966 resultados para Analog electronic systems


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Esta tese insere-se na área da simulação de circuitos de RF e microondas, e visa o estudo de ferramentas computacionais inovadoras que consigam simular, de forma eficiente, circuitos não lineares e muito heterogéneos, contendo uma estrutura combinada de blocos analógicos de RF e de banda base e blocos digitais, a operar em múltiplas escalas de tempo. Os métodos numéricos propostos nesta tese baseiam-se em estratégias multi-dimensionais, as quais usam múltiplas variáveis temporais definidas em domínios de tempo deformados e não deformados, para lidar, de forma eficaz, com as disparidades existentes entre as diversas escalas de tempo. De modo a poder tirar proveito dos diferentes ritmos de evolução temporal existentes entre correntes e tensões com variação muito rápida (variáveis de estado activas) e correntes e tensões com variação lenta (variáveis de estado latentes), são utilizadas algumas técnicas numéricas avançadas para operar dentro dos espaços multi-dimensionais, como, por exemplo, os algoritmos multi-ritmo de Runge-Kutta, ou o método das linhas. São também apresentadas algumas estratégias de partição dos circuitos, as quais permitem dividir um circuito em sub-circuitos de uma forma completamente automática, em função dos ritmos de evolução das suas variáveis de estado. Para problemas acentuadamente não lineares, são propostos vários métodos inovadores de simulação a operar estritamente no domínio do tempo. Para problemas com não linearidades moderadas é proposto um novo método híbrido frequência-tempo, baseado numa combinação entre a integração passo a passo unidimensional e o método seguidor de envolvente com balanço harmónico. O desempenho dos métodos é testado na simulação de alguns exemplos ilustrativos, com resultados bastante promissores. Uma análise comparativa entre os métodos agora propostos e os métodos actualmente existentes para simulação RF, revela ganhos consideráveis em termos de rapidez de computação.

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Electromagnetic compatibility of power electronic systems becomes an engineering discipline and it should be considered at the beginning stage of a design. Thus, a power electronics design becomes more complex and challenging and it requires a good communication between EMI and Power electronics experts. Three major issues in designing a power electronic system are Losses, EMI and Harmonics. These issues affect system cost, size, efficiency and quality and it is a tradeoff between these factors when we design a power converter.

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The attenuation of long-wavelength phonons due to their interaction with electronic excitations in disordered systems is investigated here. Lattice strain couples to electronic stress, and thus ultrasonic attenuation measures electronic viscosity. The enhancement and critical divergence of electronic viscosity due to localization effects is calculated for the first time. Experimental consequences for the anomalous increase of ultrasonic attenuation in disordered metals close to the metal-insulator transition are discussed. In the localized regime, the appropriate model is one of electronic two-level systems (TLS’s) coupled to phonons. The TLS consists of a pair of states with one localized state occupied and the other unoccupied. The density of such low-excitation-energy TLS’s is nonzero due to long-range Coulomb interactions. The question of whether these could be significant low-energy excitations in glasses is touched upon.

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This paper presents simulated computational fluid dynamics (CFD) results for comparison against experimental data. The performance of four turbulence models has been assessed for electronic application areas considering both fluid flow and heat transfer phenomenon. CFD is vast becoming a powerful and almost essential tool for design, development and optimization in engineering problems. However turbulence models remain to be the key problem issue when tackling such flow phenomena. The reliability of CFD analysis depends heavily on the performance of the turbulence model employed together with the wall functions implemented. To be able to resolve the abrupt changes in the turbulent energy and other parameters near the wall a particularly fine mesh is necessary which unfortunately increases the computer storage capacity requirements. The objective of turbulence modelling is to enhance computational procdures of sufficient acccuracy and generality for engineers to anticipate the Reynolds stresses and the scalar transport terms.

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The electronics industry is developing rapidly together with the increasingly complex problem of microelectronic equipment cooling. It has now become necessary for thermal design engineers to consider the problem of equipment cooling at some level. The use of Computational Fluid Dynamics (CFD) for such investigations is fast becoming a powerful and almost essential tool for the design, development and optimisation of engineering applications. However turbulence models remain a key issue when tackling such flow phenomena. The reliability of CFD analysis depends heavily on the turbulence model employed together with the wall functions implemented. In order to resolve the abrupt fluctuations experienced by the turbulent energy and other parameters located at near wall regions and shear layers a particularly fine computational mesh is necessary which inevitably increases the computer storage and run-time requirements. This paper will discuss results from an investigation into the accuract of currently used turbulence models. Also a newly formulated transitional hybrid turbulence model will be introduced with comparisonsaagainst experimental data.

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A major percentage of the heat emitted from electronic packages can be extracted by air cooling whether by means of natural or forced convection. This flow of air throughout an electronic system and the heat extracted is highly dependable on the nature of turbulence present in the flow field. This paper will discuss results from an investigation into the accuracy of turbulence models to predict air cooling for electronic packages and systems.

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Embedded electronic systems in vehicles are of rapidly increasing commercial importance for the automotive industry. While current vehicular embedded systems are extremely limited and static, a more dynamic configurable system would greatly simplify the integration work and increase quality of vehicular systems. This brings in features like separation of concerns, customised software configuration for individual vehicles, seamless connectivity, and plug-and-play capability. Furthermore, such a system can also contribute to increased dependability and resource optimization due to its inherent ability to adjust itself dynamically to changes in software, hardware resources, and environment condition. This paper describes the architectural approach to achieving the goals of dynamically self-configuring automotive embedded electronic systems by the EU research project DySCAS. The architecture solution outlined in this paper captures the application and operational contexts, expected features, middleware services, functions and behaviours, as well as the basic mechanisms and technologies. The paper also covers the architecture conceptualization by presenting the rationale, concerning the architecture structuring, control principles, and deployment concept. In this paper, we also present the adopted architecture V&V strategy and discuss some open issues in regards to the industrial acceptance.

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Real-space grids are a powerful alternative for the simulation of electronic systems. One of the main advantages of the approach is the flexibility and simplicity of working directly in real space where the different fields are discretized on a grid, combined with competitive numerical performance and great potential for parallelization. These properties constitute a great advantage at the time of implementing and testing new physical models. Based on our experience with the Octopus code, in this article we discuss how the real-space approach has allowed for the recent development of new ideas for the simulation of electronic systems. Among these applications are approaches to calculate response properties, modeling of photoemission, optimal control of quantum systems, simulation of plasmonic systems, and the exact solution of the Schrödinger equation for low-dimensionality systems.

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The electronics industry is encountering thermal challenges and opportunities with lengthscales comparable to or much less than one micrometer. Examples include nanoscale phonon hotspots in transistors and the increasing temperature rise in onchip interconnects. Millimeter-scale hotspots on microprocessors, resulting from varying rates of power consumption, are being addressed using two-phase microchannel heat sinks. Nanoscale thermal data storage technology has received much attention recently. This paper provides an overview of these topics with a focus on related research at Stanford University.

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Presentation guide for Tom and Paul - apologies for quality/lack-of-rehersal. It was only intended as a mic-check, but I got carried away.

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Este proyecto colabora con la plataforma Integrated Language Learning Lab (ILLLab) aportando una serie de ejercicios de gramática inglesa para una nueva sección de la web basada íntegramente en la especialidad de Sistemas Electrónicos. Complementariamente se adentra en una nueva oportunidad basada en dispositivos móviles inteligentes creando una aplicación para el repaso de los conceptos estudiados en la titulación de Ingeniería Técnica de Telecomunicación en lengua inglesa.