Computer modelling of the reliability of flip chips with metal column bumping

Recently, research has been carried out to test a novel bumping method which omits the under bump metallurgy forming process by bonding copper columns directly onto the Al pads of the silicon dies. This bumping method could be adopted to simplify the flip chip manufacturing process, increase the productivity and achieve a higher I/O count. This paper describes an investigation of the solder joint reliability of flip-chips based on this new bumping process. Computer modelling methods are used to predict the shape of solder joints and response of flip chips to thermal cyclic loading. The accumulated plastic strain energy at the comer solder joints is used as the damage indicator. Models with a range of design parameters have been compared for their reliability. The parameters that have been investigated are the copper column height, radius and solder volume. The ranking of the relative importance of these parameters is given. For most of the results presented in the paper, the solder material has been assumed to be the lead-free 96.5Sn3.5Ag alloy but some results for 60Sn40Pb solder joints have also been presented.

Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips

Cu column bumping is a novel flip chip packaging technique that allows Cu columns to be bonded directly with the dies. It has eliminated the under-bump-metallurgy (UBM) fonnation step of the traditional flip chip manufacturing process. This bumping technique has the potential benefits of simplifying the flip chip manufacturing process, increasing productivity and the UO counts. In this paper, a study of reliability of Cu column bumped flip chips will be presented. Computer modelling methods have been used to predict the shape of solder joints and the response of flip chips to cyclic thermal-mechanical loading. The accumulated plastic strain energy at the corner solder joints has been used as an indicator of the solder joint reliability. Models with a wide range of design parameters have been compared for their reliability. The design parameters that have been investigated are the copper column height and radius, PCB pad radius, solder volume and Cu column wetting height. The relative importance ranking of these parameters has been obtained. The Lead-free solder material 96.5Sn3.5Ag has been used in this modelling work.

Wire bond reliability for power electronic modules - effect of bonding temperature

In this paper, thermal cycling reliability along with ANSYS analysis of the residual stress generated in heavy-gauge Al bond wires at different bonding temperatures is reported. 99.999% pure Al wires of 375 mum in diameter, were ultrasonically bonded to silicon dies coated with a 5mum thick Al metallisation at 25degC (room temperature), 100degC and 200degC, respectively (with the same bonding parameters). The wire bonded samples were then subjected to thermal cycling in air from -60degC to +150degC. The degradation rate of the wire bonds was assessed by means of bond shear test and via microstructural characterisation. Prior to thermal cycling, the shear strength of all of the wire bonds was approximately equal to the shear strength of pure aluminum and independent of bonding temperature. During thermal cycling, however, the shear strength of room temperature bonded samples was observed to decrease more rapidly (as compared to bonds formed at 100degC and 200degC) as a result of a high crack propagation rate across the bonding area. In addition, modification of the grain structure at the bonding interface was also observed with bonding temperature, leading to changes in the mechanical properties of the wire. The heat and pressure induced by the high temperature bonding is believed to promote grain recovery and recrystallisation, softening the wires through removal of the dislocations and plastic strain energy. Coarse grains formed at the bonding interface after bonding at elevated temperatures may also contribute to greater resistance for crack propagation, thus lowering the wire bond degradation rate

Reliability analysis of SiP structures

This presentation discusses latest developments in SiP technology and the challenges for design in terms of manufacture and reliability. It presents results from a UK government funded project that aims to develop modelling techniques that will assess the thermo-mechanical reliability of SiP structures such as (i) stacked die, (ii) side-by-side dies and (iii) embedded die. Finite element analysis coupled with numerical optimisation and uncertainty analysis is used is used to model the reliability of a particular package design. In particular, the damage (energy density) in the lead free solder interconnects under accelerated temperature cycling is predicted and used to observe the fatigue life-time. Warpage of the structure is also investigated

Reliability based design optimisation for system-in-package

This paper discusses a reliability based optimisation modelling approach demonstrated for the design of a SiP structure integrated by stacking dies one upon the other. In this investigation the focus is on the strategy for handling the uncertainties in the package design inputs and their implementation into the design optimisation modelling framework. The analysis of fhermo-mechanical behaviour of the package is utilised to predict the fatigue life-time of the lead-free board level solder interconnects and warpage of the package under thermal cycling. The SiP characterisation is obtained through the exploitation of Reduced Order Models (ROM) constructed using high fidelity analysis and Design of Experiments (DoE) methods. The design task is to identify the optimal SiP design specification by varying several package input parameters so that a specified target reliability of the solder joints is achieved and in the same time design requirements and package performance criteria are met

