Experimental investigation of three-layer electromagnetically coupled circular microstrip antennas

The broadband behaviour of a three-layer electromagnetically coupled circular microstrip antenna is investigated experimentally. The effects of interlayer spacings and the thickness of the parasitic layers on the impedance bandwidth, 3 dB beamwidth and pattern shape, are studied. Experiments show that this structure can provide a frequency bandwidth as high as 20% with a low crosspolarisation level and a moderately high gain.

Broadband stacked three-layer circular microstrip antenna arrays

The broadband aspects of stacked three-layer electromagnetically coupled circular microstrip antenna arrays are investigated experimentally. Experiments carried out on 8-element linear microstrip antenna arrays, using optimized stacked three-layer circular microstrip antenna elements, configured in E- and H-planes, have exhibited an impedance bandwidth of 20 percent, with a high gain and a good pattern shape with sidelobe as well as crosspolarization levels better than -20 dB through a scan angle of 40 deg from the broadside.

Effect of tolerance on the propagation characteristic of a superconducting thin film microstrip delay line

The propagation constant of a superconducting microstrip transmission delay line is evaluated using the spectral domain immitance approach, modelling the superconductor as a surface current having an equivalent surface impedance found through the complex resistive boundary condition. The sensitivity approach is used to study the beta variations with substrate parameters and film characteristics. Results show that the surface impedance does not have much influence on beta sensitivities with respect to epsilon r, W and h. However, it can be observed that the surface impedance plays a crucial role in determining the optimum design.

Modelling of a patch repair to a thin cracked sheet

Integrity enhancement of damaged or design deficient structures through repairs is attracting considerable engineering attention. Bonded composite patch repairs to cracked metallic sheets offer various advantages over riveted doubler type, particularly for airframe applications. This paper first reviews the R&D activity in the area of structural repairs. It then approaches the problem of a composite patch repair to a cracked aluminium sheet with different finite element modelling strategies and compares their outcome. The efficient finite element modelling approach thus established is used to study the effect of patch material, patch size, patch symmetry and adhesive thickness on repair performance as the crack grows in the repair configuration. (C) 1999 Elsevier Science Ltd. All rights reserved.

Residual strength and fatigue life assessment of composite patch repaired specimens

Design, analysis and technology for the integrity enhancement of damaged or underdesigned structures continues to be an engineering challenge. Bonded composite patch repairs to metallic structures is receiving increased attention in the recent years. It offers various advantages over rivetted doubler, particularly for airframe repairs. This paper presents an experimental investigation of residual strength and fatigue crack-growth life of an edge-cracked aluminium specimen repaired using glass epoxy composite patch. The investigation begins with the evaluation of three different surface treatments from bond strength viewpoint. A simple thumb rule formula is employed to estimate the patch size. Cracked and repaired specimens are tested under static and fatigue loading. The patch appears to restore the original strength of the undamaged specimen and enhance the fatigue crack growth life by an order of magnitude. (C) 1999 Elsevier Science Ltd. All rights reserved.

Development and studies on microstrip detector

We report development of gas microstrip detectors using thin film and lithography techniques. The detectors were tested for their performance for X-rays (5.9 keV) and a maximum gas gain of similar to 13,000 and best resolution of similar to 12% was obtained. Factors affecting gain and resolution were investigated. The detectors were tested for their one-dimensional position sensitivity. Meandering resistive strips were used for charge division method. A position resolution of 0.48 mm was obtained.