apresentou corrosão galvânica ao ser analisado formando par com o MB, mostrando uma jcorr de 5,3 A.cm-2. Entretanto, o mesmo não foi observado quando o MB foi associado à solda TIG, onde a jcorr foi cerca de 150 vezes menor. O grupo BRA, além de apresentar um comportamento eletroquímico muito diferente do MB, revelou diferenças marcantes quanto a composição química, aspecto microestrutural e microdureza. As juntas TIG e LAS mostraram semelhanças químicas e microestruturais em relação ao MB, sendo que na solda TIG esta semelhança foi ainda mais evidente. Além disto, a solda TIG apresentou um comportamento eletroquímico muito semelhante ao MB e, portanto, parecendo ser mais recomendável para soldar ligas odontológicas de níquel-cromo em relação aos demais processos de soldagem aqui avaliados.

Estudo de Eletrodeposição de Ligas Cu-Sn em Meio de Citrato de Sódio

Revestimentos produzidos a partir de ligas de Cu-Sn apresentam grande interesse em função de suas propriedades, originando uma grande capacidade de aplicação industrial, especialmente em indústrias de componentes e materiais eletrônicos. Tais ligas também têm sido comercialmente utilizadas como revestimentos em metais diferentes, como o aço, para protegê-los contra a corrosão e melhorar sua aparência. Na presente dissertação, técnicas de voltametria cíclica, cronoamperometria e voltametria de varredura anódica linear foram utilizadas para o estudo dos processos de deposição de Cu e/ou Sn a partir de dois conjuntos de soluções contendo CuCl2.2H2O e SnCl2.2H2O nas razões de Cu:Sn = 1:10 e 10:1, além de Na3C6H5O7 1,00 mol/L, em pH = 6,0. As curvas de voltametria cíclica realizadas sobre o eletrodo de grafita foram utilizadas para o cálculo das constantes de equilíbrio dos complexos de ambos os metais com citrato de sódio, bem como na determinação dos potenciais catódicos aplicados nos ensaios de cronoamperometria. Após a deposição da liga nos potenciais estipulados para cada uma das duas soluções, os revestimentos de liga Cu-Sn foram ressolubilizados em solução de NaNO3 0,5 mol/L, empregando varredura anódica linear para a avaliação de suas composições químicas. Os resultados iniciais mostraram que a variação da concentração de Cu (II) e do potencial aplicado influenciaram no teor de cobre na liga. Contudo, percebeu-se que o teor de estanho não sofreu grandes variações, independente das concentrações das soluções e do potencial aplicado. Na solução com maior concentração de cobre foram alcançados teores dos metais na liga em maior proximidade com o da liga de bronze comercial. Com base nesses resultados, foram produzidos revestimentos de ligas sobre substrato de aço carbono, a partir de soluções contendo CuCl2.2H2O e SnCl2.2H2O na razão de 10:1, empregando a técnica de cronoamperometria potenciostática. Quatro diferentes valores de potencial (-0,39V, -0,67V, -1,00V, -1,20V e -1,94V vs. Ag/AgClsat.) foram aplicados, obtendo-se camadas cujas colorações variaram do rosa claro ao marrom escuro, sempre sem brilho. A eficiência de corrente catódica (Ef) decresceu conforme o potencial aplicado se tornou mais negativo. Nesta mesma direção, verificou-se um aumento do teor de estanho na liga depositada e menores tamanhos de grão. Porém, quando o potencial tornou-se mais negativo (-1,20V e -1,94V), observou-se a presença de cristalitos de diferentes tamanhos e de dendritos. Revestimentos com melhores resistências à corrosão em solução de NaCl 0,5 mol/L foram produzidos nos potenciais de -1,00V e -1,20V, cujas composições foram 99,40 % m/m Cu / 0,60 % m/m Sn e 97,70 % m/m Cu / 2,30 % m/m Sn, respectivamente. As análises por DRX permitiram verificar que estes revestimentos eram constituídos, principalmente, da fase α-CuSn

Controlled crystallinity and crystallographic orientation of Cu nanowires fabricated in ion-track templates

The hallmark of materials science is the ability to tailor the structures of a given material to provide a desired response. In this work, the structures involving crystallinity and crystallographic orientation of Cu nanowires electrochemically fabricated in ion-track templates have been investigated as a function of fabrication condition. Both single crystalline and polycrystalline nanowires were obtained by adjusting applied voltages and temperatures of electrochemical deposition. The anti-Hall-Petch effect was experimentally evidenced in the polycrystalline nanowires. The dominant crystallographic orientations of wires along [111], [100], or [110] directions were obtained by selecting electrochemical deposition conditions, i.e., H2SO4 concentration in electrolyte, applied voltage, and electrodeposition temperature.

