Electrochemical studies of copper, copper-aluminium and copper-aluminium-silver alloys: Impedance results in 0.5M NaCl

The electrochemical behaviour of Cu, Cu-Al and Cu-Al-Ag alloys in aqueous solutions of NaCl (0.5 M, pH = 3.00) was studied by means of voltammetric methods and electrochemical impedance spectroscopy. The surfaces were examined by SEM and EDX analysis. Cu-Al-Ag alloy shows a potentiodynamic behaviour similar to that of the pure copper electrode while the Cu-Al alloy presents some minor differences. In the active dissolution region the electrodes suffer pitting corrosion and in the other potential regions there are the formation of a passivant film with composition depending on the potential. The impedance responses of the electrodes are discussed. An electrodissolution mechanism is proposed and the effect of the alloying elements upon the impedance response and polarisation curves is explained. The main effects are due to the production of copper and silver chlorides and aluminium oxides/ hydroxides at the corroding interface. The addition of Al or (Al + Ag) increases the corrosion resistance of pure copper. © 1995.

Potentiodynamic behaviour of CuA1Ag alloys in NaOH: a comparative study related to the pure metals electrochemistry

The mechanism of electrochemical oxidation of surface reformed CuA1Ag alloys having different composition of heat treatment, in 0.5 M NaOH was studied by means of cyclic polarization, constant potential electrolysis, ICP, AA, SEM and EDX. The surface reformation consisted of a repetitive triangular potential sweep (RTPS) between H 2 and O 2 evolution at 100 mV s -1 in the working solution itself, performed in order to increase the electrode roughness and obtain a quasi-stationary I/E profile in which the potentiodynamic behaviour of copper and silver was clearly revealed. The alloys suffer aluminum dealloying after such an RTPS. The quasi-stationary cyclic polarization curve exhibits a multiplicity of current peaks which have been related to the electrochemical reactions involving the pure alloying elements. Complex potential perturbation programmes in regions having different anodic and cathodic limits allowed the study of the mechanism of the electrochemical oxidation of the surface reformed alloys and the compare with that corresponding to the pure metals. The basic differences between the electro-oxidation processes of the surface reformed CuA1Ag alloys with respect to those established for the high purity alloying metals are the splitting of the peaks corresponding to the formation of the Cu(I) and Ag(I) species. © 1991.

Structural study of copper oxide supported on a ceria-modified titania catalyst system

A structural study of CuO supported on a CeO2-TiO2 system was undertaken using X-ray diffraction (XRD) and X-ray absorption spectroscopy (XAS) techniques. The results of XRD revealed the presence of only two phases, TiO2 anatase and CeO2 cerianite. A trend towards smaller TiO2 crystallites was observed when cerium content increased. When the amount of cerium increased, Ti K-edge XANES analysis showed an increasing distortion of Ti sites. The results of Ce LIII-edge EXAFS showed that Ce atoms are coordinated by eight oxygen atoms at 2.32 Å. For the sample containing a small amount of cerium, the EXAFS analysis indicated that the local structure around Ce atoms was highly distorted. The catalysts presented quite different Cu K-edge XANES spectra compared to the spectra of the CuO and Cu2O reference compounds. The Cu-O mean bond length was close to that of the CuO and the Cu atoms in the catalysts are surrounded by approximately four oxygen atoms in their first shell. Copper supported on the ceria-modified titania support catalysts displayed a better performance in the methanol dehydrogenation when compared to copper supported only on titania or on ceria. © 2002 Plenum Publishing Corporation.

Electrochemical behaviour of copper electrode in concentrated sulfuric acid solutions

The electrochemical behaviour of copper in 6.0 mol 1-1 sulfuric acid at 30°C, was studied by means of the potentiodynamic method. At low potential sweep rates, v < 200 m V s-1, the data reveal that the anodic process is basically constituted of copper dissolution and a film formation which inhibits further metal oxidation and which may undergo further dissolution. For higher potential sweep rates, a modification in the passivation region of the voltammogram is observed. It can be ascribed to a change in the passivation mechanism which possibly involves different surface species. The kineticrelationships derived from the potentiodynamic I/E curves obtained at low v suggest a film formation via a dissolution/precipitation mechanism. © 1993.

