925 resultados para Low-power Design


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This study introduces an inexact, but ultra-low power, computing architecture devoted to the embedded analysis of bio-signals. The platform operates at extremely low voltage supply levels to minimise energy consumption. In this scenario, the reliability of static RAM (SRAM) memories cannot be guaranteed when using conventional 6-transistor implementations. While error correction codes and dedicated SRAM implementations can ensure correct operations in this near-threshold regime, they incur in significant area and energy overheads, and should therefore be employed judiciously. Herein, the authors propose a novel scheme to design inexact computing architectures that selectively protects memory regions based on their significance, i.e. their impact on the end-to-end quality of service, as dictated by the bio-signal application characteristics. The authors illustrate their scheme on an industrial benchmark application performing the power spectrum analysis of electrocardiograms. Experimental evidence showcases that a significance-based memory protection approach leads to a small degradation in the output quality with respect to an exact implementation, while resulting in substantial energy gains, both in the memory and the processing subsystem.

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This paper deals with and details the design and implementation of a low-power; hardware-efficient adaptive self-calibrating image rejection receiver based on blind-source-separation that alleviates the RF analog front-end impairments. Hybrid strength-reduced and re-scheduled data-flow, low-power implementation of the adaptive self-calibration algorithm is developed and its efficiency is demonstrated through simulation case studies. A behavioral and structural model is developed in Matlab as well as a low-level architectural design in VHDL providing valuable test benches for the performance measures undertaken on the detailed algorithms and structures.

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Thesis (Ph.D.)--University of Washington, 2016-03

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This paper presents the operational analysis of the single-phase integrated buck-boost inverter. This topology is able to convert the DC input voltage into AC voltage with a high static gain, low harmonic content and acceptable efficiency, all in one single-stage. Main functionality aspects are explained, design procedure, system modeling and control, and also component requirements are detailed. Main simulation results are included, and two prototypes were implemented and experimentally tested, where its results are compared with those corresponding to similar topologies available in literature. © 2012 IEEE.

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Oggi, i dispositivi portatili sono diventati la forza trainante del mercato consumer e nuove sfide stanno emergendo per aumentarne le prestazioni, pur mantenendo un ragionevole tempo di vita della batteria. Il dominio digitale è la miglior soluzione per realizzare funzioni di elaborazione del segnale, grazie alla scalabilità della tecnologia CMOS, che spinge verso l'integrazione a livello sub-micrometrico. Infatti, la riduzione della tensione di alimentazione introduce limitazioni severe per raggiungere un range dinamico accettabile nel dominio analogico. Minori costi, minore consumo di potenza, maggiore resa e una maggiore riconfigurabilità sono i principali vantaggi dell'elaborazione dei segnali nel dominio digitale. Da più di un decennio, diverse funzioni puramente analogiche sono state spostate nel dominio digitale. Ciò significa che i convertitori analogico-digitali (ADC) stanno diventando i componenti chiave in molti sistemi elettronici. Essi sono, infatti, il ponte tra il mondo digitale e analogico e, di conseguenza, la loro efficienza e la precisione spesso determinano le prestazioni globali del sistema. I convertitori Sigma-Delta sono il blocco chiave come interfaccia in circuiti a segnale-misto ad elevata risoluzione e basso consumo di potenza. I tools di modellazione e simulazione sono strumenti efficaci ed essenziali nel flusso di progettazione. Sebbene le simulazioni a livello transistor danno risultati più precisi ed accurati, questo metodo è estremamente lungo a causa della natura a sovracampionamento di questo tipo di convertitore. Per questo motivo i modelli comportamentali di alto livello del modulatore sono essenziali per il progettista per realizzare simulazioni veloci che consentono di identificare le specifiche necessarie al convertitore per ottenere le prestazioni richieste. Obiettivo di questa tesi è la modellazione del comportamento del modulatore Sigma-Delta, tenendo conto di diverse non idealità come le dinamiche dell'integratore e il suo rumore termico. Risultati di simulazioni a livello transistor e dati sperimentali dimostrano che il modello proposto è preciso ed accurato rispetto alle simulazioni comportamentali.

