Triggered vacuum gap for initiating electric arcs in vacuum

Describes a simple triggered vacuum gap developed for initiating electric arcs in vacuum which uses the property that the voltage required to breakdown a gap in vacuum in the presence of a solid insulating material is considerably less than the voltage required in the absence of such material. In this triggered vacuum gap a solid insulating material is used in the angular space between the main cathode and the concentric trigger electrode forming the auxiliary gap. Different materials like epoxy resin, Teflon (PTFE) and mica have been used. The trigger voltage was found to vary in the range 560-1840 V. The results with epoxy and Teflon were unsatisfactory because the trigger voltages showed wide scatter and the auxiliary gap was soon bridged by metal particles eroded from the electrodes. Though the trigger voltages required with mica were relatively high, consistent triggering could be obtained for a large number of trials before the auxiliary gap was bridged. This was probably due to better thermal stability of mica as compared with either epoxy or Teflon.

Polymer composite/nanocomposite processing and its effect on the electrical properties

One of the biggest challenges when considering polymer nanocomposites for electrical insulation applications lies in determining their electrical properties accurately, which in turn depend on several factors, primary being dispersion of particles in the polymer matrix. With this background, this paper reports an experimental study to understand the effects of different processing techniques on the dispersion of filler particles in the polymer matrix and their related effect on the dielectric properties of the composites. Polymer composite and nanocomposite samples for the study were prepared by mixing 10% by weight of commercially available TiO2 particles of two different sizes in epoxy using different processing methods. A considerable effect of the composite processing method could be seen in the dielectric properties of nanocomposites.

Studies on design, fabrication and reliability assessment of embedded passives on a high-density interconnect (HDI) organic substrate using a sequential build-up process

One of the foremost design considerations in microelectronics miniaturization is the use of embedded passives which provide practical solution. In a typical circuit, over 80 percent of the electronic components are passives such as resistors, inductors, and capacitors that could take up to almost 50 percent of the entire printed circuit board area. By integrating passive components within the substrate instead of being on the surface, embedded passives reduce the system real estate, eliminate the need for discrete and assembly, enhance electrical performance and reliability, and potentially reduce the overall cost. Moreover, it is lead free. Even with these advantages, embedded passive technology is at a relatively immature stage and more characterization and optimization are needed for practical applications leading to its commercialization.This paper presents an entire process from design and fabrication to electrical characterization and reliability test of embedded passives on multilayered microvia organic substrate. Two test vehicles focusing on resistors and capacitors have been designed and fabricated. Embedded capacitors in this study are made with polymer/ceramic nanocomposite (BaTiO3) material to take advantage of low processing temperature of polymers and relatively high dielectric constant of ceramics and the values of these capacitors range from 50 pF to 1.5 nF with capacitance per area of approximately 1.5 nF/cm(2). Limited high frequency measurement of these capacitors was performed. Furthermore, reliability assessments of thermal shock and temperature humidity tests based on JEDEC standards were carried out. Resistors used in this work have been of three types: 1) carbon ink based polymer thick film (PTF), 2) resistor foils with known sheet resistivities which are laminated to printed wiring board (PWB) during a sequential build-up (SBU) process and 3) thin-film resistor plating by electroless method. Realization of embedded resistors on conventional board-level high-loss epoxy (similar to 0.015 at 1 GHz) and proposed low-loss BCB dielectric (similar to 0.0008 at > 40 GHz) has been explored in this study. Ni-P and Ni-W-P alloys were plated using conventional electroless plating, and NiCr and NiCrAlSi foils were used for the foil transfer process. For the first time, Benzocyclobutene (BCB) has been proposed as a board level dielectric for advanced System-on-Package (SOP) module primarily due to its attractive low-loss (for RF application) and thin film (for high density wiring) properties.Although embedded passives are more reliable by eliminating solder joint interconnects, they also introduce other concerns such as cracks, delamination and component instability. More layers may be needed to accommodate the embedded passives, and various materials within the substrate may cause significant thermo -mechanical stress due to coefficient of thermal expansion (CTE) mismatch. In this work, numerical models of embedded capacitors have been developed to qualitatively examine the effects of process conditions and electrical performance due to thermo-mechanical deformations.Also, a prototype working product with the board level design including features of embedded resistors and capacitors are underway. Preliminary results of these are presented.

Environmental effects on fibre-Polymer composites

Moisture absorption characteristics and its effects on the mechanical properties and failure process of polymers (neat epoxy and polyester resins) and composites with simple (glass, carbon and kevlar) and hybrid (glass-carbon, carbon-kevlar and kevlar-glass) fibres were experimentally determined before and after immersion in water at 343 K for 20 days. The maximum moisture content (Mm) and diffusion coefficient (Dx) of these composites were determined. The degradation in ultimate tensile strength and Young's modulus due to the moisture content were experimentally determined and found to be quite significant. Acoustic emissions, from specimens before and after exposure, were monitored during the load cycle, and revealed a significant change in the failure process of these composites. Scanning Electron Microscope (SEM) studies on failed exposed and unexposed specimens revealed resin leach out and fibre prominence.

