957 resultados para On-Chip Multiprocessor (OCM)


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Pullpipelining, a pipeline technique where data is pulled from successor stages from predecessor stages is proposed Control circuits using a synchronous, a semi-synchronous and an asynchronous approach are given. Simulation examples for a DLX generic RISC datapath show that common control pipeline circuit overhead is avoided using the proposal. Applications to linear systolic arrays in cases when computation is finished at early stages in the array are foreseen. This would allow run-time data-driven digital frequency modulation of synchronous pipelined designs. This has applications to implement algorithms exhibiting average-case processing time using a synchronous approach.

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This paper discusses the design, implementation and synthesis of an FFT module that has been specifically optimized for use in the OFDM based Multiband UWB system, although the work is generally applicable to many other OFDM based receiver systems. Previous work has detailed the requirements for the receiver FFT module within the Multiband UWB ODFM based system and this paper draws on those requirements coupled with modern digital architecture principles and low power design criteria to converge on our optimized solution. The FFT design obtained in this paper is also applicable for implementation of the transmitter IFFT module therefore only needing one FFT module for half-duplex operation. The results from this paper enable the baseband designers of the 200Mbit/sec variant of Multiband UWB systems (and indeed other OFDM based receivers) using System-on-Chip (SoC), FPGA and ASIC technology to create cost effective and low power solutions biased toward the competitive consumer electronics market.

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This paper discusses the design, implementation and synthesis of an FFT module that has been specifically optimized for use in the OFDM based Multiband UWB system, although the work is generally applicable to many other OFDM based receiver systems. Previous work has detailed the requirements for the receiver FFT module within the Multiband UWB ODFM based system and this paper draws on those requirements coupled with modern digital architecture principles and low power design criteria to converge on our optimized solution particularly aimed at a low-clock rate implementation. The FFT design obtained in this paper is also applicable for implementation of the transmitter IFFT module therefore only needing one FFT module in the device for half-duplex operation. The results from this paper enable the baseband designers of the 200Mbit/sec variant of Multiband UWB systems (and indeed other OFDM based receivers) using System-on-Chip (SoC), FPGA and ASIC technology to create cost effective and low power consumer electronics product solutions biased toward the very competitive market.

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Schottky barrier diodes have been integrated into on-chip rectangular waveguides. Two novel techniques have been developed to fabricate diodes with posts suitable for integration into waveguides. One technique produces diodes with anode diameters of the order of microns with post heights from 90 to 125 microns and the second technique produces sub-micron anodes with post heights around 20 microns. A method has been developed to incorporate these structures into a rectangular waveguide and provide a top contact onto the anode which could be used as an I.F. output in a mixer circuit. Devices have been fabricated and D.C. characterized.

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A new technique is reported for micro-machining millimetre-wave rectangular waveguide components. S-parameter measurements on these structures show that they achieve lower loss than those produced using any other on-chip fabrication technique, have highly accurate dimensions, are physically robust, and are cheap and easy to manufacture.

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This paper proposes a parallel hardware architecture for image feature detection based on the Scale Invariant Feature Transform algorithm and applied to the Simultaneous Localization And Mapping problem. The work also proposes specific hardware optimizations considered fundamental to embed such a robotic control system on-a-chip. The proposed architecture is completely stand-alone; it reads the input data directly from a CMOS image sensor and provides the results via a field-programmable gate array coupled to an embedded processor. The results may either be used directly in an on-chip application or accessed through an Ethernet connection. The system is able to detect features up to 30 frames per second (320 x 240 pixels) and has accuracy similar to a PC-based implementation. The achieved system performance is at least one order of magnitude better than a PC-based solution, a result achieved by investigating the impact of several hardware-orientated optimizations oil performance, area and accuracy.

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Genetic algorithms are commonly used to solve combinatorial optimizationproblems. The implementation evolves using genetic operators (crossover, mutation,selection, etc.). Anyway, genetic algorithms like some other methods have parameters(population size, probabilities of crossover and mutation) which need to be tune orchosen.In this paper, our project is based on an existing hybrid genetic algorithmworking on the multiprocessor scheduling problem. We propose a hybrid Fuzzy-Genetic Algorithm (FLGA) approach to solve the multiprocessor scheduling problem.The algorithm consists in adding a fuzzy logic controller to control and tunedynamically different parameters (probabilities of crossover and mutation), in anattempt to improve the algorithm performance. For this purpose, we will design afuzzy logic controller based on fuzzy rules to control the probabilities of crossoverand mutation. Compared with the Standard Genetic Algorithm (SGA), the resultsclearly demonstrate that the FLGA method performs significantly better.

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This work presents the concept, design and implementation of a MP-SoC platform, named STORM (MP-SoC DirecTory-Based PlatfORM). Currently the platform is composed of the following modules: SPARC V8 processor, GPOP processor, Cache module, Memory module, Directory module and two different modles of Network-on-Chip, NoCX4 and Obese Tree. All modules were implemented using SystemC, simulated and validated, individually or in group. The modules description is presented in details. For programming the platform in C it was implemented a SPARC assembler, fully compatible with gcc s generated assembly code. For the parallel programming it was implemented a library for mutex managing, using the due assembler s support. A total of 10 simulations of increasing complexity are presented for the validation of the presented concepts. The simulations include real parallel applications, such as matrix multiplication, Mergesort, KMP, Motion Estimation and DCT 2D

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This paper deals with the design of a network-on-chip reconfigurable pseudorandom number generation unit that can map and execute meta-heuristic algorithms in hardware. The unit can be configured to implement one of the following five linear generator algorithms: a multiplicative congruential, a mixed congruential, a standard multiple recursive, a mixed multiple recursive, and a multiply-with-carry. The generation unit can be used both as a pseudorandom and a message passing-based server, which is able to produce pseudorandom numbers on demand, sending them to the network-on-chip blocks that originate the service request. The generator architecture has been mapped to a field programmable gate array, and showed that millions of numbers in 32-, 64-, 96-, or 128-bit formats can be produced in tens of milliseconds. (C) 2011 Elsevier B.V. All rights reserved.

