Influência da energia de soldagem em uniões de lâminas finas através de laser pulsado de Nd:YAG

Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)

Development of Robotized Laser Welding Applications for Joining Thin Sheets

Laser Welding (LW) is more often used in manufacturing due to its advantages, such as accurate control, good repeatability, less heat input, opportunities for joining of special materials, high speed, capability to join small dimension parts etc. LW is dedicated to robotized manufacturing, and the fabrication cells are using various level of flexibility, from specialized robots to very flexible setups. This paper features several LW applications using two industrially-scaled manufacturing cells at UPM Laser Centre (CLUPM) of Polytechnical University of Madrid (Universidad Politécnica de Madrid). The one dedicated to Remote Laser Welding (RLW) of thin sheets for automotive and other sectors uses a CO2 laser of 3500 W. The second has a high flexibility, is based on a 6-axis ABB robot and a Nd:YAG laser of 3300 W, and is meant for various laser processing methods, including welding. After a short description of each cell, several LW applications experimented at CLUPM and recently implemented in industry are briefly presented: RLW of automotive coated sheets, LW of high strength automotive sheets, LW vs. laser hybrid welding (LHW) of Double Phase steel thin sheets, and LHW of thin sheets of stainless steel and carbon steel (dissimilar joints). The main technological issues overcame and the critical process parameters are pointed out. Conclusions about achievements and trends are provided.

New laser-based approaches to improve the passivation and rear contact quality in high effiency crystalline silicon solar cells

Laser processing has been the tool of choice last years to develop improved concepts in contact formation for high efficiency crystalline silicon (c-Si) solar cells. New concepts based on standard laser fired contacts (LFC) or advanced laser doping (LD) techniques are optimal solutions for both the front and back contacts of a number of structures with growing interest in the c-Si PV industry. Nowadays, substantial efforts are underway to optimize these processes in order to be applied industrially in high efficiency concepts. However a critical issue in these devices is that, most of them, demand a very low thermal input during the fabrication sequence and a minimal damage of the structure during the laser irradiation process. Keeping these two objectives in mind, in this work we discuss the possibility of using laser-based processes to contact the rear side of silicon heterojunction (SHJ) solar cells in an approach fully compatible with the low temperature processing associated to these devices. First we discuss the possibility of using standard LFC techniques in the fabrication of SHJ cells on p-type substrates, studying in detail the effect of the laser wavelength on the contact quality. Secondly, we present an alternative strategy bearing in mind that a real challenge in the rear contact formation is to reduce the damage induced by the laser irradiation. This new approach is based on local laser doping techniques previously developed by our groups, to contact the rear side of p-type c-Si solar cells by means of laser processing before rear metallization of dielectric stacks containing Al2O3. In this work we demonstrate the possibility of using this new approach in SHJ cells with a distinct advantage over other standard LFC techniques.

Silicon PV module customization using laser technology for new BIPV applications

It is well known that lasers have helped to increase efficiency and to reduce production costs in the photovoltaic (PV) sector in the last two decades, appearing in most cases as the ideal tool to solve some of the critical bottlenecks of production both in thin film (TF) and crystalline silicon (c-Si) technologies. The accumulated experience in these fields has brought as a consequence the possibility of using laser technology to produce new Building Integrated Photovoltaics (BIPV) products with a high degree of customization. However, to produce efficiently these personalized products it is necessary the development of optimized laser processes able to transform standard products in customized items oriented to the BIPV market. In particular, the production of semitransparencies and/or freeform geometries in TF a-Si modules and standard c-Si modules is an application of great interest in this market. In this work we present results of customization of both TF a-Si modules and standard monocrystalline (m-Si) and policrystalline silicon (pc-Si) modules using laser ablation and laser cutting processes. A discussion about the laser processes parameterization to guarantee the functionality of the device is included. Finally some examples of final devices are presented with a full discussion of the process approach used in their fabrication.

Fabrication of micro-channels in optical fibers using femtosecond laser pulses and selective chemical etching

The fabrication of micro-channels in single-mode optical fibers is demonstrated using focused femtosecond laser processing and chemical etching. Straight line micro-channels are achieved based on a simple technique which overcomes limitations imposed by the fiber curved surface.