Pädagogisches Wissen in Bildern. Zum Bildprogramm der französischen Ausgaben des 18. Jahrhunderts von Rousseaus "Émile"

Aus Anlass der 250. Wiederkehr der Erstauflage von Rousseaus Werk "Émile oder über die Erziehung" widmet sich der Text der Analyse seiner Illustrationen. Die französischen Ausgaben des 18. Jahrhunderts wurden mit Kupferstichen von unterschiedlichen Künstlern gestaltet. Dabei war das Bildprogramm der Erstausgabe des Jahres 1762 noch von Rousseau autorisiert, während die posthumen Auflagen dies nicht mehr waren und einen vollständigen Wechsel des Bildprogramms vollziehen. Diese beiden unterschiedlichen Bildprogramme werden analysiert und in den Kontext ihrer Druckgeschichte gestellt. Dabei zeigt sich, auf welche Art das pädagogische Hauptwerk Rousseaus bildlich illustriert wird. (DIPF/Orig.)

Risikowahrnehmung und psychologische Reaktionen in öffentlichen Krisensituationen am Beispiel von Terrorattentaten / Risk perception and psychological reactions in public crisis situations using the example of terror attacks

The reactions to the 9/11 terror attacks were immense in the western population. In the current review, the impact of terror attacks is presented with surveys, clinical interviews, and scientific polls, which were identified in a comprehensive literature search. Results show that the fear of further terror attacks is comparatively overestimated in the population and is associated with numerous psychological consequences and reactions. The overestimation of the probability of further terror attacks is related among other reasons to its unique features and its strong representation in the media. Several independent studies proved that the number of stress symptoms and psychiatric diagnoses is associated with a high risk perception in relation to terror attacks. This was not only the case for victims of terror attacks, but also for people indirectly exposed to the terror attacks. In addition, there is evidence that the number of the stress symptoms correlate with the duration of TV consumption of new findings about terror attempts. Methodologically, there is a critical lack of more in-depth analyses to explain the development of risk perceptions and its influence on mental and physical health. Because of the international importance and cross-cultural differences, an international standardization of research is desirable. [In German] Die Reaktionen auf die Terrorattentate vom 9. September 2001 in New York waren in der westlichen Bevölkerung immens. In der vorliegenden Übersichtsarbeit werden die Auswirkungen von Terrorattentaten durch Einbeziehung bevölkerungsrepräsentativer Untersuchungen, Surveys, klinischer Interviews und Einstellungsbefragungen dargestellt, die über eine deskriptive Literaturrecherche ermittelt wurden. Als Ergebnis des Reviews zeigt sich, dass die Angst vor weiteren Terrorattentaten in der Bevölkerung vergleichsweise hoch und mit zahlreichen psychologischen Folgen und Reaktionen assoziiert ist. Die Einschätzung der Auftretenswahrscheinlichkeit eines Terrorattentats hängt unter anderem mit den besonderen Charakteristika und der hohen medialen Präsenz des Themas zusammen. Die Anzahl der Stresssymptome bis hin zu psychiatrischen Diagnosen erwies sich in mehreren unabhängigen Untersuchungen mit einer hohen Risikowahrnehmung assoziiert. Dies ließ sich nicht nur bei den Opfern von Terrorattentaten, sondern auch bei indirekt Betroffenen zeigen. Darüber hinaus gibt es mehrfache Belege dafür, dass die Anzahl der Stresssymptome mit der Dauer des TV-Konsums über Neuigkeiten zu Terrorattentaten zusammenhing. Als methodische Kritik ist an den gegenwärtigen Untersuchungsszenarien einzuwenden, dass es derzeit keine tiefer gehenden Analysen zur Entwicklung der Risikowahrnehmung und zu ihrem Einfluss auf die Gesundheit gibt. Aufgrund der internationalen Bedeutung des Themas und der interkulturellen Unterschiede im Umgang mit Krisensituationen ist eine internationale Standardisierung von Untersuchungszugängen wünschenswert.

