Microscale thermal engineering of electronic systems
Data(s) |
28/10/2004
28/10/2004
01/05/2003
|
---|---|
Resumo |
The electronics industry is encountering thermal challenges and opportunities with lengthscales comparable to or much less than one micrometer. Examples include nanoscale phonon hotspots in transistors and the increasing temperature rise in onchip interconnects. Millimeter-scale hotspots on microprocessors, resulting from varying rates of power consumption, are being addressed using two-phase microchannel heat sinks. Nanoscale thermal data storage technology has received much attention recently. This paper provides an overview of these topics with a focus on related research at Stanford University. |
Formato |
1587318 bytes 323957 bytes application/pdf application/pdf |
Identificador | |
Idioma(s) |
en_US |
Tipo |
Presentation Technical Report |