Fabrication of micro-channels in optical fibers using femtosecond laser pulses and selective chemical etching

The fabrication of micro-channels in single-mode optical fibers is demonstrated using focused femtosecond laser processing and chemical etching. Straight line micro-channels are achieved based on a simple technique which overcomes limitations imposed by the fiber curved surface. © 2005 Optical Society of America.

Advances in characterisation, calibration and data processing speed of optical coherence tomography systems

This thesis describes advances in the characterisation, calibration and data processing of optical coherence tomography (OCT) systems. Femtosecond (fs) laser inscription was used for producing OCT-phantoms. Transparent materials are generally inert to infra-red radiations, but with fs lasers material modification occurs via non-linear processes when the highly focused light source interacts with the materials. This modification is confined to the focal volume and is highly reproducible. In order to select the best inscription parameters, combination of different inscription parameters were tested, using three fs laser systems, with different operating properties, on a variety of materials. This facilitated the understanding of the key characteristics of the produced structures with the aim of producing viable OCT-phantoms. Finally, OCT-phantoms were successfully designed and fabricated in fused silica. The use of these phantoms to characterise many properties (resolution, distortion, sensitivity decay, scan linearity) of an OCT system was demonstrated. Quantitative methods were developed to support the characterisation of an OCT system collecting images from phantoms and also to improve the quality of the OCT images. Characterisation methods include the measurement of the spatially variant resolution (point spread function (PSF) and modulation transfer function (MTF)), sensitivity and distortion. Processing of OCT data is a computer intensive process. Standard central processing unit (CPU) based processing might take several minutes to a few hours to process acquired data, thus data processing is a significant bottleneck. An alternative choice is to use expensive hardware-based processing such as field programmable gate arrays (FPGAs). However, recently graphics processing unit (GPU) based data processing methods have been developed to minimize this data processing and rendering time. These processing techniques include standard-processing methods which includes a set of algorithms to process the raw data (interference) obtained by the detector and generate A-scans. The work presented here describes accelerated data processing and post processing techniques for OCT systems. The GPU based processing developed, during the PhD, was later implemented into a custom built Fourier domain optical coherence tomography (FD-OCT) system. This system currently processes and renders data in real time. Processing throughput of this system is currently limited by the camera capture rate. OCTphantoms have been heavily used for the qualitative characterization and adjustment/ fine tuning of the operating conditions of OCT system. Currently, investigations are under way to characterize OCT systems using our phantoms. The work presented in this thesis demonstrate several novel techniques of fabricating OCT-phantoms and accelerating OCT data processing using GPUs. In the process of developing phantoms and quantitative methods, a thorough understanding and practical knowledge of OCT and fs laser processing systems was developed. This understanding leads to several novel pieces of research that are not only relevant to OCT but have broader importance. For example, extensive understanding of the properties of fs inscribed structures will be useful in other photonic application such as making of phase mask, wave guides and microfluidic channels. Acceleration of data processing with GPUs is also useful in other fields.

Laser machining steel for moulds: a case study

Laser beam machining is a non-traditional subtractive manufacturing process, a form of machining, in which a laser is directed towards the work piece for machining. This process uses thermal energy to remove material from metallic or non-metallic surfaces. The laser is focused onto the surface to be worked and the thermal energy of the laser is transferred to the surface, heating and melting or vaporizing the material. Laser beam machining is best suited for brittle materials with low conductivity, but can be used on most materials. The role of the technical equipment in laser milling is to perform a controllable action of the laser radiation on the material to be treated. The laser is the main unit of the equipment and it is characteristics determine to great extent the qualitative and quantitative parameters of the technological treatments. In this work, I had to study the laser milling process parameter selection for process planning operations from start to finish. It was important to have an understanding about laser milling and laser processing parameters for different materials. As a result from the laser milling, the surface finish will have different surface properties such as, surface hardness, surface roughness, friction and tribology etc.. During the process, I gained knowledge about the historical and conceptual framework of laser milling, the different parameters of a laser milling and how the laser milling parameters influence the surface properties of the machined parts.

