Microstrip antennas for mobile telephone handset with reduced radiation hazards

A novel antenna configuration comprised of two circular micro strip antennas (CMAs) resonating in the TMtt and TM2, modes, producing radiation characteristics suitable for a mobile telephone handset, is presented. The antennas operating at the same frequency are placed back to back with a separation comparable to the thickness of a typical handset. The radiation pattern consists of a region of reduced radiation intensity, which minimizes the radiation hazards to the user

Automated synthesis of delay-reduced Reed-Muller universal logic module networks

This paper presents a new approach to implement Reed-Muller Universal Logic Module (RM-ULM) networks with reduced delay and hardware for synthesizing logic functions given in Reed-Muller (RM) form. Replication of single control line RM-ULM is used as the only design unit for defining any logic function. An algorithm is proposed that does exhaustive branching to reduce the number of levels and modules required to implement any logic function in RM form. This approach attains a reduction in delay, and power over other implementations of functions having large number of variables.

Microstrip Antennas For Mobile Telephone Handset With Reduced Radiation Hazards

A novel antenna configuration comprised of two circular microstrip antennas (CMAs) resonating in the TMtt and TM2, modes, producing radiation characteristics suitable for a mobile telephone handset, is presented. The antennas operating at the same frequency are placed back to back with a separation comparable to the thickness of a typical handset. The radiation pattern consists of a region of reduced radiation intensity, which minimizes the radiation hazards to the user

Microwave exfoliated reduced graphene oxide epoxy nanocomposites for high performance applications

Graphene has captured the attention of scientific community due to recently emerging high performance applications. Hence, studying its reinforcing effects on epoxy resin is a significant step. In this study, microwave exfoliated reduced graphene oxide (MERGO) was prepared from natural graphite for subsequent fabrication of epoxy nanocomposites using triethylenetetramine (TETA) as a curing agent via insitu polymerization. Thermogravimetric analysis (TGA), X-ray diffraction (XRD), Raman spectroscopy, Fourier transform infrared spectroscopy (FTIR), C13 NMR spectroscopy, X-ray photoelectron spectroscopy (XPS) and ultravioletevisible (UVevis) spectroscopy were employed to confirm the simultaneous reduction and exfoliation of graphene oxide. The reinforcing effect of MERGO on epoxy resin was explored by investigating its static mechanical properties and dynamic mechanical analysis (DMA) at MERGO loadings of 0 to 0.5 phr. The micro-structure of epoxy/MERGO nanocomposites was investigated using scanning electron microscope (SEM), transmission electron microscope (TEM) and XRD techniques. The present work reports an enhancement of 32%, 103% and 85% in tensile, impact and flexural strength respectively of epoxy by the addition of even 0.25 phr MERGO. At this loading elastic and flexural moduli also increased by 10% and 65%, respectively. Single-edge-notch three-point-Bending (SEN-TPB) fracture toughness (KIC) measurements were carried out where a 63% increase was observed by the introduction of 0.25 phr MERGO. The interfacial interactions brought about by graphene also benefited the dynamic mechanical properties to a large extent in the form of a significant enhancement in storage modulus and slightly improved glass transition temperature. Considerable improvements were also detected in dielectric properties. The epoxy nanocomposite also attained an ac conductivity of 10 5 S/m and a remarkable increase in dielectric constant. The simple and cost effective way of graphene synthesis for the fabrication of epoxy/MERGO nanocomposites may be extended to the preparation of other MERGO based polymer nanocomposites. This remarkable class of materials has thrown open enormous opportunities for developing conductive adhesives and in microelectronics