Numerical algorithms for modelling electrodeposition: Tracking the deposition front under forced convection from megasonic agitation

Electrodeposition is a widely used technique for the fabrication of high aspect ratio microstructures. In recent years, much research has been focused within this area aiming to understand the physics behind the filling of high aspect ratio vias and trenches on substrates and in particular how they can be made without the formation of voids in the deposited material. This paper reports on the fundamental work towards the advancement of numerical algorithms that can predict the electrodeposition process in micron scaled features. Two different numerical approaches have been developed, which capture the motion of the deposition interface and 2-D simulations are presented for both methods under two deposition regimes: those where surface kinetics is governed by Ohm’s law and the Butler–Volmer equation, respectively. In the last part of this paper the modelling of acoustic forces and their subsequent impact on the deposition profile through convection is examined.

The processes involved in the Se electrodeposition and dissolution on Au electrode: the H2Se formation

The processes involved in the Se electrodeposition, mainly the one related to the formation of H2Se species on Au electrode in perchloric acid solutions, have been investigated through cyclic voltammetry, electrochemical quartz crystal microbalance (EQCM), rotating ring-disc electrode (RRDE), and atomic force microscopy (AFM) techniques. In the experiments performed with the EQCM, with the potential sweep in the negative direction, the responses for the mass variation were divided in three well-defined potential regions: A (from 1.55 to 0.35 V), B (from 0.35 to -0.37 V), and C (from -0.37 to -0.49 V). It was verified that the following processes can occur, respectively: the species (AuO)(2)H2SeO3 was desorbed during the AuO reduction, the reduction of Se(IV) to Se(0), and the formation of H2Se. When the potential was swept in the positive direction, the responses for the mass variation were divided in four well-defined potential regions: D (from -0.49 to 0.66 V), E (from 0.66 to 0.99 V), F (from 0.99 to 1.26 V), and G (from 1.26 to 1.55 V), and the described processes in these regions were, respectively: the Se deposition and adsorption of water molecules and/or perchlorate ions, the Se dissolution, the Se incorporating mass in the form of HO-Se, and the Au oxidation (all potentials are referred to the Ag/AgCl electrode). Making use of the RRDE, using the collection technique, the formation of H2Se species during the Se electrodeposition was investigated. Therefore, it was confirmed that this species is formed on the disc electrode between -0.3 and -0.55 V vs the Ag/AgCl potential range (collecting the oxidized compound onto the ring electrode). AFM images also indicated that the surface topography of the Se-massive deposit on Au is different from the images registered after the formation of H2Se species, confirming the cathodic stripping of Se.

Electrodeposition and characterization of undoped and nitrogen-doped ZnSe films

Semiconducting films of (n-type) ZnSe and (p-type) nitrogen-doped ZnSe were electrodeposited by a linear-sweep voltammetric technique on to a substrate of fluorine-tin oxide (FM) glass ceramics. The films were characterized by scanning electron microscopy, energy-dispersive X-ray analysis and grazing-incidence X-ray diffraction. The results indicated that the material was deposited uniformly over the substrate, forming clusters when the Zn content of the bath was 0.1 mol L(-1) and a film when it was 0.2 or 0.3 mol L(-1). The effectiveness of doping the films with nitrogen by adding ammonium sulfate to the deposition solution was assessed by measuring the film-electrolyte interface capacitance (C) at various applied potentials (E(ap)) and plotting Mott-Schottky curves (C(-2) vs E(ap)), whose slope sign was used to identify p-type ZnSe. (C) 2009 Elsevier B.V. All rights reserved.

In Situ Quantification of Cu(II) during an Electrodeposition Reaction Using Time-Domain NMR Relaxometry

The use of a low-cost benchtop time-domain NMR (TD-NMR) spectrometer to monitor copper electrodeposition in situ is presented. The measurements are based on the strong linear correlation between the concentration of paramagnetic ions and the transverse relaxation rates (R-2) of the solvent protons Two electrochemical NMR (EC-NMR) cells were constructed and applied to monitor the Cu2+ concentration during the electrodeposition reaction. The results show that TD-NMR relaxometry using the Carr-Purcell-Meiboom-Gill pulse sequence can be a very fast, simple, and efficient technique to monitor, in real time, the variation in the Cu2+ concentration during an electrodeposition reaction. This methodology can also be applied to monitor the electrodeposition of other paramagnetic ions, such as Ni2+ and Cr3+, which are commonly used in electroplating.