Microwave curing of thermosetting polymer materials in microelectronics applications

Thermosetting polymer materials are widely utilised in modern microelectronics packaging technology. These materials are used for a number of functions, such as for device bonding, for structural support applications and for physical protection of semiconductor dies. Typically, convection heating systems are used to raise the temperature of the materials to expedite the polymerisation process. The convection cure process has a number of drawbacks including process durations generally in excess of 1 hour and the requirement to heat the entire printed circuit board assembly, inducing thermomechanical stresses which effect device reliability. Microwave energy is able to raise the temperature of materials in a rapid, controlled manner. As the microwave energy penetrates into the polymer materials, the heating can be considered volumetric – i.e. the rate of heating is approximately constant throughout the material. This enables a maximal heating rate far greater than is available with convection oven systems which only raise the surface temperature of the polymer material and rely on thermal conductivity to transfer heat energy into the bulk. The high heating rate, combined with the ability to vary the operating power of the microwave system, enables the extremely rapid cure processes. Microwave curing of a commercially available encapsulation material has been studied experimentally and through use of numerical modelling techniques. The material assessed is Henkel EO-1080, a single component thermosetting epoxy. The producer has suggested three typical convection oven cure options for EO1080: 20 min at 150C or 90 min at 140C or 120 min at 110C. Rapid curing of materials of this type using advanced microwave systems, such as the FAMOBS system [1], is of great interest to microelectronics system manufacturers as it has the potential to reduce manufacturing costs, increase device reliability and enables new device designs. Experimental analysis has demonstrated that, in a realistic chip-on-board encapsulation scenario, the polymer material can be fully cured in approximately one minute. This corresponds to a reduction in cure time of approximately 95 percent relative to the convection oven process. Numerical assessment of the process [2] also suggests that cure times of approximately 70 seconds are feasible whilst indicating that the decrease in process duration comes at the expense of variation in degree of cure within the polymer.

Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes

This paper concerns the use of a non-destructive ultrasonic technique for characterising the rheological properties of solder paste and specifically, the use of through-mode microsecond ultrasonic pulses for evaluation of viscoelastic properties of paste materials at the molecular level. Ultrasonic techniques are a widely used and a reliable form of non-destructive testing of materials. This is because techniques such as ultrasounds while used for testing or monitoring material properties, has offered immense benefits in applications where access to the sample is restricted or when handling the sample for testing could interfere with the monitoring or analysis process. Very often, this would mean that the measurements taken are not a true representation of the behaviour of the material (due to externally incorporated changes into the material's physical state during the removal or testing process). Ultrasonic based techniques are being increasingly used for quality control and production monitoring functions which requires evaluation of the changes in material properties over wide range of industrial applications such as cement paste quality, plastic/polymer extrusion process, dough, and even sugar content in beverage drinks. In addition, ultrasound techniques are of great interest for their capacity to take rapid measurements in systems which are optically opaque. The viscometer and rheometer are two of the most widely used rheological instruments used in industry for monitoring the quality of solder pastes, during the production and packaging stage. One of the potential limitations of viscometer and rheometer based measurements is that the collection and preparation of the solder paste samples can irreversibly alter the structure and flow behaviour of the sample. Hence the measurement may not represent the actual quality of the whole production batch. Secondly, rheological measurements and the interpretation of rheological data is a very technical and time consuming process, which requires professionally trained R&D personnel. It is for these reasons that materials suppliers (who formulate and produce solder pastes) and solder paste consumers (especially, contract electronics manufacturers) are keen to see the development of simple, easy to use and accurate techniques for the theological characterisation of solder pastes. The results from the work show that the technique can be used by R&D personnel involved in paste formulation and manufacture to monitor the batch-to-batch quality and consistency.

In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications

This paper investigates the application of a non-destructive ultrasonic technique for characterising the rheological properties of solder paste through the use of through-mode microsecond ultrasonic pulses for evaluation of viscoelastic properties of lead-free solder paste containing different types of flux. Ultrasonic techniques offer a robust and reliable form of non-destructive testing of materials where access to the sample is restricted or when sample handling can interfere with the monitoring or analysis process due to externally incorporated changes to the material’s physical state or accidental contamination during the removal or testing process. Ultrasonic based techniques are increasingly used for quality control and production monitoring functions which requires evaluation of changes in material properties for a wide range of industrial applications such as cement paste quality, plastic/polymer extrusion process, dough and even sugar content in beverage drinks. In addition, ultrasound techniques are of great interest for their capability to take rapid measurements in systems which are optically opaque. The conventional industry approach for characterising the rheological properties of suspensions during processing/packaging stage is mainly through the use of viscometer and some through the use of rheometer. One of the potential limitations of viscometer and rheometer based measurements is that the collection and preparation of the solder paste samples can irreversibly alter the structure and flow behaviour of the sample. Hence the measurement may not represent the actual quality of the whole production batch. Secondly, rheological measurements and the interpretation of rheological data is a very technical and time consuming process, which requires professionally trained R&D personnel. The ultrasound technique being proposed provides simple, yet accurate and easy to use solution for the in-situ rheological characterisation of solder pastes which will benefit the materials suppliers (who formulate and produce solder pastes) and solder paste consumers (especially, contract electronics manufacturers). The results from the work show that the technique can be used by R&D personnel involved in paste formulation and manufacture to monitor the batch-to-batch quality and consistency.