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The design, construction and optimization of a low power-high temperature heated ceramic sensor to detect leaking of halogen gases in refrigeration systems are presented. The manufacturing process was done with microelectronic assembly and the Low Temperature Cofire Ceramic (LTCC) technique. Four basic sensor materials were fabricated and tested: Li2SiO3, Na2SiO3, K2SiO3, and CaSiO 3. The evaluation of the sensor material, sensor size, operating temperature, bias voltage, electrodes size, firing temperature, gas flow, and sensor life was done. All sensors responded to the gas showing stability and reproducibility. Before exposing the sensor to the gas, the sensor was modeled like a resistor in series and the calculations obtained were in agreement with the experimental values. The sensor response to the gas was divided in surface diffusion and bulk diffusion; both were analyzed showing agreement between the calculations and the experimental values. The sensor with 51.5%CaSiO3 + 48.5%Li 2SiO3 shows the best results, including a stable current and response to the gas. ^

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The design, construction and optimization of a low power-high temperature heated ceramic sensor to detect leaking of halogen gases in refrigeration systems are presented. The manufacturing process was done with microelectronic assembly and the Low Temperature Cofire Ceramic (LTCC) technique. Four basic sensor materials were fabricated and tested: Li2SiO3, Na2SiO3, K2SiO3, and CaSiO3. The evaluation of the sensor material, sensor size, operating temperature, bias voltage, electrodes size, firing temperature, gas flow, and sensor life was done. All sensors responded to the gas showing stability and reproducibility. Before exposing the sensor to the gas, the sensor was modeled like a resistor in series and the calculations obtained were in agreement with the experimental values. The sensor response to the gas was divided in surface diffusion and bulk diffusion; both were analyzed showing agreement between the calculations and the experimental values. The sensor with 51.5%CaSiO3 + 48.5%Li2SiO3 shows the best results, including a stable current and response to the gas.

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This dissertation presents the design of three high-performance successive-approximation-register (SAR) analog-to-digital converters (ADCs) using distinct digital background calibration techniques under the framework of a generalized code-domain linear equalizer. These digital calibration techniques effectively and efficiently remove the static mismatch errors in the analog-to-digital (A/D) conversion. They enable aggressive scaling of the capacitive digital-to-analog converter (DAC), which also serves as sampling capacitor, to the kT/C limit. As a result, outstanding conversion linearity, high signal-to-noise ratio (SNR), high conversion speed, robustness, superb energy efficiency, and minimal chip-area are accomplished simultaneously. The first design is a 12-bit 22.5/45-MS/s SAR ADC in 0.13-μm CMOS process. It employs a perturbation-based calibration based on the superposition property of linear systems to digitally correct the capacitor mismatch error in the weighted DAC. With 3.0-mW power dissipation at a 1.2-V power supply and a 22.5-MS/s sample rate, it achieves a 71.1-dB signal-to-noise-plus-distortion ratio (SNDR), and a 94.6-dB spurious free dynamic range (SFDR). At Nyquist frequency, the conversion figure of merit (FoM) is 50.8 fJ/conversion step, the best FoM up to date (2010) for 12-bit ADCs. The SAR ADC core occupies 0.06 mm2, while the estimated area the calibration circuits is 0.03 mm2. The second proposed digital calibration technique is a bit-wise-correlation-based digital calibration. It utilizes the statistical independence of an injected pseudo-random signal and the input signal to correct the DAC mismatch in SAR ADCs. This idea is experimentally verified in a 12-bit 37-MS/s SAR ADC fabricated in 65-nm CMOS implemented by Pingli Huang. This prototype chip achieves a 70.23-dB peak SNDR and an 81.02-dB peak SFDR, while occupying 0.12-mm2 silicon area and dissipating 9.14 mW from a 1.2-V supply with the synthesized digital calibration circuits included. The third work is an 8-bit, 600-MS/s, 10-way time-interleaved SAR ADC array fabricated in 0.13-μm CMOS process. This work employs an adaptive digital equalization approach to calibrate both intra-channel nonlinearities and inter-channel mismatch errors. The prototype chip achieves 47.4-dB SNDR, 63.6-dB SFDR, less than 0.30-LSB differential nonlinearity (DNL), and less than 0.23-LSB integral nonlinearity (INL). The ADC array occupies an active area of 1.35 mm2 and dissipates 30.3 mW, including synthesized digital calibration circuits and an on-chip dual-loop delay-locked loop (DLL) for clock generation and synchronization.