Cryptosin, a cardenolide from the leaves of Cryptolepis buchanani

A new cardenolide named cryptosin was isolated from the leaves of Cryptolepis buchanani. By spectral studies and single crystal X-ray crystallography, cryptosin was found to possess a novel structure. The structure thus established was 3β-(d-deoxy glucose-oxy)-14β,11β-dihydroxy-7α,8α-epoxy-12-oxo-5β- card-20 (22)-enolide.

Attaching chelating ligands to polybenzimidazole via epoxidation to obtain metal selective sorbents

Microporous polybenzimidazole of 250–500 μm spherical bead size from Celanese has been reacted with epichlorohydrin and sodium hydroxide and the resulting product with pendant epoxy groups has been reacted with various chelating ligands in order to augment the metal sorption capacity and selectivity of the resin. The chelating ligands used include ethylenediamine, diethylenetriamine, diethanolamine, dimethylglyoxime, L-cysteine, thiourea, dithiooxamide, glyoxal-bis-2-hydroxyanil, salicylaldehyde-ethylenediimine, and glyoxal-bis-2-mercaptoanil. The aminolysis of the pendant epoxy groups with the oligoamines has been performed in pyridine under reflux conditions, while the addition reactions with the other ligands which are alkali soluble have been carried out at room temperature in a mixture of dioxane and aqueous KOH using tetra-n-butylammonium iodide as the phase transfer catalyst. The products are found to possess high capacity and selectivity in metal sorption depending on the ligand attached.

Temperature Distribution in Resin Impregnated Paper Insulation for Transformer Bushings

The overall reliability of a power transformer depends to a great extent on the sound operation of the bushings thereof. Oil impregnated paper (OIP) insulated bushings have been in use for a long time now. In many situations, it becomes necessary to avoid OIP insulation in bushings. In the recent past, a new technological breakthrough has been achieved whereby the OIP is replaced by epoxy resin impregnated crepe paper (RIP) insulation. This new system has several advantages over OIP and has now become the insulation of choice. However, its long time thermal and electrical performance need to be carefully assessed. This paper reports the results of a study of temperature distribution in the body of insulation, based on the ac conductivity of RIP insulation. A method of computing the maximum thermal voltage of this system is also given.

Stress and strength analysis of pin joints in laminated anisotropic plates

Mechanical joints in composites can be tailored to achieve improved performance and better life by appropriately selecting the laminate parameters. In order to gain the best advantage of this possibility of tailoring the laminate, it is necessary to understand the influence of laminate parameters on the behaviour of joints in composites. Most of the earlier studies in this direction were based on simplified assumptions regarding load transfer at the pin-plate interface and such studies were only carried out on orthotropic and quasi-isotropic laminates. In the present study, a more rigorous analysis is carried out to study pin joints in laminates with anisotropic properties. Two types of laminates with (0/ + ?4/90)s and (0/ ± ?2/90)s layups made out of graphite epoxy T300/5208 material system are considered. The analysis mainly concentrates on clearance fit in which the pin is of smaller diameter compared to the hole. The main aspect of the analysis of pin joints is the changing contact between the pin and the plate with increasing load levels. The analysis is carried out by an iterative finite element technique and a computationally efficient routine is developed for this purpose. Numerical studies indicate that the location and magnitude of the peak stresses along the hole boundary are functions of fibre angle and the overall anisotropic properties. It is also shown that the conventional assumption of cosine distribution for the contact pressure between pin and the plate in the analysis lead to underestimation of bearing failure load and overestimation of shear and tensile failure loads in typical (0/905)s cross-ply laminates.

Diterpenoids of Roylea calycina(Roxb.) Briq.

The structures of three new diterpenes, calyone, calyenone, and precalyone, isolated from the aerial portion of Roylea calycina have been shown to be 3-acetoxy-15,16-epoxy-9-hydroxylabda-1 3(16),14-dien-7-one (2), 3-acetoxy-15,16-epoxylabda-8,13(16),14-trien-7-one (5), and 3-acetoxy-9,13;15,16-diepoxylabda-14-en-7-one (7), respectively, by chemical and spectroscopic studies. Precalyone showed antitumor activity against P-388 lymphocytic leukaemia.

Chemical toughening of epoxies. II. Mechanical, thermal, and microscopic studies of epoxies toughened with hydroxyl-terminated poly(butadiene-co-acrylonitrile)

Diglycidyl ether–bisphenol-A-based epoxies toughened with various levels (0–12%) of chemically reacted liquid rubber, hydroxyl-terminated poly(butadiene-co-acrylonitrile) (HTBN) were studied for some of the mechanical and thermal properties. Although the ultimate tensile strength showed a continuous decrease with increasing rubber content, the toughness as measured by the area under the stress-vs.-strain curve and flexural strength reach a maximum around an optimum rubber concentration of 3% before decreasing. Tensile modulus was found to increase for concentrations below 6%. The glass transition temperature Tg as measured by DTA showed no variation for the toughened formulations. The TGA showed no variations in the pattern of decomposition. The weight losses for the toughened epoxies at elevated temperatures compare well with that of the neat epoxy. Scanning electron microscopy revealed the presence of a dual phase morphology with the spherical rubber particles precipitating out in the cured resin with diameter varying between 0.33 and 6.3 μm. In contrast, a physically blended rubber–epoxy showed much less effect towards toughening with the precipitated rubber particles of much bigger diameter (0.6–21.3 μm).