DFM(A)- aspects for a horn antenna design

In this paper aspects of design for manufacturability and assembly (DFMA) are applied to the design of coaxially fed standard gain horn antenna for 1.70 - 2.60 GHz. Possibilities to utilize cross-technological approach method is examined. Methods of DFMA for laser processing are covered and practical design guides and methods are developed. Antenna construction for easy manufacturing and specialized performance is shown. Required dimensions and tolerances are discussed and suitable materials for laser processing are selected.

Design and manufacture of a microdistillation column

Aim of this thesis was to design and manufacture a microdistillation column. The literature review part of this thesis covers stainless steels, material processing and basics about engineering design and distillation. The main focus, however, is on the experimental part. Experimental part is divided into five distinct sections: First part is where the device is introduced and separated into three parts. Secondly the device is designed part by part. It consists mostly of detail problem solving, since the first drawings had already been drawn and the critical dimensions decided. Third part is the manufacture, which was not fully completed since the final assembly was left out of this thesis. Fourth part is the test welding for the device, and its analysis. Finally some ideas for further studies are presented. The main goal of this thesis was accomplished. The device only lacks some final assembly but otherwise it is complete. One thing that became clear during the process was how difficult it is to produce small and precise steel parts with conventional manufacturing methods. Internal stresses within steel plates and thermal distortions can easily ruin small steel structures. Designing appropriate welding jigs is an important task for even simple devices. Laser material processing is a promising tool for this kind of steel processing because of the flexibility, good cutting quality and also precise and low heat input when welding. Next step in this project is the final assembly and the actual distillation tests. The tests will be carried out at Helsinki University of Technology.

Pulssitettu laserablaatio mikrofluidisten kanavistojen sarjatuotantomenetelmänä

Puolijohteiden yleistyttyä vuodesta 1948 alkaen, ovat elektroniset laitteet pienentyneet jatkuvasti tehojen kuitenkin kasvaessa. Kasvaneet tehotiheydet kuitenkin vaikeuttavat laitesuunnittelua, sillä puoljohdekomponenttien suorituskyvylle ja eliniälle on oleellista lämpötilojen ja lämpötilavaihteluiden minimointi. Perinteisen ilmajäähdytyksen lähestyessä rajojaan niin kokonaistehon kuin järkevän energiatehokkuudenkin suhteen, on parhaaksi seuraavaksi teknologiaksi ennustettu kaksifaasijäähdytystä, jonka suorituskyky ja energiatehokkuus ovat vaaditulla tasolla. Kaksifaasijäähdytyksen optimaaliselle toiminnalle tärkeää on hyvin suunniteltu ja tarkasti valmistettu lämmönsiirtopinta, jota kutsutaan mikrokanavistoksi. Pulssitettu laserkaiverrus on edistynyt valmistustekniikka, jonka tarkkuus ja luotettavuus sopisivat mikrokanavistojen valmistamiseen. Laserkaiverruksella saavutettavat lopputulokset vaihtelevat kuitenkin materiaalista riippuen ja kupari – jota käytetään yleisesti lämmönjohteena – on eräs huonoimmin lasertyöstöön reagoivista materiaaleista ja siksi on oleellista selvittää laser-kaiverruksen toimivuutta kuparisten mikrokanavistojen valmistuksessa. Pulssitetun laser-kaiverruksen eri variaatioista nanosekunti-luokan pulssinpituuksilla toimivat laitteet ovat jatkuvan tuotannon kannalta paras vaihtoehto niiden hyvän tuottavuuden, saatavuuden sekä kohtuullisen alkuinvestoinnin vuoksi. Käytännön kaiverruskokeiden perusteella selvisi, että menetelmä on laatunsa ja tarkkuutensa puolesta sopiva varsinaiseen tuotantoon. Kaiverruksen tehokkuus kuparia työstettäessä on kuitenkin ennakoituakin heikompi ja niin valmistus- kuin suunnitelu-prosessikin vaativat vielä jatkotutkimusta ja -kehitystä.