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As the semiconductor industry struggles to maintain its momentum down the path following the Moore's Law, three dimensional integrated circuit (3D IC) technology has emerged as a promising solution to achieve higher integration density, better performance, and lower power consumption. However, despite its significant improvement in electrical performance, 3D IC presents several serious physical design challenges. In this dissertation, we investigate physical design methodologies for 3D ICs with primary focus on two areas: low power 3D clock tree design, and reliability degradation modeling and management. Clock trees are essential parts for digital system which dissipate a large amount of power due to high capacitive loads. The majority of existing 3D clock tree designs focus on minimizing the total wire length, which produces sub-optimal results for power optimization. In this dissertation, we formulate a 3D clock tree design flow which directly optimizes for clock power. Besides, we also investigate the design methodology for clock gating a 3D clock tree, which uses shutdown gates to selectively turn off unnecessary clock activities. Different from the common assumption in 2D ICs that shutdown gates are cheap thus can be applied at every clock node, shutdown gates in 3D ICs introduce additional control TSVs, which compete with clock TSVs for placement resources. We explore the design methodologies to produce the optimal allocation and placement for clock and control TSVs so that the clock power is minimized. We show that the proposed synthesis flow saves significant clock power while accounting for available TSV placement area. Vertical integration also brings new reliability challenges including TSV's electromigration (EM) and several other reliability loss mechanisms caused by TSV-induced stress. These reliability loss models involve complex inter-dependencies between electrical and thermal conditions, which have not been investigated in the past. In this dissertation we set up an electrical/thermal/reliability co-simulation framework to capture the transient of reliability loss in 3D ICs. We further derive and validate an analytical reliability objective function that can be integrated into the 3D placement design flow. The reliability aware placement scheme enables co-design and co-optimization of both the electrical and reliability property, thus improves both the circuit's performance and its lifetime. Our electrical/reliability co-design scheme avoids unnecessary design cycles or application of ad-hoc fixes that lead to sub-optimal performance. Vertical integration also enables stacking DRAM on top of CPU, providing high bandwidth and short latency. However, non-uniform voltage fluctuation and local thermal hotspot in CPU layers are coupled into DRAM layers, causing a non-uniform bit-cell leakage (thereby bit flip) distribution. We propose a performance-power-resilience simulation framework to capture DRAM soft error in 3D multi-core CPU systems. In addition, a dynamic resilience management (DRM) scheme is investigated, which adaptively tunes CPU's operating points to adjust DRAM's voltage noise and thermal condition during runtime. The DRM uses dynamic frequency scaling to achieve a resilience borrow-in strategy, which effectively enhances DRAM's resilience without sacrificing performance. The proposed physical design methodologies should act as important building blocks for 3D ICs and push 3D ICs toward mainstream acceptance in the near future.

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This paper presents design of a Low power 256x72 bit TCAM in 0.13um CMOS technology. In contrast to conventional Match line (ML) sensing scheme in which equal power is consumed irrespective of match or mismatch, the ML scheme employed in this design allocates less power to match decisions involving a large number of mismatched bits. Typically, the probability of mismatch is high so this scheme results in significant CAM power reduction. We propose to use this technique along with pipelining of search operation in which the MLs are broken into several segments. Since most words fail to match in first segment, the search operation for subsequent segments is discontinued, resulting in further reduction in power consumption. The above architecture provides 70% power reduction while performing search in 3ns.