Musikalische Teilkulturen

Die relativ geschlossene Welt der mitteleuropäischen Tonalität ist mittlerweile längst nicht mehr in Kunst und Unterhaltung geschieden, vielmehr im Zeitalter der Medien in eine lange Reihe musikalischer Teilkulturen zerfallen. Diesem Phänomen war die Jahrestagung 1982 des Arbeitskreises Musikpädagogische Forschung gewidmet, deren Ergebnisse den vorliegenden Band füllen. Wenn auch — unter anderem durch die kurzfristige Absage einiger grundlegender Referatthemen — beileibe nicht alle Fragen des vielschichtigen Problemfeldes hinreichend beantwortet werden konnten, so darf dennoch konstatiert werden, daß auch offene Fragen die eminente Bedeutung des Tagungsthemas keinesfalls geschmälert haben. Dies hat sich gerade in dem erneut versuchten Dialog mit musikalischen Praktikern (einem Jazz- und einem Punkmusiker, einem Chorleiter, einem Komponisten Neuer Musik, dem Leiter einer Mandolinengesellschaft, einem U-Musik-Redakteur) im Rahmen einer Podiumsdiskussion erwiesen. (DIPF/Orig.)

Inklusion als Verstrickung. Essay

Im Anschluß an das narrative Verständnis der Zeit bei Paul Ricoeur und Wilhelm Schapp entwickelt der Text die These, daß Lebenszeit die Summe der erzählten und erzählbaren Geschichten ist, die wir über uns und die wir einander zu erzählen haben. Wenn diese These Geltung besitzt, plausibel und nachvollziehbar ist, dann sind Sonderpädagogen Geschichtenerzähler. Allerdings (re-)konstruieren sie nur eine Geschichte, nämlich die der Behinderung. Nur in diesem Fokus sind andere Menschen sonderpädagogisch überhaupt interessant. Dieser unauflösliche Widerspruch fundiert Sonderpädagogik. Fatal im Sinne von „end-gültig“ist die Konsequenz für den so Erzählten: wer nur eine Geschichte von sich zu erzählen hat, über wen es nur eine Geschichte zu erzählen gibt, der ist arm dran. Behinderung ist ein Geschichtsmonopol. Dem ist nur durch disziplinkritische Auswilderung zu entgehen. Die pädagogische Aufgabe liegt in der Eröffnung eines Horizontes von Geschichten. Dies kann die verengenden institutionellen und organisatorischen Fragestellungen gegenwärtiger inklusiver Bewegungsforschung erweitern und ergänzen. Es ist dabei gleichgültig, ob dies zu einer Neubestimmung von akademischer Sonderpädagogik oder ihrer Substituierung führt. Die weißen Handschuhe auszuziehen gilt es allemal. (DIPF/Orig.)

