Electrochemical behaviour of copper electrode in concentrated sulfuric acid solutions
Contribuinte(s) |
Universidade Estadual Paulista (UNESP) |
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Data(s) |
27/05/2014
27/05/2014
01/05/1993
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Resumo |
The electrochemical behaviour of copper in 6.0 mol 1-1 sulfuric acid at 30°C, was studied by means of the potentiodynamic method. At low potential sweep rates, v < 200 m V s-1, the data reveal that the anodic process is basically constituted of copper dissolution and a film formation which inhibits further metal oxidation and which may undergo further dissolution. For higher potential sweep rates, a modification in the passivation region of the voltammogram is observed. It can be ascribed to a change in the passivation mechanism which possibly involves different surface species. The kineticrelationships derived from the potentiodynamic I/E curves obtained at low v suggest a film formation via a dissolution/precipitation mechanism. © 1993. |
Formato |
981-987 |
Identificador |
http://dx.doi.org/10.1016/0013-4686(93)87018-9 Electrochimica Acta, v. 38, n. 7, p. 981-987, 1993. 0013-4686 http://hdl.handle.net/11449/132356 10.1016/0013-4686(93)87018-9 WOS:A1993KW61800017 2-s2.0-0000706702 |
Idioma(s) |
eng |
Publicador |
Elsevier B.V. |
Relação |
Electrochimica Acta |
Direitos |
closedAccess |
Palavras-Chave | #Copper #Cyclic voltammetry #Dissolution/precipitation process #Potentiodynamic studies #Sulfuric acid |
Tipo |
info:eu-repo/semantics/article |