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The use of delayed coefficient adaptation in the least mean square (LMS) algorithm has enabled the design of pipelined architectures for real-time transversal adaptive filtering. However, the convergence speed of this delayed LMS (DLMS) algorithm, when compared with that of the standard LMS algorithm, is degraded and worsens with increase in the adaptation delay. Existing pipelined DLMS architectures have large adaptation delay and hence degraded convergence speed. We in this paper, first present a pipelined DLMS architecture with minimal adaptation delay for any given sampling rate. The architecture is synthesized by using a number of function preserving transformations on the signal flow graph representation of the DLMS algorithm. With the use of carry-save arithmetic, the pipelined architecture can support high sampling rates, limited only by the delay of a full adder and a 2-to-1 multiplexer. In the second part of this paper, we extend the synthesis methodology described in the first part, to synthesize pipelined DLMS architectures whose power dissipation meets a specified budget. This low-power architecture exploits the parallelism in the DLMS algorithm to meet the required computational throughput. The architecture exhibits a novel tradeoff between algorithmic performance (convergence speed) and power dissipation. (C) 1999 Elsevier Science B.V. All rights resented.

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We determine the optimal allocation of power between the analog and digital sections of an RF receiver while meeting the BER constraint. Unlike conventional RF receiver designs, we treat the SNR at the output of the analog front end (SNRAD) as a design parameter rather than a specification to arrive at this optimal allocation. We first determine the relationship of the SNRAD to the resolution and operating frequency of the digital section. We then use power models for the analog and digital sections to solve the power minimization problem. As an example, we consider a 802.15.4 compliant low-IF receiver operating at 2.4 GHz in 0.13 μm technology with 1.2 V power supply. We find that the overall receiver power is minimized by having the analog front end provide an SNR of 1.3dB and the ADC and the digital section operate at 1-bit resolution with 18MHz sampling frequency while achieving a power dissipation of 7mW.

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A low-power frequency multiplication technique, developed for ZigBee (IEEE 802.15.4) like applications is presented. We have provided an estimate for the power consumption for a given output voltage swing using our technique. The advantages and disadvantages which determine the application areas of the technique are discussed. The issues related to design, layout and process variation are also addressed. Finally, a design is presented for operation in 2.405-2.485-GHz band of ZigBee receiver. SpectreRF simulations show 30% improvement in efficiency for our circuit with regard to conversion of DC bias current to output amplitude, against a LC-VCO. To establish the low-power credentials, we have compared our circuit with an existing technique; our circuit performs better with just 1/3 of total current from supply, and uses one inductor as against three in the latter case. A test chip was implemented in UMC 0.13-mum RF process with spiral on-chip inductors and MIM (metal-insulator-metal) capacitor option.

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Large instruction windows and issue queues are key to exploiting greater instruction level parallelism in out-of-order superscalar processors. However, the cycle time and energy consumption of conventional large monolithic issue queues are high. Previous efforts to reduce cycle time segment the issue queue and pipeline wakeup. Unfortunately, this results in significant IPC loss. Other proposals which address energy efficiency issues by avoiding only the unnecessary tag-comparisons do not reduce broadcasts. These schemes also increase the issue latency.To address both these issues comprehensively, we propose the Scalable Lowpower Issue Queue (SLIQ). SLIQ augments a pipelined issue queue with direct indexing to mitigate the problem of delayed wakeups while reducing the cycle time. Also, the SLIQ design naturally leads to significant energy savings by reducing both the number of tag broadcasts and comparisons required.A 2 segment SLIQ incurs an average IPC loss of 0.2% over the entire SPEC CPU2000 suite, while achieving a 25.2% reduction in issue latency when compared to a monolithic 128-entry issue queue for an 8-wide superscalar processor. An 8 segment SLIQ improves scalability by reducing the issue latency by 38.3% while incurring an IPC loss of only 2.3%. Further, the 8 segment SLIQ significantly reduces the energy consumption and energy-delay product by 48.3% and 67.4% respectively on average.