Minimum weight design of fiber-reinforced laminated composite structures with maximum stress and Tsai-Wu failure criteria

In this article, a minimum weight design of carbon/epoxy laminates is carried out using genetic algorithms. New failure envelopes have been developed by the combination of two commonly used phenomenological failure criteria, namely Maximum Stress (MS) and Tsai-Wu (TW) are used to obtain the minimum weight of the laminate. These failure envelopes are the most conservative failure envelope (MCFE) and the least conservative failure envelope (LCFE). Uniaxial and biaxial loading conditions are considered for the study and the differences in the optimal weight of the laminate are compared for the MCFE and LCFE. The MCFE can be used for design of critical load-carrying composites, while the LCFE could be used for the design of composite structures where weight reduction is much more important than safety such as unmanned air vehicles.

Electro-magnetically Actuated Minute Polymer Pump Fabricated using Packaging Technology

Design, fabrication and preliminary testing of a flat pump with millimetre thickness are described in this paper. The pump is entirely made of polymer materials barring the magnet and copper coils used for electromagnetic actuation. The fabrication is carried out using widely available microelectronic packaging machinery and techniques. Therefore, the fabrication of the pump is straightforward and inexpensive. Two types of prototypes are designed and built. One consists of copper coils that are etched on an epoxy plate and the other has wound insulated wire of 90 mu m diameter to serve as a coil. The overall size of the first pump is 25 mm x 25 mm x 3.6 mm including the 3.1 mm-thick NdFeB magnet of diameter 12 mm. It consists of a pump chamber of 20 mm x 20 mm x 0.8 mm with copper coils etched from a copper-clad epoxy plate using dry-film lithography and milled using a CNC milling machine, two passive valves and the pump-diaphragm made of Kapton film of 0.089 mm thickness. The second pump has an overall size of 35 mm x 35 mm x 4.4 mm including the magnet and the windings. A breadboard circuit and DC power supply are used to test the pump by applying an alternating square-wave voltage pulse. A water slug in a tube attached to the inlet is used to observe and measure the air-flow induced by the pump against atmospheric pressure. The maximum flow rate was found to be 15 ml/min for a voltage of 2.5 V and a current of 19 mA at 68 Hz.

Chemo- and stereoselective reduction of alpha,beta-epoxyketones with diisopropoxytitanium(III) tetrahydroborate

Reduction of alpha,beta-epoxyketones with diisopropoxytitanium(III) tetrahydroborate in dichloromethane under mild conditions (-78 degrees--> -20 degrees C) provides anti- (or erythro-) alpha,beta-epoxy alcohols in high yields with high degree of chemo- and stereoselectivity. Copyright (C) 1996 Elsevier Science Ltd

On the characterisation of syntactic foam core sandwich composites for compressive properties

Sandwich structures, especially those with honeycomb and grid structures as the core material, are very commonly employed in aircraft structures. There is an increasing use of closed-pore rigid syntactic foams as core materials in sandwich constructions because they possess a number of favourable properties. The syntactic foams, owing to their structure and formation, behave differently under compression compared to other traditionally used core materials. In the present study, therefore, syntactic foam core sandwich constructions are evaluated for their behaviour under compression in both edgewise and flatwise orientations. Further, the work characterises the relative performance of two sets of sandwich materials, one containing glass-epoxy and the other, glass/carbon hybrid-epoxy skins. As non-standard geometry test specimens were involved, only a comparative evaluation was contemplated in this approach. The experiments indicate that the nature of the reinforcement fabric in the skin has a bearing on the test results in edgewise orientation. Thus, the tendency towards initiation of vertical crack in the central plane of the core material, which is a typical fracture event in this kind of material, was found to occur after a delay for the specimens containing the glass fabric in the skin. Attempts are made to establish the correlation between observations made on the test specimen visually during the course of testing and the post-compression microscopic examinations of the fracture features.

Residual strength and fatigue life assessment of composite patch repaired specimens

Design, analysis and technology for the integrity enhancement of damaged or underdesigned structures continues to be an engineering challenge. Bonded composite patch repairs to metallic structures is receiving increased attention in the recent years. It offers various advantages over rivetted doubler, particularly for airframe repairs. This paper presents an experimental investigation of residual strength and fatigue crack-growth life of an edge-cracked aluminium specimen repaired using glass epoxy composite patch. The investigation begins with the evaluation of three different surface treatments from bond strength viewpoint. A simple thumb rule formula is employed to estimate the patch size. Cracked and repaired specimens are tested under static and fatigue loading. The patch appears to restore the original strength of the undamaged specimen and enhance the fatigue crack growth life by an order of magnitude. (C) 1999 Elsevier Science Ltd. All rights reserved.