Optimisation of a surface mount technology process using a SnAgCu lead-free alloy

The impending introduction of lead-free solder in the manufacture of electrical and electronic products has presented the electronics industry with many challenges. European manufacturers must transfer from a tin-lead process to a lead-free process by July 2006 as a result of the publication of two directives from the European Parliament. Tin-lead solders have been used for mechanical and electrical connections on printed circuit boards for over fifty years and considerable process knowledge has been accumulated. Extensive literature reviews were conducted on the topic and as a result it was found there are many implications to be considered with the introduction of lead-free solder. One particular question that requires answering is; can lead-free solder be used in existing manufacturing processes? The purpose of this research is to conduct a comparative study of a tin-lead solder and a lead-free solder in two key surface mount technology (SMT) processes. The two SMT processes in question were the stencil printing process and the reflow soldering process. Unreplicated fractional factorial experimental designs were used to carry out the studies. The quality of paste deposition in terms of height and volume were the characteristics of interest in the stencil printing process. The quality of solder joints produced in the reflow soldering experiment was assessed using x-ray and cross sectional analysis. This provided qualitative data that was then uniquely scored and weighted using a method developed during the research. Nested experimental design techniques were then used to analyse the resulting quantitative data. Predictive models were developed that allowed for the optimisation of both processes. Results from both experiments show that solder joints of comparable quality to those produced using tin-lead solder can be produced using lead-free solder in current SMT processes.

What makes corporate blogs successful? : an international investigation of corporate blogging practices and corporate blog acceptance

Magdeburg, Univ., Fak. für Wirtschaftswiss., Diss., 2013

Factory Acceptance Test des Prozessleitsystems PCS 7 und Anlagenfeld Simulation mit WinMOD

Das Prozessleitsystem PCS 7 beinhaltet softwaretechnische Lösungen für alle Hierarchieebenen der industriellen Automatisierung von der Unternehmensleitebene bis zur Anlagenfeldebene. Mit der Simulationssoftware WinMOD können Komponenten,Signale und Prozesse einer Industrieanlage nachgebildet werden. Zudem bietet WinMOD Schnittstellenlösungen für gängige Speicherprogrammierbare Steuerungen und eignet sich somit für den Factory Acceptance Test (FAT) von Prozessleitsystemen. Die FATs sollen sich hauptsächlich auf die Überprüfung von Signaladressierungen und von Ursache und Wirkung konzentrieren. Im Rahmen der vorliegenden Arbeit wurden ausgewählte PCS 7–Projekte untersucht und auf deren Grundlage Aussagen getroffen wie zukünftig Simulationen effektiv erstellt werden können. Hierzu wurden mithilfe von WinMOD Simulationsmodule angelegt - welche reale Komponenten des Anlagenfeldes ersetzen – , ihr Aufbau beschrieben und in einer Bibliothek zusammengefasst. Im Anschluss wird auf die Verwendung der Bibliothek für verschiedene Anwendungsfälle eingegangen und eine Lösung präsentiert, welche das Erstellen einer Simulation für spezifische Projekte optimiert. Das Ergebnis zeigt auf, dass WinMOD sowohl neue Möglichkeiten der Durchführung für einen FAT liefert, wobei die Simulationserstellung nur einen geringen Mehraufwand bedeutet und sich die Durchführung der Simulation ergonomischer und kürzer gestaltet.

Reptiles collected in Salvador for the California Institute of Technology, by Karl P. Schmidt.

v.12:no.16(1928)

National Aquaculture Development Plan / prepared by the Joint Subcommittee on Aquaculture of the Federal Coordinating Council on Science, Engineering and Technology.

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Science, technology, and American diplomacy : an extended study of the interactions of science and technology with United States foreign policy / Committee on International Relations, U.S. House of Representatives.

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Science, technology, and American diplomacy : an extended study of the interactions of science and technology with United States foreign policy / Committee on International Relations, U.S. House of Representatives.

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Science, technology, and American diplomacy : an extended study of the interactions of science and technology with United States foreign policy / Committee on International Relations, U.S. House of Representatives.

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