Electrocatalytic properties of Cu-Zr amorphous alloy towards the electrochemical hydrogenation of nitrobenzene

The Cu-Zr amorphous alloy was studied as an electrocatalyst towards the electrochemical hydrogenation of nitrobenzene. The electrocatalyst was activated by chemical etching in HF solution. Resulted changes in the morphology, chemical composition and crystalline structure of the electrocatalyst surface were characterised by scanning electron microscopy, X-ray diffraction and Auger electron spectroscopy. The electrocatalytic properties of the Cu-Zr amorphous alloy were assessed by voltammetric measurements. Due to the formation and aggregation of Zr residue modified Cu nanocrystals on the surface caused by the selective dissolution of Zr components in the chemical etching, the activated amorphous alloy is an effective electrocatalyst for the electrochemical reduction reaction of nitrobenzene with aniline as the main product. The positive shift of the peak potential and accompanying increase in the value of peak current in voltammograms with increasing Cu content and decreasing Zr content of the alloy surface in the chemical etching are indicative of improved electrocatalytic activity. (C) 2002 Elsevier Science B.V. All rights reserved.

Structure and electrochemical characteristics of melted composite Ti0.10Zr0.15V0.35Cr0.10Ni0.30-LaNi5 hydrogen storage alloys

The structure and electrochemical characteristics of melted composite Ti0.10Zr0.15V0.35Cr0.10Ni0.30+x% LaNi5 (x=0, 1, 5 and 10) hydrogen storage alloys have been investigated systematically. XRD shows that the matrix phase structure of V-based solid solution phase with a BCC structure and C14 Laves phase with hexagonal structure is not changed after adding LaNi5 alloy. However, the amount of the secondary phase increases with increasing LaNi5 content. Field emission scanning electron microscopy-energy dispersive spectroscopy (FESEM-EDS) shows that the C14 Laves phase contains more Zr and the white lard phase has a composition close to (Zr, Ti)(V, Cr, Ni, La)(2).

Structures and electrochemical characteristics of Ti0.26Zr0.07V0.24Mn0.1Ni0.33Mox (x=0-0.1) hydrogen storage alloys

Microstructures and electrochemical properties of Ti0.26Zr0.07V0.21Mn0.1Ni0.33Mox (x=0,0.025,0.05,0.075, 0.10) electrode alloys have been investigated. The results of XRD analysis show that the alloys are mainly composed of V-based solid solution phase with body centered cubic (bcc) structure and C14 Laves phase with hexagonal structure. The addition of Mo element can imp ove the activation characteristics, maximum discharge capacity and cyclic durability for the electrode alloys

Perovskite-Like Mixed Oxides (LaSrMn1-x Ni (x) O4+delta, 0 a parts per thousand currency sign x a parts per thousand currency sign 1) as Catalyst for Catalytic NO Decomposition: TPD and TPR Studies

Catalytic NO decomposition on LaSrMn1-x Ni (x) O4+delta (0 a parts per thousand currency sign x a parts per thousand currency sign 1) is investigated. The activity of NO decomposition increases dramatically after the substitution of Ni for Mn, but decreases when Mn is completely replaced by Ni (x = 1.0). The optimum value is at x = 0.8. These indicate that the catalytic performance of the samples is contributed by the synergistic effect of Mn and Ni. O-2-TPD and H-2-TPR experiments are carried out to explain the change of activity. The former indicates that only when oxygen vacancy is created, could the catalyst show enhanced activity for NO decomposition; the latter suggests that the best activity is obtained from catalyst with the most matched redox potentials (in this work, the biggest Delta T and Delta E values).

Structure and electrochemical characteristics of TiV1.1Mn0.9Nix (x=0.1-0.7) alloys

The structure and electrochemical properties of TiV1.1Mn0.9Nix (x = 0.1-0.7) solid solution electrode alloys have been investigated. It is found that these alloys mainly consist of a solid solution phase with body centered cubic (bcc) structure and a C14 Laves secondary phase. The solid solution alloys show easy activation behavior, high temperature dischargeability, high discharge capacity and favorable high-rate dischargeability as a negative electrode material in Ni-MH battery. The maximum discharge capacity is 502 mAh g(-1) at 303 K when x = 0.4. Electrochemical impedance spectroscopy (EIS) test shows that the charge-transfer resistance at the surface of the alloy electrodes decreases obviously with increasing Ni content.

Cu掺杂的NiO的制备及其超级电容器性能

采用低热固相反应法合成掺杂Cu的Ni(OH)2,将其在300℃下热处理得到相应的NiO.电化学测试表明∶掺杂量为n(Ni)∶n(Cu)=100∶0.25时,NiO电极的比容量最高,为99-120 F/g,具有良好的充放电性能,而不掺杂的只有83-111 F/g,因此掺杂Cu有利于提高NiO的电化学性能.