VUV-Laserablation von Spinnenseide

Spinnenseide gehört zu den stabilsten bekannten Polymerverbindungen. Spinnfäden können bis auf das Dreifache ihrer ursprünglichen Länge gedehnt werden, bevor sie reißen, und dabei mit rund 160 MJ/m³ mehr als dreimal soviel Energie absorbieren wie die stärkste synthetisch hergestellte Faser Kevlar (50 MJ/m³). Dabei weisen Spinnfäden mit 2 bis 5 Mikrometer nur ein Zehntel des Durchmessers eines menschlichen Haares auf. Das präzise, berührungslose Bearbeiten von Spinnenseide ist für verschiedene technische Anwendungen interessant, insbesondere wenn dabei ihre außergewöhnlichen Eigenschaften erhalten bleiben. Könnten die von Natur aus dünnen Seidenfäden gezielt in ihrem Durchmesser verringert werden, so wären sie unter anderem in der Mikroelektronik einzusetzen. Hier könnten sie als Trägermaterial für eine dünne, elektrisch leitfähige Schicht fungieren. Man erhielte Nanodrähte, die auch in mechanisch besonders belasteten Mikroelektronikbauteilen (MEMS) Verwendung finden könnten. In dieser Arbeit wird die Verwendung der laserinduzierten Ablation zur gezielten Bearbeitung von Haltefäden der Schwarzen Witwe (Latrodectus hesperus) beschrieben. Eingesetzt wurde ein VUV-Excimerlaser vom Typ LPF 205 (Lambda-Physik, Göttingen) mit einer Wellenlänge von 157 nm und einer Pulsdauer von 18 ns. Eine berührungslose Laserbearbeitung bei 157 nm erlaubt einen effizienten und präzisen Abtrag von Material durch Ablation aufgrund der geringen optischen Eindringtiefe von unter 100 nm oberhalb einer Schwellenfluenz (Energie/Fläche) von Φth=29 mJ/cm², ohne dabei das umgebende Material thermisch zu beeinträchtigen. Parallel zur Ablation setzt allerdings eine wellenförmige Oberflächenstrukturierung auf der Faseroberfläche ein, wodurch die mechanische Belastbarkeit der Faser entscheidend geschwächt wird. Die Ursache hierfür liegt im Abbau materialbedingter Spannungsfelder („stress release“) innerhalb einer durch das Laserlicht induzierten dünnen Schmelzschicht. Im Rahmen dieser Arbeit ist es nun gelungen, diese Strukturen durch einen anschließenden Glättungsprozeß zu entfernen. Dabei wird auf der bestrahlten Oberfläche mittels Laserlichts eine glatte Ablation erzielt. Mit feinerer Abstufung dieser Prozeßschritte konnte der Durchmesser des verwendeten Spinnenseidefadens zum Teil um 70 Prozent bis auf ca. 750 nm verringert werden. Durch Zugfestigkeitsexperimente wurde belegt, daß die mechanischen Eigenschaften der so bearbeiteten Spinnenseide weitgehend erhalten bleiben. Die im Rahmen dieser Arbeit angewandte Methode erlaubt somit eine präzise Laserablation von Spinnenseide und ähnlichen hochabsorbierenden Materialien, ohne deren Kernsubstanz in ihrer Beschaffenheit zu verändern.

Fabrication of microenvironments with different geometrical features for cell growth studies

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Burning Graphene Layer-by-Layer

Graphene, in single layer or multi-layer forms, holds great promise for future electronics and high-temperature applications. Resistance to oxidation, an important property for high-temperature applications, has not yet been extensively investigated. Controlled thinning of multi-layer graphene (MLG), e.g., by plasma or laser processing is another challenge, since the existing methods produce non-uniform thinning or introduce undesirable defects in the basal plane. We report here that heating to extremely high temperatures (exceeding 2000 K) and controllable layer-by-layer burning (thinning) can be achieved by low-power laser processing of suspended high-quality MLG in air in "cold-wall" reactor configuration. In contrast, localized laser heating of supported samples results in non-uniform graphene burning at much higher rates. Fully atomistic molecular dynamics simulations were also performed to reveal details of oxidation mechanisms leading to uniform layer-by-layer graphene gasification. The extraordinary resistance of MLG to oxidation paves the way to novel high-temperature applications as continuum light source or scaffolding material.

Highly thermally responsive hybrid in-fiber slab waveguide grating structure with a plastic core and a silica cladding

A 1.2(height)×125(depth)×500(length) micro-slot was engraved along a fiber Bragg grating by chemically assisted femtosecond laser processing. By filling epoxy and UV-curing, waveguide with plastic-core and silica-cladding was created, presenting high thermal responding coefficient of 211pm/°C.