Verhältnismäßig trivial

Zwischen pädagogischem Hochamt und Etikettierungs-Ressourcen-Dilemma: Wer selbst unterrichtet, merkt schnell, dass es weder allein in das Belieben des einzelnen Erwachsenen noch des Jugendlichen und auch nicht von diesen beiden nur gestellt ist, wie sie ihr pädagogisches Verhältnis regeln, wie sie ihre Beziehungen aushandeln, gestalten und einschätzen. „Wir müssen zu ihnen in Beziehung treten, und mit ihnen kommunizieren.“ (Fornefeld 1999). Dies erfordert „eine verantwortlich handelnde Erzieherpersönlichkeit, (die sich) um den reinen Begriff der Erziehung und Bildung schöpferisch bemüht“ (Klein 2001). Der hohe Ton pädagogischer Beziehung in Tateinheit mit Lebensweltorientierung wird allerdings durch eine eher triviale Frage relativiert, nämlich nach der Kontinuität personeller Ressourcen als Ermöglichungsgrund für Beziehungen. Es geht um die alltägliche Verlässlichkeit und Nachhaltigkeit, mit der die Beziehungs-Ressourcen bereit gestellt werden; nicht zufällig ist derlei verfasst in Ausdrücken wie Beschulungsdauer, Schulöffnungs- und Unterrichtszeiten, Klassenteiler, Schullastenausgleich, usw. Im Anschluss an Giesecke und Richter lässt sich dieser Sachverhalt gelassen formulieren: Professionelles Handeln als bezahlte Tätigkeit ist zeitlich und räumlich begrenzt. Wenn ein ‚Beziehungsanspruch’ besteht, dann nur während der Öffnungszeiten der Schule. Solche Beziehungen gehen die Professionellen nicht im rechtsfreien Raum ein (Richter 2004). Das Zustandekommen dieser Beziehungen ist ein Rechtsgut und kann von einer unbegrenzten Anzahl von Personen reklamiert werden. (vgl. Giesecke 1997, S. 246 ff). In unserem Land ‚erwirbt’ sich ein Kind oder ein Jugendlicher einen erweiterten Anspruch durch den fest gestellten sonderpädagogischen Förderbedarf. Ist es Zufall, wenn der Zusammenhang zwischen personellen und sächlichen Ressourcen und Etikettierung in der moralischen Kategorie des ‚Dilemmas’ gefasst wird (Bleidick/Rath/Schuck 1995; Kornmann 1994).

Cellular physiology of retinal and choroidal arteriolar smooth muscle cells.

Control of ocular blood flow occurs predominantly at the level of the retinal and choroidal arterioles. The present article provides an overview of the Ca2 + handling mechanisms and plasmalemmal ion channels involved in the regulation of retinal and choroidal arteriolar smooth muscle tone. Increases in global intracellular free Ca2 + ([Ca2 +]i) involve multiple mechanisms, including agonist-dependent release of Ca2 + from intracellular stores through activation of the inositol trisphosphate (IP3) pathway. Ca2 + enters by voltage-dependent L-type Ca2 + channels and novel dihydropyridine-sensitive store-operated nonselective cation channels. Ca2 + extrusion is mediated by plasmalemmal Ca2 +-ATPases and through Na+/Ca2+ exchange. Local Ca2 + transients (Ca2 + sparks) play an important excitatory role, acting as the building blocks for more global Ca2 + signals that can initiate vasoconstriction. K+ and Cl- channels may also affect cell function by modulating membrane potential. The precise contribution of each of these mechanisms to the regulation of retinal and choroidal perfusion in vivo warrants future investigation.

The manufacture and characterisation of hot-melt extruded enteric tablets

The aim of this highly novel study was to use hot-melt extrusion technology as an alternative process to enteric coating. In so doing, oral dosage forms displaying enteric properties may be produced in a continuous, rapid process, providing significant advantages over traditional pharmaceutical coating technology. Eudragit (R) L100-55, an enteric polymer, was pre-plasticized with triethyl citrate (TEC) and citric acid and subsequently dry-mixed with 5-aminosalicylic acid, a model active pharmaceutical ingredient (API), and an optional gelling agent (PVP (R) K30 or Carbopol (R) 971P). Powder blends were hot-melt extruded as cylinders, cut into tablets and characterised using powder X-ray diffraction (PXRD), differential scanning calorimetry (DSC) and dissolution testing conducted in both pH 1.2 and pH 6.8 buffers. Increasing the concentration of TEC significantly lowered the glass transition temperature (T,) of Eudragit (R) L100-55 and reduced temperatures necessary for extrusion as well as the die pressure. Moreover, citric acid (17% w/w) was shown to act as a solid-state plasticizer. HME tablets showed excellent gastro-resistance, whereas milled extrudates compressed into tablets released more than 10% w/w of the API in acidic media. Drug release from HME tablets was dependent upon the concentration of TEC, the presence of citric acid, PVP K30, and Carbopol (R) 971P in the matrix, and pH of the dissolution media. The inclusion of an optional gelling agent significantly reduced the erosion of the matrix and drug release rate at pH 6.8; however, the enteric properties of the matrix were lost due to the formation of channels within the tablet. Consequently this work is both timely and highly innovative and identifies for the first time a method of producing an enteric matrix tablet using a continuous hot-melt extrusion process.