Structure of copper complexes adsorbed on a silica gel surface chemically modified with benzimidazole

Silica gel having a particle size between 0.2 and 0.05 mm and a specific surface area, S BET = 473 m 2 g -1, was chemically modified with benzimidazole. Adsorption isotherms of CuX 2 (X = Cl, Br or ClO 4) from ethanol and acetone solutions were studied at 298 K. The metal is bonded to the surface through the free nitrogen atom of the attached benzimidazole. The average number of ligands co-ordinated to the central metal ion was shown to depend on the solid surface loading by the solute. At low loading the electronic and ESR spectral parameters indicated that the copper ion is in a distorted-tetragonal symmetry field.

The homeostasis of iron, copper, and zinc in paracoccidioides brasiliensis, cryptococcus neoformans var. Grubii, and cryptococcus gattii: a comparative analysis

Iron, copper, and zinc are essential for all living organisms. Moreover, the homeostasis of these metals is vital to microorganisms during pathogenic interactions with a host. Most pathogens have developed specific mechanisms for the uptake of micronutrients from their hosts in order to counteract the low availability of essential ions in infected tissues. We report here an analysis of genes potentially involved in iron, copper, and zinc uptake and homeostasis in the fungal pathogens Paracoccidioides brasiliensis, Cryptococcus neoformans var. grubii, and Cryptococcus gattii. Although prior studies have identified certain aspects of metal regulation in Cryptococcus species, little is known regarding the regulation of these elements in P. brasiliensis. We also present amino acid sequences analyses of deduced proteins in order to examine possible conserved domains. The genomic data reveals, for the first time, genes associated to iron, copper, and zinc assimilation and homeostasis in P. brasiliensis. Furthermore, analyses of the three fungal species identified homologs to genes associated with high-affinity uptake systems, vacuolar and mitochondrial iron storage, copper uptake and reduction, and zinc assimilation. However, homologs to genes involved in siderophore production were only found in P. brasiliensis. Interestingly, in silico analysis of the genomes of P. brasiliensis Pb01, Pb03, and Pb18 revealed significant differences in the presence and/or number of genes involved in metal homeostasis, such as in genes related to iron reduction and oxidation. The broad analyses of the genomes of P. brasiliensis, C. neoformans var. grubii, and C. gattii for genes involved in metal homeostasis provide important groundwork for numerous interesting future areas of investigation that are required in order to validate and explore the function of the identified genes and gene pathways.

Vacuum infiltration of copper aluminate by liquid aluminium

This paper studies attained microstructures and reactive mechanisms involved in vacuum infiltration of copper aluminate preforms with liquid aluminium. At high temperatures, under vacuum, the inherent alumina film enveloping the metal is overcome, and aluminium is expected to reduce copper aluminate, rendering alumina and copper. Under this approach, copper aluminate toils as a controlled infiltration path for aluminium, resulting in reactive wetting and infiltration of the preforms. Ceramic preforms containing a mixture of Al2O3 and CuAl2O4 were infiltrated with aluminium under distinct vacuum levels and temperatures, and the resulting reaction and infiltration behaviour is discussed. Copper aluminates stability ranges depend on vacuum level and oxygen partial pressure, which determine both CuAl2O4 and CuAlO2 ability for liquid aluminium infiltration. At 1100 °C and 0.76 atm vacuum level CuAl2O4 is stable, indicating pO2 above 0.11 atm. Reactive infiltration is achieved via reaction between aluminium and CuAl2O4; however, fast formation of an alumina film blocking liquid aluminium wicking results in incipient infiltration. At 1000 °C and 3.8 × 10−7 atm vacuum level, CuAlO2 decomposes to Cu and Al2O3 indicating a pO2 below 6.0 × 10−7 atm; infiltration of the ceramic is hindered by the non-wetting behaviour of the resulting metal alloy. At 1000 °C and 1.9 × 10−6 atm vacuum level CuAlO2 is stable, indicating pO2 above 6.0 × 10−7 atm. Extensive infiltration is achieved via redox reaction between aluminium and CuAlO2, rendering a microstructure characterised by uniform distribution of alumina particles amid an aluminium matrix. This work evidences that liquid aluminium infiltration upon copper aluminate-rich preforms is a feasible route to produce Al–matrix alumina-reinforced composites. The associated reduction reaction renders alumina, as fine particulate composite reinforcements, and copper, which dissolves in liquid aluminium contributing as a matrix strengthener.