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We have recently proposed an extension to Petri nets in order to be able to directly deal with all aspects of embedded digital systems. This extension is meant to be used as an internal model of our co-design environment. After analyzing relevant related work, and presenting a short introduction to our extension as a background material, we describe the details of the timing model we use in our approach, which is mainly based in Merlin's time model. We conclude the paper by discussing an example of its usage. © 2004 IEEE.

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Artificial Neural Networks are widely used in various applications in engineering, as such solutions of nonlinear problems. The implementation of this technique in reconfigurable devices is a great challenge to researchers by several factors, such as floating point precision, nonlinear activation function, performance and area used in FPGA. The contribution of this work is the approximation of a nonlinear function used in ANN, the popular hyperbolic tangent activation function. The system architecture is composed of several scenarios that provide a tradeoff of performance, precision and area used in FPGA. The results are compared in different scenarios and with current literature on error analysis, area and system performance. © 2013 IEEE.

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Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)

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Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

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Current SoC design trends are characterized by the integration of larger amount of IPs targeting a wide range of application fields. Such multi-application systems are constrained by a set of requirements. In such scenario network-on-chips (NoC) are becoming more important as the on-chip communication structure. Designing an optimal NoC for satisfying the requirements of each individual application requires the specification of a large set of configuration parameters leading to a wide solution space. It has been shown that IP mapping is one of the most critical parameters in NoC design, strongly influencing the SoC performance. IP mapping has been solved for single application systems using single and multi-objective optimization algorithms. In this paper we propose the use of a multi-objective adaptive immune algorithm (M(2)AIA), an evolutionary approach to solve the multi-application NoC mapping problem. Latency and power consumption were adopted as the target multi-objective functions. To compare the efficiency of our approach, our results are compared with those of the genetic and branch and bound multi-objective mapping algorithms. We tested 11 well-known benchmarks, including random and real applications, and combines up to 8 applications at the same SoC. The experimental results showed that the M(2)AIA decreases in average the power consumption and the latency 27.3 and 42.1 % compared to the branch and bound approach and 29.3 and 36.1 % over the genetic approach.

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This thesis deals with two important research aspects concerning radio frequency (RF) microresonators and switches. First, a new approach for compact modeling and simulation of these devices is presented. Then, a combined process flow for their simultaneous fabrication on a SOI substrate is proposed. Compact models for microresonators and switches are extracted by applying mathematical model order reduction (MOR) to the devices finite element (FE) description in ANSYS c° . The behaviour of these devices includes forms of nonlinearities. However, an approximation in the creation of the FE model is introduced, which enables the use of linear model order reduction. Microresonators are modeled with the introduction of transducer elements, which allow for direct coupling of the electrical and mechanical domain. The coupled system element matrices are linearized around an operating point and reduced. The resulting macromodel is valid for small signal analysis around the bias point, such as harmonic pre-stressed analysis. This is extremely useful for characterizing the frequency response of resonators. Compact modelling of switches preserves the nonlinearity of the device behaviour. Nonlinear reduced order models are obtained by reducing the number of nonlinearities in the system and handling them as input to the system. In this way, the system can be reduced using linear MOR techniques and nonlinearities are introduced directly in the reduced order model. The reduction of the number of system nonlinearities implies the approximation of all distributed forces in the model with lumped forces. Both for microresonators and switches, a procedure for matrices extraction has been developed so that reduced order models include the effects of electrical and mechanical pre-stress. The extraction process is fast and can be done automatically from ANSYS binary files. The method has been applied for the simulation of several devices both at devices and circuit level. Simulation results have been compared with full model simulations, and, when available, experimental data. Reduced order models have proven to conserve the accuracy of finite element method and to give a good description of the overall device behaviour, despite the introduced approximations. In addition, simulation is very fast, both at device and circuit level. A combined process-flow for the integrated fabrication of microresonators and switches has been defined. For this purpose, two processes that are optimized for the independent fabrication of these devices are merged. The major advantage of this process is the possibility to create on-chip circuit blocks that include both microresonators and switches. An application is, for example, aswitched filter bank for wireless transceiver. The process for microresonators fabrication is characterized by the use of silicon on insulator (SOI) wafers and on a deep reactive ion etching (DRIE) step for the creation of the vibrating structures in single-crystal silicon and the use of a sacrificial oxide layer for the definition of resonator to electrode distance. The fabrication of switches is characterized by the use of two different conductive layers for the definition of the actuation electrodes and by the use of a photoresist as a sacrificial layer for the creation of the suspended structure. Both processes have a gold electroplating step, for the creation of the resonators electrodes, transmission lines and suspended structures. The combined process flow is designed such that it conserves the basic properties of the original processes. Neither the performance of the resonators nor the performance of the switches results affected by the simultaneous fabrication. Moreover, common fabrication steps are shared, which allows for cheaper and faster fabrication.