Multi-wavelength holographic profilometry - art. no. 60272L

A novel method for surface profilometry by holography is presented. We used a diode laser emitting at many wavelengths simultaneously as the light source and a Bi12TiO20 (BTO) crystal as the holographic medium in single exposure processes. The employ of multi-wavelength, large free spectral range (FSR) lasers leads to holographic images covered of interference fringes corresponding to the contour lines of the studied surface. In order to obtain the relief of the studied surface, the fringe analysis was performed by the phase stepping technique (PST) and the phase unwrapping was carried out by the Cellular-automata method. We analysed the relief of a tilted flat metallic bar and a tooth prosthesis.

Photoelastic analysis of forces generated by T-loop springs made with stainless steel or titanium-molybdenum alloy

Introduction: The purpose of this study was to use photoelastic analysis to compare the system of forces generated by retraction T-loop springs made with stainless steel and titanium-molybdenum alloy (TMA) (Ormco, Glendora, Calif) with photoelastic analysis. Methods: Three photoelastic models were used to evaluate retraction T-loop springs with the same preactivations in 2 groups. In group 1, the loop was constructed with a stainless steel wire, and 2 helicoids were incorporated on top of the T-loop; in group 2, it was made with TMA and no helicoids. Results: Upon using the qualitative analysis of the fringe order in the photoelastic model, it was observed that the magnitude of force generated by the springs in group 1 was significantly higher than that in group 2. However, both had symmetry for the active and reactive units related to the system of force. Conclusions: Both springs had the same mechanical characteristics. TMA springs showed lower force levels. (Am J Orthod Dentofacial Orthop 2011;140:e123-e128)

Design, construction, and performance of a real-time holographic refractometry prototype for liquid analysis

Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)