Multifunctional core–shell Co–SiO2 nanowires via electrodeposition and sol–gel techniques

In this work, we propose a new strategy for the synthesis of multifunctional nanowires using a combination of sol–gel and electrodeposition techniques, based on a two-step procedure. First of all, nanotubes of SiO2 are synthesized via a sol–gel technique using polycarbonate membranes as templates. Homogenous nanotubes are obtained after centrifugation and thermal annealing. Afterwards, a ferromagnetic cobalt core is grown using potentiostatic electrodeposition. Finally, the core–shell Co–SiO2 nanowires are released by dissolving the template using wet-etching. These nanodevices can be used for many detection and sensing purposes. As a proof of concept, we have developed a pH nanosensor by including a pH-sensitive organic dye in the SiO2 shell. The sensing principle is based on the optical response of the organic dye towards pH when added to a solution. The magnetic core allows the recovery of the nanosensors after use. These nanowires can therefore be used as recoverable pH nanosensors. By changing the dye molecule to another molecule or receptor, the procedure described in the paper can be used to synthesize nanodevices for many different applications.

Electrodeposition on magnesium alloy diecasting

Magnesium alloy diecasting AZ91CC, AZ61CC', AZ91HC and AZ71HC were electroplated using different pretreatment sequences which incorporated conventional zincate immersion processes. Satisfactory peel adhesion in excess of 7. 7 KNm -1 was achieved on AZ61CC using a sequence which was designated Canning. The comparatively low adhesion achieved on the AZ91HC was due to its poor surface quality as cast. Growth of deposits was monitored using a strip-and-analysis technique and the morphology of the various deposits were studied using scanning electron microscopy. Different pretreatment sequences resulted in different surface responses for the alloys but all alloys behaved in a similar manner in a particular sequence with regard to potential time-curves and the rate of zinc deposition. The role of fluoride in both the second stage solution and zinc immersion stages of the Canning pretreatment sequence was studied using techniques listed above and Auger electron spectroscopy. Complete coverage of the magnesium alloy surface with immersion zinc was achieved when fluoride was absent from the zincating solution. However, a zero adhesion value was indicated in both thermal cycling and peel tests. The presence of fluoride in the immersion zinc solution suppressed the rate of zinc deposition and affected the time taken to reach equilibrium during potential-time determinations. A mechanism is suggested to explain the significance of fluoride additions to the processing solutions. pH and composition of the zincating solution had a significant effect on the time taken to produce the step observed in the potential/time curves and hence equilibrium potential. Immersion zinc deposition occurred rapidly at first but then changed to a lower uniform rate at a point corresponding approximately to the step in the potential/time curve. Although the minimun levels of adhesion, using the Canning sequence, varied from 7.72 KNm-1 for alloy AZ61CC to 1.54 KNm-1 for alloy AZ91HC, all the alloys revealed ductile failure characteristics in the surface layer of the substrate after peel testing. Plated magnesium alloys exhibited good corrosion resistance when appropriately pretreated and overplated with adequate nickel chromium coatings. The immersion zinc layer was not preferentially attacked when pits penetrated to the coating/substrate interface. Hemispherical pits formed and attack on the substrate was severe. Of the pretreatment sequences investigated, the Canning one was the most premising with respect to peel adhesion and corrosion behaviour.

Electrodeposition on aluminium and its alloys

Aluminium alloys S1C, NS4, HE9, LM25 and the 'difficult' zinc containing U.S. specification alloy used for automobile bumpers (X-7046), have been successfully electroplated using pretreatments which utilized either conventional immersion, elevated temperature or electrolytic modified alloy zincate (M.A.Z.) deposits. Satisfactory adhesion in excess of 7•5 KN m -I was only achieved on X-7046 using an electrolytic M.A.Z. pretreatment. The limitations of simple zincate solutions were demonstrated. Growth of deposits ~as monitored using a weight loss technique and the morphology of the various deposits studied using scanning electron microscopy. The characteristics of a specific alloy and processing sequence selected had a significant influence on the growth and morphology of the N.A.Z. deposi t. These all affected subsequent adhesion of electrodeposited nickel. The advantages of double-dip sequences were confirmed. Superior adhesion was associated with a uniform, thin, fine grained M.A.Z. deposit which exhibited rapid and complete surface coverage of the aluminium alloy. The presence of this preferred type deposit did not guarantee adhesion because a certain degree of etching was essential. For a satisfactory combination of alloy and M.A.Z. pretreatment, there was a specific optimum film weight per unit area which resulted in maximum adhesion. An ideal film weight of 0•06 :!: 0•01 mg cm-2was determined for S1C. Different film weights were required for the other alloys due to variations in surface topography caused by pretreatment. S1C was the easiest alloy on which to achieve high bond strength. Peel adhesion was not directly related to tensile strength of the alloy. The highest adhesion value was obtained on S1C which had the lowest strength of the alloys studied. The characteristics of the failure surfaces after peeling depended on alloy type, adhesion level and pretreatment employed. Plated aluminium alloys exhibited excellent corrosion resistance when appropriately pretreated. The M.A.Z. layer was not preferentially attacked. There was a threshold value of adhesion below which corrosion performance ~a8 poor. Alloy type, pretreatment and coating system influenced corrosion performance. Microporous chromium gave better corrosion protection than decorative chromium.