923 resultados para Fishes--Effect of temperature on.


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Thermally stable high-resistivity regions have been formed using hydrogen ion implantation at three energies (50, 100, and 180 keV) with three corresponding doses (6 X 10(14) 1.2 X 10(15), and 3 X 10(15) cm(-2)), oxygen implantation at 280keV with 2 X 10(14) cm(-2) as well as subsequent annealing at about 600 degrees C for 10-20s, in AlGaAs/GaAs multiple epitaxial heterojunction structure. After anncaling at 600 degrees C, the sheet resistivity increases by six orders more of magnitude from the as-grown values. This creation of high resistivity is different from that of the conventional damage induced isolation by H or O single implantation which becomes ineffective when anneal is carried out at 400-600 degrees C and the mechanism there of is discussed.

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The power-time curves of growth of three strains of petroleum bacteria at different NaCl concentrations at 40.0 and 50.0 degreesC have been determined by using a 2277 Thermometric Thermal Activity Analyser. An equation of a power-time curve, ln[alphaP(K)/P(t) - 1] = ln[(alphaK - N-0)/N-0] - alphakt, was established based on the generalized logistic equation, where P(t) is the thermal power at time t, K the carrying capacity, P-K = P0K, P-0 the thermal power of one cell, N-0 the bacterial population at time zero, alpha = (k - D)/k. The method of four observed points with the same time interval was used to calculate the value of P-K. The growth rate constant k and the death rate constant D were calculated. The NaCl concentration of optimum growth rate of petroleum bacteria at 40.0 and 50.0 degreesC, respectively, have been obtained according to the curves k - D versus NaCl concentration, which are 0.26, 0.54 and 0.57 mol l(-1) for B-1, B-2 and B-3, respectively, at 50.0 degreesC, 0.26, 0.55 and 0.56 mol l(-1) for B-1, B-2 and B-3, respectively, at 40.0 degreesC. The results indicated that the effect of temperature on NaCl concentration of optimum growth rate was small. (C) 2002 Elsevier Science B.V. All rights reserved.

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Reliability of electronic parts is a major concern for many manufacturers, since early failures in the field can cost an enormous amount to repair - in many cases far more than the original cost of the product. A great deal of effort is expended by manufacturers to determine the failure rates for a process or the fraction of parts that will fail in a period of time. It is widely recognized that the traditional approach to reliability predictions for electronic systems are not suitable for today's products. This approach, based on statistical methods only, does not address the physics governing the failure mechanisms in electronic systems. This paper discusses virtual prototyping technologies which can predict the physics taking place and relate this to appropriate failure mechanisms. Simulation results illustrate the effect of temperature on the assembly process of an electronic package and the lifetime of a flip-chip package.

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Variation in temperature can have a significant impact on the rheological characterisation of solder pastes used in the electronic assembly of surface mount devices. This paper concerns the study of the effect of temperature on slumping characteristics of lead-free solder pastes. The identification of the slumping characteristics can help in the correlation of the pastes characteristics to its printing performance. Further issues, which aid in justifying the undertaking of such a study, include the temperature differences identified both at the squeegee during the print, and during reflow. Due to these temperature variations, it is imperative to understand how slump differs with a temperature gradient

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The effect of temperature on respiration rate has been established, using Cartesian divers, for the meiofaunal sabellid polychaeteManayunkia aestuarina, the free-living nematodeSphaerolaimus hirsutus and the harpacticoid copepodTachidius discipes from a mudflat in the Lynher estuary, Cornwall, U.K. Over the temperature range normally experienced in the field, i.e. 5–20° C the size-compensated respiration rate (R c) was related to the temperature (T) in °C by the equation Log10 R c=-0.635+0.0339T forManayunkia, Log10 R c=0.180+0.0069T forSphaerolaimus and Log10 R c=-0.428+0.0337T forTachidius, being equivalent toQ 10 values of 2.19, 1.17 and 2.17 respectively. In order to derive the temperature response forManayunkia a relationship was first established between respiration rate and body size: Log10 R=0.05+0.75 Log10 V whereR=respiration in nl·O2·ind-1·h-1 andV=body volume in nl. TheQ 10 values are compared with values for other species derived from the literature. From these limited data a dichotomy emerges: species with aQ 10≏2 which apparently feed on diatoms and bacteria, the abundance of which are subject to large short term variability, and species withQ 10≏1 apparently dependent on more stable food sources.

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The adsorption and electrooxidation of CO at a Ru(0001) electrode in perchloric acid solution have been investigated as a function of temperature, potential and time using in situ FTIR spectroscopy. This builds upon and extends previous work on the same system carried out at room temperature. As was observed at room temperature, both linear (CO) and 3-fold-hollow (CO) binding CO adsorbates (bands at 2000-2045 cm and 1768-1805 cm, respectively) were detected on the Ru(0001) electrode at 10°C and 50°C. However, the temperature of the Ru(0001) electrode had a significant effect upon the structure and behavior of the CO adlayer. At 10°C, the in-situ FTIR data showed that the adsorbed CO species still remain in rather compact islands up to ca. 1100 mV vs Ag/AgCl as the CO oxidation reaction proceeds, with oxidation occurring only at the boundaries between the CO and active surface oxide/hydroxide domains. However, the IR data collected at 50°C strongly suggest that the adsorbed CO species are present as relatively looser and weaker structures, which are more easily electro-oxidized. The temperature-, potential-, and coverage-dependent relaxation and compression of the CO adlayer at low coverages are also discussed.