An observer-based vaccination control law for an SEIR epidemic model based on feedback linearization techniques for nonlinear systems

This paper presents a vaccination strategy for fighting against the propagation of epidemic diseases. The disease propagation is described by an SEIR (susceptible plus infected plus infectious plus removed populations) epidemic model. The model takes into account the total population amounts as a refrain for the illness transmission since its increase makes the contacts among susceptible and infected more difficult. The vaccination strategy is based on a continuous-time nonlinear control law synthesised via an exact feedback input-output linearization approach. An observer is incorporated into the control scheme to provide online estimates for the susceptible and infected populations in the case when their values are not available from online measurement but they are necessary to implement the control law. The vaccination control is generated based on the information provided by the observer. The control objective is to asymptotically eradicate the infection from the population so that the removed-by-immunity population asymptotically tracks the whole one without precise knowledge of the partial populations. The model positivity, the eradication of the infection under feedback vaccination laws and the stability properties as well as the asymptotic convergence of the estimation errors to zero as time tends to infinity are investigated.

Experimental Study Of Multi-Hole Cooling For Integrally-Woven, Ceramic Matrix Composite Walls For Gas Turbine Applications

In this paper, multi-hole cooling is studied for an oxide/oxide ceramic specimen with normal injection holes and for a SiC/SiC ceramic specimen with oblique injection holes. A special purpose heat transfer tunnel was designed and built, which can provide a wide range of Reynolds numbers (10(5)similar to 10(7)) and a large temperature ratio of the primary flow to the coolant (up to 2.5). Cooling effectiveness determined by the measured surface temperature for the two types of ceramic specimens is investigated. It is found that the multi-hole cooling system for both specimens has a high cooling efficiency and it is higher for the SiC/SiC specimen than for the oxide/oxide specimen. Effects on the cooling effectiveness of parameters including blowing ratio, Reynolds number and temperature ratio, are studied. In addition, profiles of the mean velocity and temperature above the cooling surface are measured to provide further understanding of the cooling process. Duplication of the key parameters for multi-hole cooling, for a representative combustor flow condition (without radiation effects), is achieved with parameter scaling and the results show the high efficiency of multi-hole cooling for the oblique hole, SiC/SiC specimen. (C) 2008 Elsevier Ltd. All rights reserved.

Boiling heat transfer enhancement by using micro-pin-finned surface for electronics cooling

For efficiently cooling electronic components with high heat flux, experiments were conducted to study the flow boiling heat transfer performance of FC-72 over square silicon chips with the dimensions of 10 × 10 × 0.5 mm3. Four kinds of micro-pin-fins with the dimensions of 30 × 60, 30 × 120, 50 × 60, 50 × 120 μm2 (thickness, t × height, h) were fabricated on the chip surfaces by the dry etching technique for enhancing boiling heat transfer. A smooth surface was also tested for comparison. The experiments were made at three different fluid velocities (0.5, 1 and 2 m/s) and three different liquid subcoolings (15, 25 and 35 K). The results were compared with the previous published data of pool boiling. All micro-pin-fined surfaces show a considerable heat transfer enhancement compared with a smooth surface. Flow boiling can remarkably decrease wall superheat compared with pool boiling. At the velocities lower than 1 m/s, the micro-pin-finned surfaces show a sharp increase in heat flux with increasing wall superheat. For all surfaces, the maximum allowable heat flux, qmax, for the normal operation of LSI chips increases with fluid velocity and subcooling. For all micro-pin-finned surfaces, the wall temperature at the critical heat flux (CHF) is less than the upper limit for the reliable operation of LSI chips, 85◦C. The largest value of qmax can reach nearly 148 W/cm2 for micro-pin-finned chips with the fin height of 120 μm at the fluid velocity of 2 m/s and the liquid subcooling of 35 K. The perspectives for the boiling heat transfer experiment of the prospective micro-pin-finned sur- faces, which has been planned to be made in the Drop Tower Beijing/NMLC in the future, are also presented.